hit counter script
LG U830 KU830 Service Manual
  1. Manuals
  2. Brands
  3. LG Manuals
  4. Cell Phone
  5. U830 KU830
  6. Service manual

LG U830 KU830 Service Manual

Hide thumbs
Table of Contents

Advertisement

Quick Links

Download this manual
Service Manual
U830_KU830
Date: November, 2006 / Issue 1.0

Advertisement

Table of Contents
loading

Related Manuals for LG U830 KU830

Summary of Contents for LG U830 KU830

  • Page 1 Service Manual U830_KU830 Date: November, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION ......5 4.11 SIM Detect Troubleshooting ....109 4.12 Key Sense Troubleshooting....110 1.1 Purpose........... 5 4.13 Camera Troubleshooting 1.2 Regulatory Information......5 (2M Camera)........111 4.14 Keypad Backlight Troubleshooting ..113 2. PERFORMANCE.......7 4.15 Folder ON/OFF Troubleshooting ..114 2.1 System Overview ........7 4.16 Main LCD Troubleshooting ....115 2.2 Usable environment .........8...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Folder Handset Size 98 X 49 X 14.8 mm Weight Under 110 g (with 800mAh Battery) Power 3.7 V normal, 800 mAh Li-Polymer Talk Time Over 110 min (WCDMA, Tx=12 dBm, Voice) (with 1000mAh) Over 110 min (GSM, Tx=Level 5, Voice) Standby Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 3.7 V(Typ), 3.47 V(Min), [Shut Down : 3.4 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ. Unit TA Power Available power * CLA : 12 ~ 24 V(DC)
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Maximum Output Power Class 3 : +24dBm(+1/-3dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 3.3 mA Under 333 mA Under 600mA WCDMA (DRX=2.56) (Tx=10dBm) (Tx=10dBm) Under 3.3 mA Under 300 mA Paging=5 period (PCL=7) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Of,Neighbor Cell offf) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change...

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -4 ± 3 dB Receiving Loudness Rating (RLR) -13 ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Idle Noise-Sending (INS) -64 dBm0p Under -47 dBPA...

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 600 mA • Normal Battery Capacity : 800 mAh • Charging Time : Max 3 hours (except for trickle charging time) •...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. RF TECHNICAL BRIEF 3.1 General Description The U830 supports UMTS-2100, DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900 GSM/GPRS/EDGE. All receivers and the UMTS transmitter use the radioOne Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The GSM900, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of U830 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS dual band operation). The UMTS receive signal is amplified by the RFR6250 LNA then passes through a bandpass filter before being applied to the RFR6250 Receiver IC.
  • Page 18 3. TECHNICAL BRIEF U830 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

  • Page 19: Gsm Mode

    3. TECHNICAL BRIEF 3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode U830’s receiver functions are split between the three RFICs as follows: • UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q). •...
  • Page 20 3. TECHNICAL BRIEF Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers - this is accomplished in the switch module. The GSM900, DCS, and PCS receive signals are routed to the RTR6250 through band selection filters and matching networks that transform single-ended 50Ω...
  • Page 21 3. TECHNICAL BRIEF 3.2.2. GSM Transmitter The shared GSM Low-band (GSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6275 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 22: Wcdma Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
  • Page 23 3. TECHNICAL BRIEF Figure 1-3 RFR6250 IC Fuctional block diagram The QUALCOMM RFR6250 IC is a custom GPS/UMTS-band design that meets DSWCDMA dynamic range requirements. The RFR6250 IC accepts its UMTS-1900, UMTS-2100 and GPS input signals from the handset RF front-end filters.

  • Page 24: Lo Phase-Locked Loop

    3. TECHNICAL BRIEF 3.3.2 WCDMA Transmitter The UMTS transmit path begins with analog baseband signals from the MSM device that drive the RTR6250 IC. The RTR6250 IC provides all the UMTS transmitter active signal-path circuits except the power amplifiers module. Analog (I and Q) differential signals from the MSM device are buffered, filtered, and applied to Baseband-to-RF quadrature upconverters.
  • Page 25 3. TECHNICAL BRIEF 3.4.1 UMTS Rx PLL (PLL2) UMTS Rx LO functional blocks are distributed between the RFR6250 IC, RTR6250 IC, and ixternal UMTS_RX_CH_VCO and loop filter components (Figure 3.4.1-1). The ixternal UMTS_RX_CH_VCO must be enabled for UMTS Rx operation and disable. Figure 3.4.1-1 UMTS Rx PLL functional block diagram The RFR6250 IC accommodates single-ended or differential LO inputs;...
  • Page 26 3. TECHNICAL BRIEF Many key PLL performance characteristics are largely determined by the loop filter design - stability, transitory response, settling time, and phase noise. 3.4.2 Transceiver PLL (PLL1) All LO functional blocks for the other handset modes(UMTS Tx, GSM900 Tx/Rx, DCS Tx/Rx, PCS Tx/Rx) are integrated into the RTR6250 IC except the loop filter components (Figure 3.4.2-1).

  • Page 27: Off-Chip Rf Components

    3. TECHNICAL BRIEF 3.5 Off-chip RF Components 3.5.1 Antenna switch module (U500 : DGM085M01) The antenna switch module allows multiple operating bands and modes to share the same antenna. In the U830 design, a common antenna connects to one of six paths: 1) GSM900 TX 2) GSM900RX 3) DCS1800/PCS1900TX 4) DCS1800 RX 5) PCS1900 Rx 6) UMTS Tx/Rx operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals.
  • Page 28 3. TECHNICAL BRIEF 3.5.3 UMTS Power Amplifier (U504) • U504 : WCDMA2100 Power Amplifier module The SKY77420 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset.
  • Page 29 3. TECHNICAL BRIEF 3.5.4 UMTS transmit power detector (U507 : ADL5500) This detector couples PA output power level to calibrate the transmitter characteristic over the channel variation and temperature. Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level.
  • Page 30 3. TECHNICAL BRIEF Figure 3.5.5-2 Power detector response, Vout vs PA output power 3.5.5 GSM/GPRS/EDGE Power amplifier (U502 : ADN0041) The AND0041 is a small (7x7mm), GSM/EDGE PAM for handset applications. This module has been optimized for excellent EDGE efficiency in an open loop polar modulation environment at EDGE class E2+ operation while maintaining high GSM/GPRS efficiency.
  • Page 31 3. TECHNICAL BRIEF 3.5.6 GSM transmit VCO (U503 : MQW6V0C869M) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to Murata MQW6V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .
  • Page 32 3. TECHNICAL BRIEF 3.5.8 VCTCXO (X500 : TG-5001LA-19.2MHz) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6275 IC. The 6275-series chipset requires a 19.2 MHz nominal VCTCXO frequency. The oscillator frequency is controlled by the MSM6275’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control.
  • Page 33 3. TECHNICAL BRIEF 3.5.9 Bluetooth(M700:RB04, ANT1 : ACS2450FBAU83) The MSM6275 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure3.5.12-1 shows the bluetooth system architecture in the U830. Figure3.5.7-1 Bluetooth system architecture - 34 -...

  • Page 34: Digital Baseband(Dbb/Msm6275)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6275) 3.6.1 General Description A. Features(MSM6275) • Support for multimode operation - WCDMA(UMTS),GSM/GPRS,EDGE • The ARM926EJ-S microprocessor can operate at up to 225 MHz with variable rate, software controlled clocks to provide greater standby time. •...

  • Page 35: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture (2.2 inch) Camera 2M GSM/ EDGE Camera VGA Q_VCO RTR6250 USIM PCS1900_Rx_SAW TX/RX DCS1800_Rx_SAW & WCDMA GSM900_Rx_SAW WCDMA 1900 Mono Speaker MSM6275 & Earpiece TX_SAW HDET 18PIN VCTCXO Stereo Headset MMI. Memory RFR6250 SDRAM RX_SAW WCDMA NAND Flash...
  • Page 36 3. TECHNICAL BRIEF 3.7.1. Block Diagram(MSM6275) SDRAM NAND Flash 512M (2.2 inch) EBI 1 EBI 2 Camera 0.3M GSM/GPRS/EDGE CAMERA DUAL MEMORY BUS processor PROCESSING (Default 8bit Interface) UMTS, WCDMA, MSM6275 Camera 2M processor GRAPHICS Modem QDSP 4000 BT 1.2 Open GL ES processor 3D, 2D...

  • Page 37: Subsystem(Msm6275)

    3. TECHNICAL BRIEF 3.8. Subsystem(MSM6275) 3.8.1. ARM Microprocessor Subsystem The MSM6275 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6202, RFL6202, and PM6650 devices.
  • Page 38 3. TECHNICAL BRIEF 3.8.5. Serial Bus Interface(SBI) The MSM6275 device’s SBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6250, RFR6202, RFL6202, and PM6650 ASICs. Using the SBI, the RTR6250, RFR6202, RFL6202, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode.
  • Page 39 3. TECHNICAL BRIEF 3.8.10. General-Purpose Input/Output Interface The MSM6275 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

  • Page 40: Power Block

    3. TECHNICAL BRIEF 3.9. Power Block 3.9.1. General MSM6275, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6275, MSM memory, RF block, Bluetooth, Camera, T-flash, USIM and TCXO. Major power components are: PM6650(U600) : Phone power supply BH30FB1WHFV(U402) : Touch Power BH28FB1WHFV(U302) : LCD Power BH28FB1WHFV(U304) : Camera Power...
  • Page 41 3. TECHNICAL BRIEF Figure. PM6650 Functional Block Diagram - 42 -...
  • Page 42 3. TECHNICAL BRIEF 3.9.3. Charging control A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not.
  • Page 43 3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V).
  • Page 44 3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

  • Page 45: External Memory Interface

    3. TECHNICAL BRIEF 3.10. External memory interface A. MSM6275 The MSM6275 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, NOR flash etc. •...

  • Page 46: H/W Sub System

    3. TECHNICAL BRIEF 3.11. H/W Sub System 3.11.1. RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6275 controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PA_ON : Power AMP on RF part • RX0_I/Q_M/P,TX_I/Q_M/P: I/Q for T/Rx of RF •...
  • Page 47 3. TECHNICAL BRIEF B. RFR6250(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX0_I/Q_M/P : I/Q for Rx of RF C. the others • UHF_VCO_BAND_SEL : WCDMA(3G) VCO Band Selection of UHF VCO • UHF_VCO_EN : WCDMA(3G) UHF VCO Enable •...
  • Page 48 3. TECHNICAL BRIEF 3.11.2. MSM Sub System 3.11.2.1. USIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx VREG_UIM 2.85V USIM CLK PM6650 USIM CLK...
  • Page 49 3. TECHNICAL BRIEF 3.11.2.2. USB The MSM6275 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6275 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0.
  • Page 50 3. TECHNICAL BRIEF 3.11.3. HKADC(House Keeping ADC) The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6275 device has six analog input pins which are multiplexed to the input of the internal HKADC. Figure.
  • Page 51 3. TECHNICAL BRIEF 3.11.4. Key Pad There are 24 buttons and 6 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW to PMIC(PM6650). COL0 COL1 COL2 COL3 COL4 COL5 COL6 ROW0 VT SEND MENU MUSIC SOFT1 Side key (CAMERA) Side key...
  • Page 52 3. TECHNICAL BRIEF CAMERA_SIDE_KEY KEY_ROW(0) KEY_COL(5) VOLUME_SIDE_KEY KEY_ROW(2) KEY_ROW(1) KEY_COL(5) Figure. Keypad Circuit (Side KEY) - 53 -...
  • Page 53 3. TECHNICAL BRIEF 3.11.5 Camera Interface U830 has two camera : 2M (UXGA) Pixel CMOS Camera and 0.3M(VGA) Camera. UXGA is a outer camera and VGA is a inner camera. Below figure show the camera board to board connector and camera I/F signal.
  • Page 54 3. TECHNICAL BRIEF The Camera module is connected to FPCB with 24pin Board to Board connector (UXGA : 14- 5602- 024-000-829, VGA : AXK720147G). Its interface is dedicated camera interface port in MSM6275. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 55 3. TECHNICAL BRIEF Name Port Note VGA_CAM_P_DOWN Power Down CAM_MCLK Master Clock(12M) CAM_PCLK Pixel clock CAM_DATA(0) Data CAM_DATA(1) Data CAM_DATA(2) Data CAM_DATA(3) Data CAM_DATA(4) Data CAM_DATA(5) Data CAM_DATA(6) Data CAM_DATA(7) Data CAM_VSYNC Vertical Sync CAM_HSYNC Horizontal Sync I2C_SDA I2C Data I2C_SCL I2C Clock VGA_CAM_RESET_N...
  • Page 56 3. TECHNICAL BRIEF 3.11.6 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U301 goes to 0V. Otherwise, 2.7V. This Folder signal is delivered to MSM6275 GPIO43.
  • Page 57 3. TECHNICAL BRIEF 3.11.7 Keypad Light There are EL Sheet operated by EL Driver circuit, which are driven by D381B EL-KEY DRIVER U400 D381B +VPWR R401 KEYPAD_EL_EN VOUT L400 C400 470uH 4.7u EUSY0250101 C401 C402 0.015u EL400 EL401 EL PAD Figure.
  • Page 58 3. TECHNICAL BRIEF 3.11.8. LCD Module (IL220DST1A : LG Innotek) - TThe IL220DST1A model is a Color TFT(Main) LCD supplied by LG Innotek. This main Module has a 2.2 inch diagonally measured active display area with 240(RGB)*320 resolution. Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.
  • Page 59 3. TECHNICAL BRIEF 3.11.9. Display & LCD FPC Interface - LCD module is connected to upper board with 40pin B-to-B Connector. (AXK8L40125, NAIS) The LCD module is controlled by 16-bit EBI2 in MSM6275 Table. Interface between LCD Module and Main Board - 60 -...
  • Page 60 3. TECHNICAL BRIEF 3.11.10. Audio and Sound 3.11.10.1. Overview of Audio & Sound path Head_Set Analog MSM6275 switch (U101-1) (U303) Receiver and Loud Speaker (U201) Head_set MIC Figure. Audio Path Block Diagram - 61 -...
  • Page 61 3. TECHNICAL BRIEF 3.11.10.2. Audio Signal Processing & Interface The MSM6275 device integrates a wideband audio CODEC into the mobile station modem. The wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition to the 8 kHz voice band applications on the forward link.
  • Page 62 3. TECHNICAL BRIEF MSM6275 BLK MIC_Feedback MICFBN MICINP C108 R100 0.1u C100 0.1u C101 MICOUTN C109 39p 180K 0.015u C102 R103 470K 0.015u C104 R108 0.1u C105 0.1u C106 MICOUTP 180K MICINN MICFBP Place close to MSM under same Shield Head Set Jack BLK CN700 MIC2N...
  • Page 63 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS C200 C201 SP0102BE3 U200 MIC1N C204 C202 C203 MIC1P Audio Amp for loud Speaker Audio AMP C208 U201 TPA2010D1YZF R206 R207 HPL_L +VPWR PVDD R208 SPK- SPK_AMP_EN _SHDN SPK+ C217 C218 C219 EUSY0278601 0.015u SELECT_SPK&RCV...
  • Page 64 3. TECHNICAL BRIEF 3.11.10.3. Audio Mode There are three audio modes (Voice call, speaker phone, MIDI/MP3). MODE Device Description Voice Call Receiver Mode Receiver Voice Call Loud Mode Speaker Phone Headset Headset Voice Call Speaker phone Loud Mode Speaker Phone MIDI Loud Mode Speaker MIDI Bell...
  • Page 65 3. TECHNICAL BRIEF Voice Call Receiver Mode Path Head_Set Analog MSM6275 switch (U101-1) (U303) Receiver and Loud Speaker (U201) Head_set MIC Voice Voice + MP3 + MIDI ❈ Voice Call Receiver Mode is routed as below ➞ ➞ MSM6275 EAR1ON,EAR1OP Analog Switch( U303) Receiver - 66 -...
  • Page 66 3. TECHNICAL BRIEF Voice Call Headset Mode Path & Head video Telephony Mode Head_Set Analog MSM6275 switch (U101-1) (U303) Receiver and Loud Speaker (U201) Head_set MIC Voice Voice + MP3 + MIDI ❈ Voice Call Headset Mode is routed as below ➞...
  • Page 67 3. TECHNICAL BRIEF Voice Call Speaker Phone Mode Receiver and Loud Speaker Head_Set Analog MSM6275 switch (U303) (U101-1) (U201) Head_set MIC Voice Voice + MP3 + MIDI ❈ Voice Call Speaker Phone Mode is routed as below ➞ ➞ MSM6275 HPH_L AMP(U201) Analog Switch(U303) ->...
  • Page 68 3. TECHNICAL BRIEF MIDI Ring Tone/MP3 (Speaker) Receiver and Loud Speaker Head_Set Analog MSM6275 switch (U101-1) (U303) (U201) Head_set MIC Voice Voice + MP3 + MIDI ❈ MIDI Ring Tone/MP3 Mode is routed as below ➞ ➞ MSM6275 HPH_L AMP(U201) Analog Switch(U303) ->...
  • Page 69 3. TECHNICAL BRIEF MIDI Ring Tone/MP3 (Headset) Head_Set Analog MSM6275 switch (U101-1) (U303) Receiver and Loud Speaker (U201) Head_set MIC Voice Voice + MP3 + MIDI ❈ MIDI Ring Tone/MP3 Headset Mode is routed as below ➞ ➞ MSM6275 HPH_L, HPH_R 18PIn MMI Headset Audio &...
  • Page 70 3. TECHNICAL BRIEF 2. U830 Main Component Camera(2M) Flash LED LCD Module Touch Pad Vibrator Camer a (VGA) Speaker Power Bluetooth Module - 71 -...
  • Page 71 3. TECHNICAL BRIEF 2. U830 Main Component EL Driver Logic Audio - 72 -...
  • Page 72 3. TECHNICAL BRIEF U506 FL502 U504 U501 U503 U500 U502 Reference Description Reference Description U504 WCDMA PAM U502 GSM PAM FL502 Duplexer U500 U506 RFR6250 U503 GSM VCO U501 RTR6250 - 73 -...
  • Page 73 3. TECHNICAL BRIEF Audio/logic BAT60 0 CN701 CN700 M700 U202 U101 U600 X500 Reference Description Reference Description X500 TCXO BAT600 RTC Battery USIM connector U101 MSM6275 U600 PMIC U202 Memory M700 BT module CN701 Battery connector CN700 18 pin MMI connector - 74 -...

  • Page 74: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component RF component (Top) Reference Description Reference Description ANT500, 501 ANT. Contact point U506 WCDMA Receiver IC M700 Bluetooth module X500 TCXO RF component (Bottom) Reference Description Reference Description U502 GSM/GPRS/EDGE PA U501 WCDMA Tranceiver IC U503...

  • Page 75: Signal Path

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH RF WCDMA SIGNA PATH (Top Side) WCDMA RX - 76 -...
  • Page 76 4. TROUBLE SHOOTING (Bottom Side) WCDMA TX GSM RX - 77 -...

  • Page 77: Checking Vtcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VC-TCXO Block The reference frequency (19.2MHz) from X500 (VC-TCXO) is used WCDMA TX part, GSM part and BB part. Check 1. Crystal part If you already check this crystal part, you can skip check 1. <...
  • Page 78 4. TROUBLE SHOOTING C556 1000p VREG_TCXO_2.85V C560 C561 1000p 0.1u 19.2MHz X500 R524 TRK_LO_ADJ VCONT TG-5001LA-19.2MHz C566 C567 0.01u 1000p C572 100p TCXO_PM TCXO_BT_IN R527 VREG_RFTX_2.85V PA_THERM 80.6K R529 RT500 C584 (1%) 0.068u 470K (1%) < Schematic of the The Crystal Part > - 79 -...
  • Page 79 4. TROUBLE SHOOTING Check TP2 VREG_TCXO_2.85V ≥ 2.8V Check PMIC Check TP1 TRK_LO_ADJ Check MSM Check TP3 Whit Oscilloscope TP1: TRK_LO_ADJ TP2: VREG_TCXO_2.85V TP3: VTCXO Output_19.2MHZ - 80 -...

  • Page 80: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block Schematic of the Antenna Switch Block ANT_SEL0 VREG_RFRX_0_2.85V GSM850_RX1 GSM850_RX2 C502 C503 CTRL1 GSM900_RX1 0.1u CTRL2 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GND1 GSM1900_RX1 GND2 GSM1900_RX2 GND3 WCDMA2100 ANT_SEL0 GND4 ANT_SEL1 DGM085M01 GND5 GND6 C506 C507 GND7...
  • Page 81 4. TROUBLE SHOOTING Logic Table of the Antenna Switch Mode ANT_SEL0 ANT_SEL1 GSM 900 TX High GSM 900 TX/WCDMA High DCS1800/PCS1900 TX High High DCS1800/PCS1900 TX < FEM Switch logic Table> Checking Switch Block power source Check Soldering of ANT_SEL0, 1 High Level Check VCC 2.5V <...

  • Page 82: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5 Checking WCDMA Block 4.5.1 Checking TX POWER of WCDMA 2100MHz Antenna SW500 R500 C500 R501 3.3nH KMS-512 L502 0.75p RF Mobile 15nH L503 C501 Switch WCDMA PAM +VPWR U504 SMPY0012701 FL501 EFCH1950TDC1 PGND VREF RF_IN 0.5p RF_OUT C558 VENABLE...
  • Page 83 4. TROUBLE SHOOTING <Top Side> TP1: RF Mobile Connector Output TP2: Duplexer Output TP3: WCDMA PAM Output TP4: WCDMA PAM Input For testing, Max power of WCDMA2100MHz is needed Program: QCT FTM RF Mode: WCDMA Uplink Chan: 9750 Tx On Tx AGC: 470~500 PA Range: ON R1 - 84 -...
  • Page 84 4. TROUBLE SHOOTING Set the Phone Tx is ON and PDM is 500 Check TP1 RF Tx Level is OK Over 22dBm ? Check TP2 Check FEM Over 23dBm ? Check TP3 Check Duplexer Over 25dBm ? Check TP4 Check PAM Block Refer to 3.5.4 Over -5dBm ? Change the board...
  • Page 85 4. TROUBLE SHOOTING 4.5.2 Checking WCDMA PAM Control Block • PAM control signal 1. PA_ON : WCDMA PAM Block Enable 2. HDET_EN : WCDMA Tx Power Detect IC(U1006:HDET) Enable 3. PAM_EN : WCDMA PAM Enable PA_ON PAM_EN HDET_EN → PA_ON must be HIGH(over 2.7V) →...
  • Page 86 4. TROUBLE SHOOTING 4.5.3 Check WCDMA RF Rx Level Antenna SW500 R500 C500 FEM Module R501 3.3nH KMS-512 L502 0.75p 15nH L503 C501 RF Mobile Switch ADL5500 U507 PLNA_OUT VOPS VRMS HDET1 ILNA_OUT ILNA_OUT PLNA_BIAS RFIN COMM C585 PLNA_IN 0.01u ILNA_BIAS HDET ILNA_IN...
  • Page 87 4. TROUBLE SHOOTING Test Point (RF Rx Level) < Bottom Side> < Top Side> TP1: RF Mobile Connector Output TP2: FEM Output TP3: Duplxer Output TP4: WCDMA LNA Output - 88 -...
  • Page 88 4. TROUBLE SHOOTING Set the Phone Rx is ON Check bias1 Check bias block Over 2V ? soldering Check TP1 Check RF s/w Signal exist? Check TP2 Check FEM Signal exist? Check TP3 Check Duplexer Signal exist? Check TP4 Check RFR6250 Signal exist? Program : QCT FTM RF Change the board...

  • Page 89: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6 Checking GSM Block START 1. Check TXVCO Block 2. Check ANT. SW Module 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re-download SW & CAL. - 90 -...
  • Page 90 4. TROUBLE SHOOTING 4.6.1 Checking VCO Block TP3. TP2. TP1. TP4. TP5. Test Point (TXVCO Level) Schematic of RF TXVCO 925-960 MHz R507 R508 C525 (1%) 1000p C527 C528 R511 120p 330p C531 (PPS) 5.6n MQW5V0C869M U503 FB500 R512 VREG_RFTX_2.85V R513 R514 GSM_TX_VCO_0_EN_N...
  • Page 91 4. TROUBLE SHOOTING Check PMIC (U600) Check Soldering of VCO(U503) VCO(U503) is OK Check other parts - 92 -...
  • Page 92 4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 4.4 4.6.3 Checking RF Tx level TP3. Test Point (RF Tx Level) BOT & TOP L500 SW500 C500 KMS-512 L502 U500 GSM850_RX1 GSM850_RX2 C502 C503 CTRL1 GSM900_RX1 0.1u CTRL2 GSM900_RX2 GSM1800_RX1 GSM1800_RX2...
  • Page 93 4. TROUBLE SHOOTING Module (U500) Check PAM Block (U502) Check TXVCO (U503) PAM (U502) Block. - 94 -...
  • Page 94 4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.25V < Vapc < 1.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP3.
  • Page 95 4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block EGSM RX PCS RX DCS RX Test Point (RF Rx Block) U500 PCS RX. L504 GSM850_RX1 GSM850_RX2 2.7nH CTRL1 GSM900_RX1 CTRL2 GSM900_RX2 L505 GSM1800_RX1 12nH GSM1800_RX2 GND1 GSM1900_RX1 GND2 GSM1900_RX2 1930-1990 MHz C505 GND3 WCDMA2100...
  • Page 96 4. TROUBLE SHOOTING - 97 -...

  • Page 97: Bluetooth Rf Block

    4. TROUBLE SHOOTING 4.7 Bluetooth RF Block BLUETOOTH ANT700 FEED C724 L700 L701 M700 RB04 CLK_REF SBST BT_SBST C712 1000p BT_CLK SBCK BT_SBCK VDD_MSM SBDT BT_SBDT SYNC_DET_TX_EN BT_TX_RX_N VREG_BT_2.85V VDD_A RX_BB_TX_BB BT_DATA C713 1000p LDO1 XTAL_IN TCXO_BT LDO2 TP1: BT power supply TP2: 19.2MHz reference clock - 98 -...
  • Page 98 4. TROUBLE SHOOTING Vibrator trouble shooting Start Set the battery to the U830 isassemble the upper and check short at MOTOR- Motor vibrates ? with upper case Is upper case getting ? check short at MOT_PWR Replace the Motor Motor operates properly? +VPWR : MOT_PWR MOTOR: MOTOR- - 99 -...

  • Page 99: Power On Troubleshooting

    4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.8 Power ON Troubleshooting Power On sequence of U830 is : PWR key press(Key PCB) → PM_ON_SW_N go to low(VA400),PM6650 KPDPWR_N pin(24) → PM6650 Power Up → VREG_MSMC_1.375V(C627), VREG_MSME_1.8V(C628), VREG_MSMP_2.7V(C618), VREG_MSMA_2.6V(C616), VREG_TCXO_2.85V(C603) power up and system reset assert to MSM →...
  • Page 100 4. TROUBLE SHOOTING VREG MSMP VREG MSMA 2.6V 32.768 KHz 2.7V VREG MSME 1.8V PS HOLD VREG MSMC 1.375V VREG TCXO 2.85V - 101 -...
  • Page 101 4. TROUBLE SHOOTING PM_ON_SW_ N 19.2 MHz VA400 - 102 -...
  • Page 102 4. TROUBLE SHOOTING More tips for not powering-on cases ! Main board failure: 1. Check short of +VPWR(4.2V) and GND ! → Change a board 2. Check short of L601/L602 and GND → If YES, PM6650 internal FET short ! → Change PM6650 or a board.

  • Page 103: Charger Troubleshooting

    4. TROUBLE SHOOTING 4.9 Charger Troubleshooting Charging Current Flow +5V_PWR (4.6V) Pass (ON) CHG_CNT_N ICHARGE ICHARGEOUT +VPWR FDJ129P Q603 4.2~4.25V Main VBATT Battery Battery FET (ON) BATT_FET_N Charging Procedure - Connect TA - Control the charging current by PM6650 IC - Charging current flows into the battery Troubleshooting Setup - Connect TA and battery to the phone...
  • Page 104 4. TROUBLE SHOOTING Charging function components R610 Q602 Q603 - 105 -...
  • Page 105 4. TROUBLE SHOOTING Troubleshooting Flow Start Check the pin and battery Connect terminals of I/O connector Change I/O connector Connection OK? Is the TA voltage Change TA 4.6V? Is it charging properly After turning on Q602, Q603? Change the board - 106 -...

  • Page 106: Usb Troubleshooting

    4. TROUBLE SHOOTING 4.10 USB Troubleshooting USB Initial sequence of U830 is : USB connected to U830 → USB VBUS SWITCH -> USB_VBUS go to 5V → USB_D+ go to 3.3V → 48M Crystal on → USB_VP and USB_VN is triggered → USB work. Start Insert cable Cable is inserted?
  • Page 107 4. TROUBLE SHOOTING USB_VBUS : U600 16pin USB_D+ : U600 18pin Q601 Q600 VA703 R606, C619 VA700 X100: 48M clock - 108 -...

  • Page 108: Sim Detect Troubleshooting

    4. TROUBLE SHOOTING 4.11 SIM Detect Troubleshooting USIM Initial sequence of U830 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 3.0V → USIM IF work Start Re-insert the SIM card Work well? Check the Sub PCB and VREG_UIM_2.85V is 3.0V? USIM_P_CLK is run? Main Connector Check J1...

  • Page 109: Key Sense Troubleshooting

    4. TROUBLE SHOOTING 4.12 Key Sense Troubleshooting Key Sense sequence of U830 is : Default condition ROW(1-4) is 2.6V → Press the key → Corresponding row(x) go to 0V → Key sensing Start Check the side key FPCB and Connector Work well? Change the EL Sheet or Check the Key PCB...

  • Page 110: Camera Troubleshooting (2M Camera)

    4. TROUBLE SHOOTING 4.13 Camera Troubleshooting (2M Camera) 2M Camera control signals are generated by MSM6275. Start Check the camera connector and reconnect the camera Camera is OK? Check Camera Power (CN300) Change the Main board pin12->1.8V pin10->2.8V Pin9->2.8V Check the CAM_MCLK Change the Main board (CN300 27pin) Change the camera...
  • Page 111 4. TROUBLE SHOOTING (VGA Camera) VGA Camera control signals are generated by MSM6275. Start Check the camera connector and reconnect the camera Camera is OK? Check Camera Power (CN300) Change the Main board pin9->2.8V pin11->2.8V Check the CAM_MCLK Change the Main board (CN300 27pin) Change the camera Camera is OK...

  • Page 112: Keypad Backlight Troubleshooting

    4. TROUBLE SHOOTING 4.14 Keypad Backlight Troubleshooting Key Pad Back Light is on as below : Key pressing → EL Driver ON → EL Sheet ON Start Check the side key FPCB and Connector Work well? Check EL-Key Driver Change the Main PCB -VPWR : C400 KEYPAD_EL_EN : R401 Check EL Output( EL400, EL401)

  • Page 113: Folder On/Off Troubleshooting

    4. TROUBLE SHOOTING 4.15 Folder ON/OFF Troubleshooting Folder On/Off is worked as below : Folder On/Off Event → Flip(U301 pin 1) is triggered(On : about 2.1V, Off : 0V) → MSM6275 Sense the Folder Event Start Check the magnet in Insert the magnet Slide Assy Approach the magnet to...

  • Page 114: Main Lcd Troubleshooting

    4. TROUBLE SHOOTING 4.16 Main LCD Troubleshooting Main LCD control signals are generated by MSM6275. The signal path is : MSM6275 → CON302 → LCD MODULE START Press END Key to turn the Power on Follow the Power ON Is the circuit powered ? Trouble shooting Disconnect and reconnect The LCD Module connector...
  • Page 115 4. TROUBLE SHOOTING Previous Page Previous Page LCD Display OK? The LCD works Change Main board - 116 -...
  • Page 116 4. TROUBLE SHOOTING LCD Control data flow CN300 CN302 Main board Top Main board Bottom U302 LCD connector + CN302 - 117 -...

  • Page 117: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.17 Audio Trouble Shooting Audio & sound signal paths are like below. Receiver and Loud Speaker Head_Set Analog MSM6275 switch (U101-1) (U303) (U201) Head_set MIC Voice Voice + MP3 + MIDI - 118 -...

  • Page 118: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.18 Audio Trouble Shooting 4.18.1 Receiver Path Voice Receiver path as below: MSM6275 Ear1ON/Ear1OP → FB100,FB101 → R414,R415 → U303(Speaker/receiver switch) → CN300(b’d to b’d connector for FPCB) → b’d to b’d connector of FPCB → Speaker Start Connect the phone to network Equipment and setup call...
  • Page 119 4. TROUBLE SHOOTING CN300 (FPCB connector) FPCB for LCD Module Speaker soldering point Receiver and Loud Speaker FB100,FB101 U201(Audio Amplifier) R414,R415 (receiver signal serial resistor) U303(Speaker/receiver switch) - 120 -...
  • Page 120 4. TROUBLE SHOOTING 4.18.2 Voice and Sound Path for Head_set Voice and Multimedia Sound path for Head_Set as below: MSM6275 HPH_R, HPH_L → C700 , C701 → R702,R703 → CN700 headset Jack (pin 4,5) Start Connect the phone to network equipment and setup call.
  • Page 121 4. TROUBLE SHOOTING C700 R702 C701 R703 - 122 -...
  • Page 122 4. TROUBLE SHOOTING 4.18.3 Loud Speaker path(voice speaker phone, VT, multimedia play, etc) Loud speaker path as below: MSM6275 HPH_L -> R206, C208, R207 -> U201(Amplifier) -> U303(Receiver/Speaker switch) -> CN300 -> FPCB -> Speaker * U830 use Class-D Amplifier. So, The Output Signal of Amplifier was seen Start Rectangular Pulse wave not sine wave.
  • Page 123 4. TROUBLE SHOOTING CN300 pin1, pin2 R206 R207 R208 U201(Audio Amplifier) U303(Speaker/receiver switch) - 124 -...
  • Page 124 4. TROUBLE SHOOTING 4.18.4 Microphone for Main MIC Main Microphone path as below: MIC -> C203 -> MSM6275 -> MIC feed back gain logic -> MSM internal CODEC MICBIAS C200 C201 SP0102BE3 U200 MIC1N C204 C202 C203 MIC1P SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105...
  • Page 125 4. TROUBLE SHOOTING MICBIAS C200 C201 SP0102BE3 U200 MIC1N C204 C202 C203 MIC1P - 126 -...
  • Page 126 4. TROUBLE SHOOTING 4.18.5 Microphone for Head_Set MIC for Head_Set path as below: Insert Headset -> EAR_SENSE_N(pin8) go 0V -> MSM6275 sense Head_Set insertion -> MIC signal go to MSM( to C415) CN700 MIC2N C108 MIC2P R702 C109 39p HPL_L R703 C700 HPL_R...
  • Page 127 4. TROUBLE SHOOTING C415 ( You can check Headset Mic signal at C415 ) - 128 -...

  • Page 128: Vibrator Trouble

    4. TROUBLE SHOOTING 4.19 Vibrator trouble Vibrator control signal (MOTOR_PWR-) is generated by PM6650. That signal°Øs path is : Pin 25 of PM6650 → CN801 PIN 36 of Main PCB → CN101 PIN 36 of LCD Sub PCB → TP103 of LCD Sub PCB Start The vibrator Donít working?

  • Page 129: Download

    LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 8 handsets at the same time.
  • Page 130 5. DOWNLOAD 5.2.1 Connecting to PC Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.) - 131 -...
  • Page 131 5. DOWNLOAD The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. - 132 -...
  • Page 132 5. DOWNLOAD 1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse... button. The edit box shows the file path where images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse...
  • Page 133 5. DOWNLOAD 5.2.2 Choosing image files Select the image folder, where all the image files are located, by clicking on the Browse..(The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) - 134 -...
  • Page 134 5. DOWNLOAD Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select imag by manually. For instance, select the path of AMSS Modem Image file by clicking on the Browse... button. The selected AMSS image will be downloaded to the handset from the path directory in the PC.
  • Page 135 5. DOWNLOAD If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse... button. - 136 -...
  • Page 136 5. DOWNLOAD Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is not the setting you are downloading for. Otherwise click on the Yes button to continue downloading selected image file with options.
  • Page 137 5. DOWNLOAD 5.2.3 Downloading • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
  • Page 138 5. DOWNLOAD • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection. • Rebooting the handset and re-establishing the connection •...
  • Page 139 5. DOWNLOAD • Downloading Media image in progress • Downloading Module image in progress • Downloading process has completed successfully - 140 -...
  • Page 140 5. DOWNLOAD 5.2.4 Tools Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu. - 141 -...

  • Page 141: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting Download Errors 5.3.1 When the phone does not work after downloading has been completed. • Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. In the emergency mode, you can not download media or module image.
  • Page 142 5. DOWNLOAD • Choose Image file after clicking on the Browse... button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode.
  • Page 143 5. DOWNLOAD 5.3.2 NV Restore Error • Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt. U830 - 144 -...
  • Page 144 5. DOWNLOAD • Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.) U830 - 145 -...
  • Page 145 5. DOWNLOAD • Click on Browse..Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start.

  • Page 146: Caution

    5. DOWNLOAD 5.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) The NV data saved at LGMDP folder as following format. D:\LGMDP\004400-01-429926\_COM14_ LGMDP folder name Port number...

  • Page 147: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block FEM -> ASM + BPF Fig 2.1-1.UMTS2100+EGSM/DCS-1800/PCS-1900 RF Functional - 148 -...
  • Page 148 6. BLOCK DIAGRAM Table 2.1-1. RF Block Component - 149 -...

  • Page 149: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram VCO_EN / VCO_Band PA_ramp PA_EN, / PA_Band Ant_Sel 0,1,2 TRK_LO_ADJ PA_ON T X _ A G C _ A D J HDET U830 Interface Diagram - 150 -...
  • Page 150 6. BLOCK DIAGRAM Main RF signal EGSM TX : GSM Tx RF signal EGSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS 2100 TX : UMTS 2100 Tx RF signal UMTS 2100 RX : UMTS 2100 Rx RF signal...
  • Page 151 6. BLOCK DIAGRAM *Top Side *Bottom Side - 152 -...

  • Page 152: Circuit Diagram

    7. CIRCUIT DIAGRAM MICFBN WDOG_EN (1:Enable , 0:Disable) MODE MICINP Default Pull-up R100 HKADC(4):PCB_Rev_ADC USB 48M CLK 0.1u C100 0.1u C101 MICOUTN MODE2 MODE1 MODE0 ( Default Pull-Down) 180K 150K : 10K : 0.016V VREG_MSMP_2.7V VREG_MSMP_2.7V VREG_MSMP_2.7V Native, ARM JTAG HKADC[0] - AMUX_OUT 0.015u C102...
  • Page 153 7. CIRCUIT DIAGRAM MEMORY MICBIAS C200 C201 SDRAM_DATA(0:31) SDRAM_ADDR(0:12) SP0102BE3 SDRAM_DATA(0) SDRAM_ADDR(0) SDRAM_DATA(1) SDRAM_ADDR(1) U200 MIC1N SDRAM_DATA(2) SDRAM_ADDR(2) C204 SDRAM_DATA(3) SDRAM_ADDR(3) C202 C203 SDRAM_DATA(4) SDRAM_ADDR(4) MIC1P SDRAM_DATA(5) SDRAM_ADDR(5) SDRAM_DATA(6) SDRAM_ADDR(6) SDRAM_DATA(7) SDRAM_ADDR(7) SDRAM_DATA(8) SDRAM_ADDR(8) SDRAM_DATA(9) SDRAM_ADDR(9) SDRAM_DATA(10) SDRAM_ADDR(10) DQ10 SDRAM_DATA(11) SDRAM_ADDR(11) DQ11 SDRAM_DATA(12)
  • Page 154 7. CIRCUIT DIAGRAM SUB PMIC FPCB B TO B CONNECTOR U404 MAX8645Y CN300 +VPWR FL11 ICVE10184E070R100FR C300 SPK_RCV+ TOUCHKEY_CLK INOUT_A1 INOUT_B1 CAM_DATA(0) SPK_RCV- VGA_CAM_P_DOWN CAM_DATA(1) C411 INOUT_A2 INOUT_B2 4.7u MEGA_CAM_P_DOWN CAM_DATA(2) INOUT_A3 INOUT_B3 C301 VGA_CAM_RESET_N INOUT_A4 INOUT_B4 CAM_DATA(3) PGND MEGA_CAM_RESET_N BGND MOTOR- FLASH_LED_ANODE...
  • Page 155 7. CIRCUIT DIAGRAM EL-KEY DRIVER ON_SW KEY SIDE VREG_MSMP_2.7V U400 D381B RA400 +VPWR R400 END_KEY R401 KEYPAD_EL_EN VOUT L400 C400 470uH HOT400 HOT401 HOT402 MENU 4.7u EUSY0250101 MENU KEY_ROW(0) C401 C402 0.015u LEFT EL400 EL401 LEFT KEY_ROW(1) EL PAD RIGHT RIGHT KEY_ROW(2) SEARCH...
  • Page 156 7. CIRCUIT DIAGRAM 3.9nH ANT501 L500 GSM_PA_BAND MODE ANT_SEL0 ANT_SEL1 TX_VCO_EN_0_N TX_VCO_EN_1_N R500 SW500 GSM900 HIGH R501 C500 GSM 1800/GSM 1900 RX DCS/PCS HIGH 3.3nH GSM 850/ GSM 900 RX HIGH DCS1800/PCS1900 HIGH KMS-512 L502 0.75p GSM 850/GSM 900 TX/ WCDMA HIGH HIGH HIGH...
  • Page 157 7. Circuit Diagram PREVENT USB BOOT Q600 USB_VBUS_IN USB_VBUS +VPWR SI1305-E3 Q601 DTC144EM-T2L USB_PWR_EN C612 BAT600 0.1u ADC_BYP REF_BYP +5V_PWR VCHG REF_GND C613 R602 121K NBL414R-F9J ICHARGE ISNS_P REF_ISET R603 470K CHG_CNT_N CHG_CTL_N VCOIN C615 ICHARGEOUT ISNS_M MSM_INT_N PM_INT_N 0.1u VBATT VBAT TCXO_IN...
  • Page 158 7. Circuit Diagram MMI CONNECTOR VREG_MSMP_2.7V +VPWR U702 CN700 MIC2N REMOTE_ADC U700 MIC2P DG2011DX-T1-E3 R702 HPL_L R703 USB_D+ C700 HPL_R C701 USB_D- EAR_SENSE_N VBATT R704 U701 C702 FSA2257L10X REMOTE_PWR_ON 470K +5V_PWR VBAT_SENSE USB_PWR_EN USB_VBUS_IN NFM21PC105B1A3 UART_TX REMOTE_INTERRUPT DG2011DX-T1-E3 CN701 VBAT B TO B (MAIN) VBAT_TEMP R706...
  • Page 159 7. CIRCUIT DIAGRAM CAMERA_SIDE_KEY MEGA CAM CONNECTOR VGA CAM CONNECTOR VREG_CAM_DVDD_2.8V KEY_ROW(0) CN802 CN801 KEY_COL(5) VGA_CAM_P_DOWN VREG_VCAM_AVDD_2.8V CAM_MCLK CAM_DATA(7) I2C_SCL VREG_CAM_DVDD_2.8V CAM_DATA(6) I2C_SDA VGA_CAM_RESET_N CAM_DATA(5) CAM_PCLK I2C_SCL CAM_DATA(4) CAM_VSYNC CAM_DATA(0) I2C_SDA CAM_DATA(3) CAM_HSYNC CAM_DATA(1) CAM_DATA(2) CAM_MCLK CAM_DATA(2) CAM_HSYNC CAM_DATA(1) CAM_DATA(3) CAM_VSYNC CAM_DATA(0) VREG_MCAM_AVDD_2.8V...

  • Page 160: Pcb Layout

    8. PCB LAYOUT - 161 -...
  • Page 161 8. PCB LAYOUT - 162 -...
  • Page 162 8. PCB LAYOUT - 163 -...
  • Page 163 8. PCB LAYOUT - 164 -...
  • Page 164 8. PCB LAYOUT - 165 -...
  • Page 165 8. PCB LAYOUT - 166 -...

  • Page 166: Calibration Program

    9. Calibration Program 9. Calibration Program 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory Cal_Model U310 At_Serial_Cmd.xml HOT KIMCHI PROJECT dacTable.cfg HOT_KIMCHI CmMqDll.dll Diag_NV6275_RevB.dll ComLMPLib_06.dll DLL_E5515CD.DLL Hot_KimchiD.exe DLL_PwrControlD.dll ShieldBox_DllD.dll Dll_SerialATD.dll Info_Db.txt Ezlooks.xml FTMLib.dll LG_RfCal_QuU830Ag_099.dll ModelInfo.txt PwrSupply_Cmd.xml QLib.dll Setup_Cal_Test.xml : Directory : File - 167 -...
  • Page 167 9. Calibration Program 9.1.2 Setup file (Info_Db.txt) /*cal*/[Default]=[U830] /*cal*/[U830]=[..\\Cal_Model\\U830\\LG_RfCal_QuU830Ag_099.dll] [ezlooks]=[off] [batcal]=[off] [svc]=[off] ‘on’ or ‘off’. (use only lower case) [standalone]=[off] [tescom]=[off] ‘auto’ or ‘cal’. (use only lower case) [process]=[cal] [U830]=[..\\Auto_Model\\U830\\Procedure_U830_102.xml, 1: Indication of ‘cal process’ 2: Model name which is displayed on Hot Kimchi program 3: Relative path of Main Sequence dll file from Hot_KimchiD.exe 4: You can change this as ‘on’...
  • Page 168 9. Calibration Program 9.1.3 Items of setup file [ezlooks] => The yes or no for using ezlooks Domestic: on, Overseas: off [batcal] => The yes or no for using battery calibration [svc] => The yes or no for using HOT KIMCHI at service center Domestic: off, Service Center: on [standalone] =>...
  • Page 169 9. Calibration Program 9.1.4 Example for setup file CAL Process Ex1) Service center [ezlooks]=[off] [batcal]=[off] [svc]=[on] [standalone]=[off] [tescom]=[off] [process]=[cal] Ex2) Overseas factory or Repair [ezlooks]=[off] [batcal]=[on] [svc]=[off] [standalone]=[on] [tescom]=[off] [process]=[cal] Ex3) Domestic factory [ezlooks]=[on] [batcal]=[on] [svc]=[off] [standalone]=[off] [tescom]=[off] [process]=[cal] In case of using Tescom S/B, set [tescom]=[on]. - 170 -...

  • Page 170: How To Use Hot Kimchi

    9. Calibration Program 9.2 How to use HOT KIMCHI U830 U830 * Flow 1. Select the model name which you want 2. Click APPLY button to load the ‘cal’ lib file 3. Click START button to run the procedure which you want - 171 -...

  • Page 171: Example For Using Hot Kimchi

    9. Calibration Program 9.3 Example for using HOT KIMCHI Choose Exe_QU830Ver0.99A Click APPLY button Click START button - U830_Ver0.99A Calibration - - 172 -...
  • Page 172 9. Calibration Program 9.3.1 Example for Calibration U830 Click START - 173 -...
  • Page 173 - 174 -...

  • Page 174: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 16 17 19 20 21 22 23 48 49 55 56 - 175 -...
  • Page 175 - 176 -...

  • Page 176: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT,FOLDER TIFF0014602 Black AAAY00 ADDITION AAAY0175103 Black...
  • Page 177 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MPBZ02 MPBZ0174201 CUTTING, NS, , , , , MTAA00 TAPE,DECO MTAA0103801 CUTTING, STS, , , , , ACGK00 COVER ASSY,FRONT ACGK0066101 Black MCJK00 COVER,FRONT MCJK0053201 MOLD, PC LUPOY SC-1004A, , , , , Black MPBH00...
  • Page 178 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MTAZ07 TAPE MTAZ0166101 COMPLEX, (empty), , , , , MTAZ08 TAPE MTAZ0166201 COMPLEX, (empty), , , , , ADCA00 DOME ASSY,METAL ADCA0046501 Black AFBA00 FRAME ASSY,SHIELD AFBA0004901 MCBA00 CAN,SHIELD...

  • Page 179: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0049603 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0044201...
  • Page 180 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark PCB ASSY,SUB,SMT SAJC00 SAJC0010801 BOTTOM 2.0 ,-2.0 dBd,; ,bluetooth chip, PIFA type ,; ,SINGLE ,-2.0 ANT700 ANTENNA,GSM,FIXED SNGF0019301 ,50 ,2.0 2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, BAT600 BATTERY,CELL,LITHIUM SBCL0001701...
  • Page 181 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C542 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C544 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C545 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C546 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C547 CAP,CHIP,MAKER ECZH0000813...
  • Page 182 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark CN700 CONNECTOR,I/O ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type CN701 CONNECTOR,ETC ENZY0018101 3 PIN,3.0 mm,ETC , ,Global SON80 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , D702 DIODE,SWITCHING EDSY0011901...
  • Page 183 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R501 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP R504 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP R505 RES,CHIP ERHY0000253 4.3K ohm,1/16W,J,1005,R/TP R506 RES,CHIP ERHY0000186 2.2 Kohm,1/16W ,F ,1005 ,R/TP R507...
  • Page 184 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz, U503 EXSC0009201 1710MHz ~ 1910MHz, 14pin U504 SMPY0012701 28 dBm, %, A, dBc, dB,4*4*1.2 ,SMD , COUPLER,RF -20 dB,-0.25 dB,-35 dB,1.0*0.58*0.35 ,SMD ,1850M ~ U505 SCDY0003402 DIRECTIONAL...
  • Page 185 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C566 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C567 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C572 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C574 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C575 CAP,CHIP,MAKER ECZH0000813...
  • Page 186 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C617 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C618 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C619 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C620 CAP,CHIP,MAKER ECZH0000826...
  • Page 187 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L536 INDUCTOR,CHIP ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip L601 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , L602 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , L704 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 188 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA702 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA703 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA704 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA705 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005...
  • Page 189 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C127 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C128 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C129 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C130 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C131 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C132 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 190 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C215 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C216 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C217 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C218 CAP,CERAMIC,CHIP ECCH0000179...
  • Page 191 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FL13 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), FL14 FILTER,EMI/POWER SFEY0010501 Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), FILTER,EMI/POWER SFEY0010501 Pb-free...
  • Page 192 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R407 RES,CHIP,MAKER ERHZ0000294 5100 ohm,1/16W ,F ,1005 ,R/TP R408 RES,CHIP ERHY0000124 7.5K ohm,1/16W,F,1005,R/TP R409 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP R410 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP R411 RES,CHIP,MAKER ERHZ0000493...
  • Page 193 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA405 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA406 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA407 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA408 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005...

  • Page 194: Accessory

    3.7 V,800 mAh,1 CELL,PRISMATIC ,U830(3G SON80) SBPP01 SBPP0016001 Black LI-POLYMER BATT, H/P, Pb-Free SGDY00 DATA CABLE SGDY0010901 LG-US03K ,18pin USB DataCable EAR PHONE/EAR MIKE SGEY00 SGEY0005516 GSM FORDER ,KG320(C2EAR PHONE) SSAD01 ADAPTOR,AC-DC SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug...
  • Page 195 Note...
  • Page 196 Note...

Table of Contents