Servicing Notes - Sony XAV-701BT Service Manual
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Also See for XAV-701BT:
- User manual ,
- Installation/connections (2 pages) ,
- Operating instructions manual (68 pages)
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XAV-701BT/741
1.
2.
2-1. Disassembly Flow ...........................................................
2-2. SERVO Board-1 ..............................................................
2-3. SERVO Board-2 ..............................................................
2-4. Tension Spring (KF) .......................................................
2-5. Chassis (T, 614) Sub Assy (CHA1) ................................
2-6. Chassis (OP, 614) Complete Assy (OP1) ........................
3.
1. SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
2
TABLE OF CONTENTS
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.........................................
4.
2
4-1. Block Diagram - SERVO Section - ................................
4-2. Printed Wiring Boards - SERVO Section - ..................... 11
4-3. Schematic Diagram - SERVO Section (1/2) - ................. 12
3
4-4. Schematic Diagram - SERVO Section (2/2) - ................. 13
4
5
6
5.
6
7
6.
8
NOTE THE IC004 AND IC011 ON THE SERVO BOARD
REPLACING
IC004 and IC011 on the SERVO board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
NOTE FOR FLEXIBLE BOARD OF THE OPTICAL PICK-UP
When connecting or disconnecting the fl exible board of the opti-
cal pick-up to or from the CN2 of the SERVO board, follow the
procedure given below.
Note: When soldering the short lands, solder within 5 seconds at the tem-
perature of soldering iron below 300°C.
Disconnection:
1. Solder two shortland.
2. Disconnect the fl exible board from the CN2 of the SERVO
board.
Connection:
1. Connect the fl exible board to the CN2 of the SERVO board.
2. Unsolder two shortland.
................................................. 18
.............................. 19
9
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