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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 280 Pro G2 MT Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sqcm
MB, Memory,HDD PCA,ODD PCA,PSU PCA
All types including standard alkaline and lithium
coin or button style batteriesMB
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
PSU
Power cord
system fan, Cooler fan,PSU fan
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
5
1
0
0
0
0
2
1
0
3
0
0
Page 1
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Summary of Contents for HP 280 Pro G2 MT
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
- Page 3 1. Remove access panel from the unit. Release screw on the access panel. Griping the tab at the end of access panel, pull towards the rear and remove it from unit. EL-MF877-00 Page 3 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 4 2. Remove front panel from the unit. Release 3 bezellatches from chassis by pulling the bezellatches outwards. 3.Remove all the cable from the unit. EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 5 4.Remove HDD from the unit. EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 6 5. Remove ODD from the unit. 6.Take off PSU from the unit. EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 7 Rotate the screw driver to release PSU from the unit. 7.Take off the system fan from the unit EL-MF877-00 Page 7 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 8 Rotate screw driver to loose screw and take off the system fan. 8. Take off Card Reader from the unit. EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 9 9. Take off FIO from the unit. 10.Take off Memory from the unit. Release memory socket levers by pulling outward. 11. Take off CPU cooler from the unit. EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 10 Rotate the screw driver to release CPU cooler from the unit. 12.Take off PCA from the unit. Rotate screw driver to loose PCA from the unit. EL-MF877-00 Page 10 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 11 13. Take off battery from the unit. 14.Open the PSU Rotate screw driver to release PSU cover. 15.Take off PSU fan. EL-MF877-00 Page 11 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 12 Rotate screw driver and remove PSU fan. 16. Take off PCA from the PSU. Rotate the screw driver to release the PCA from PSU. 17.Take off CAP using electric iron. EL-MF877-00 Page 12 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 13 EL-MF877-00 Page 13 Template Revision B PSG instructions for this template are available at EL-MF877-01...