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LG U890 Service Manual
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LG U890 Service Manual

LG U890 Service Manual

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Service Manual
U890/U890c
Date: April, 2006 / Issue 1.0

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Summary of Contents for LG U890

  • Page 1 Service Manual U890/U890c Date: April, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION ......5 4.10 SIM Detect Trouble ......98 4.11 Key Sense Trouble ......99 1.1 Purpose........... 5 4.12 Camera Trouble .........100 1.2 Regulatory Information......5 4.13 Main LCD Trouble......101 4.14 EL Sheet Trouble .......103 2. PERFORMANCE.......7 4.15 Folder ON/OFF Trouble .....104 2.1 System Overview ........7 4.16 Camera Direction Detection Trouble..105 2.2 Usable environment .........8...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Folder Handset Size 98.8 X 49.0 X 18.2 mm Weight 93 g (with 840mAh Battery) Power 4.0V normal, 1000 mAh Li-Polymer Talk Time Over 175 min (WCDMA, Tx=12 dBm, Voice) (with 800mAh) Over 220 min (GSM, Tx=Max, Voice) Stand by Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 4.0 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V] -20 ~ +60 °C Operation Temp -20 ~ +70 °C Storage Temp Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ.
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Class 3 : +24dBm(+1/-3dB) Maximum Output Power Class 4 : +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 4.0 mA Under 355 mA Under 480mA WCDMA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 3.6 mA (Paging=9period) Under 285 mA Under 5.3 mA (Tx=Max) (@Bluetooth Connected, Paging=9period) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change...

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -7 ± 3 dB Receiving Loudness Rating (RLR) -18 ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Idle Noise-Sending (INS) -64 dBm0p Under -47 dBPA...

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 600 mA • Normal Battery Capacity : 1000 mAh • Charging Time : Max 3.5 hours (except for trickle charging time) •...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3.1 General Description The U890 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of U890 is shown in Figure 3-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
  • Page 18 3. TECHNICAL BRIEF U890 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

  • Page 19: Gsm Mode

    3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode U890’s receiver functions are split between the two RFICs as follows: • UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
  • Page 20 3. TECHNICAL BRIEF - 21 -...
  • Page 21 3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250A IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 22: Wcdma Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
  • Page 23 3. TECHNICAL BRIEF The amplifier output drives the RF port of the quadrature RF-to-baseband downconverter. The down- converted baseband outputs are routed to low-pass filters (one I and one Q) having pass-band and stop-band characteristics suitable for DSWCDMA processing. The filter outputs are buffered and passed on to the MSM6250A IC for further processing.
  • Page 24 The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in U890 is “Load Insensitive PA” - no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.

  • Page 25: Lo Phase-Locked Loop

    AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in U890). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.
  • Page 26 3. TECHNICAL BRIEF Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked.

  • Page 27: Off-Chip Rf Components

    Front End module integrates antenna switch module and GSM Rx filter. The antenna switch module allows multiple operating bands and modes to share the same antenna. In the U890 design, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) EGSM Rx, 3) DCS-1800 Rx, 4) PCS-1900 Rx, 5)EGSM Tx, and 6) DCS-1800, PCS-1900 Tx.
  • Page 28 A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: -. Insertion loss . this component is also in the receive and transmit paths; In the U890 typical losses: UMTS Tx = 1.2 dB, UMTS Rx = 1.5 dB.
  • Page 29 Transmitter performance is always improved when an isolator is included and is well worth the added cost. 3.5.4 Thermistor (RT100) This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for assure compliance with the applicable transmit power control standards. Negative temperature compensation thermistor is used in the U890. - 30 -...
  • Page 30 Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The U890 uses National Semiconductor LMV225TLX power detector IC. In Figure 3.5.5-1, R1 is set to 1.8kΩ resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power.
  • Page 31 3. TECHNICAL BRIEF 3.5.6 Dual band GSM power amplifier (U102) The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedance- matching circuitry for 50 Ω...
  • Page 32 3. TECHNICAL BRIEF 3.5.7 GSM transmit VCO (U103) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .
  • Page 33 The MSM6250A includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure3.5.12-1 shows the bluetooth system architecture in the U890. Figure 3.5.10-1 Bluetooth system architecture - 34 -...

  • Page 34: Digital Baseband(Dbb/Msm6250A)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6250A) 3.6.1 General Description A. Features(MSM6250A) • The ARM926EJ-S microprocessor can operate at up to 180 MHz with variable rate, software controlled clocks to provide greater standby time. • Integrated PLL to provide additional on-chip clock frequencies •...

  • Page 35: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture USIM PM6650-2 Receptacle Receptacle BLUETOOTH SPEAKER GSM TX SPEAKER Quadband Quad TX VCO RECEIVER GSM RX SP7T 900/1800/1900 RTR6250 RX FILTER MSM6250A JACK(12pin) WCDMA TX 1.3M UMTS CAMERA UMTS FILTER MAIN WCDMA RX UMTS FILTER SDRAM + RFR6250...
  • Page 36 3. TECHNICAL BRIEF 3.7.1 Block Diagram(MSM6250A) HK ADC USB I/F 19.2M UART General Purpose GSM/ UMTS GPRS NAND & Processor SDRAM Tx/Rx I/Q Tx/Rx I/F SBI for PM6650 Stereo Speaker VOCODER CODEC Receiver SBI for RF IC USIM J-TAG I/F Controller Figure.

  • Page 37: Subsystem(Msm6250A)

    3. TECHNICAL BRIEF 3.8 Subsystem(MSM6250A) 3.8.1 ARM Microprocessor Subsystem The MSM6250A device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6200, RFL6200, and PM6650-2 devices.
  • Page 38 3. TECHNICAL BRIEF 3.8.6 Wideband CODEC The MSM6250A device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output.

  • Page 39: External Memory Interface

    • 2-CS(Chip Select) are used Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY9000A800E0GG Toshiba 35 ns/Bytes 50 ns/Bytes SDRAM TY9000A800E0GG Toshiba 107 ns/4Double Word 53 ns/4Double Word Table External memory interface for U890 - 40 -...

  • Page 40: H/W Sub System

    3. TECHNICAL BRIEF 3.10 H/W Sub System 3.10.1 RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6250A controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PAON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for T/Rx of RF •...
  • Page 41 3. TECHNICAL BRIEF B. RFR6250(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF C. the others • GSM_PA_BAND : DCS/GSM Band Selection of Power Amp • TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA TX Power Amp Enable •...
  • Page 42 3. TECHNICAL BRIEF 3.10.2 MSM Sub System 3.10.2.1. SIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx USIM CLK VREG_USIM 2.85V USIM CLK USIM Reset...
  • Page 43 3. TECHNICAL BRIEF 3.10.2.3. USB The MSM6250A device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6250A was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0.
  • Page 44 3. TECHNICAL BRIEF 3.10.2.4. HKADC(House Keeping ADC) The MSM6250A device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250A device has six analog input pins which are multiplexed to the input of the internal HKADC.
  • Page 45 3. TECHNICAL BRIEF 3.10.3 Power Block 3.10.3.1. General MSM6250A, included RF, is fully covered by PM6650-2(Qualcomm PMIC). PM6650-2 cover the power of MSM6250A, MSM memory, RF block, Bluetooth, Trans flash, USIM and TCXO. Major power components are : PM6650-2(U401) : Phone power supply BH28FB1WHFV(U400) : LCD Power supply QST4(Q400,Q401) : External charger supply switching SI3493DV(Q402) : Main Battery charging control...
  • Page 46 3. TECHNICAL BRIEF Figure. PM6650-2 Functional Block Diagram - 47 -...
  • Page 47 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 3.49V~3.28V 3.70V~3.62V 3.61V~3.50V 4.2V~3.81V 3.80V~3.71V 2~0 (%) 40~21 (%) 20~3 (%) 100~63 (%) 62~41 (%) U890 Battery Bar Display - 48 -...
  • Page 48 3. TECHNICAL BRIEF 3.10.3.3.1. Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT).
  • Page 49 3. TECHNICAL BRIEF 3.10.3.3.2. Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. 3.10.3.3.3.
  • Page 50 3. TECHNICAL BRIEF 3.10.4 Key Pad There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW to PMIC(PM6650-2) and MSM(GPIO76). COL0 COL1 COL2 COL3 COL4 COL5 ROW0 HOT1 (VT) HOT2 (H3G) HOT3 (MENU) CLR (Clear) FUNC_1 Side key (camera) ROW1...
  • Page 51 3. TECHNICAL BRIEF 3.10.5 Camera Interface U890 Installed a 1.3M Pixel CMOS VGA Camera. Below figure show the camera board to board connector and camera I/F signal. CONNECTOR VREG_MSMP_2.7V R500 R501 2.2K CN501 2.2K CAM_DATA(7) CAM_P_DOWN HB-1M1005-600JT CAM_DATA(6) CAM_MCLK FB500...
  • Page 52 3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227). Its interface is dedicated camera interface port in MSM6250A. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 53 3. TECHNICAL BRIEF 3.10.6 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U600 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to MSM6250A GPIO80. FOLDER_SENSE R600 VREG_MSMP_2.7V...
  • Page 54 3. TECHNICAL BRIEF 3.10.7 Camera Direction Detection CAM_SENSE detects the Camera Direction (front or back) CAM_HALL_IC R503 U501 VREG_MSMP_2.7V MRSS32W_L CAM_SENSE C512 C513 0.1u Figure Camera Direction Detection - 55 -...
  • Page 55 3. TECHNICAL BRIEF 3.10.8 Keypad Light There is EL Sheet on Top side in board backlight circuit, which is driven by EL_OUT line from EL Driver IC. Key Pad backlight controlled by PM6650. Figure. EL Sheet - 56 -...
  • Page 56 3. TECHNICAL BRIEF 3.10.9 LCD Module Vibrator MAIN Receiver Back LOUD SPK MODULE Light LOUD SPK Figure. LCD Module Block Diagram MAIN LCD MODULE SUB LCD MODULE 260K Color TFT 65K Color TFT 176 * 220 Pixel (260K Color support) 96 * 96 Pixel HD66784(RENESAS) Graphic Controller Driver Main &...
  • Page 57 3. TECHNICAL BRIEF 3.10.10. Display & LCD FPC Interface LCD module is connected to Main board with 50-pin BtoB connector (CN600_AXT450164) and Speaker, Receiver, Vibrator are connected by soldering the leads to pads in LCD FPCB module. The LCD is controlled by 16-bit EBI2 in MSM6250 1 : NC 26 : KEY_ROW(3) : MOD_KEY 2 : VCC_2.8V : LCD Power...
  • Page 58 3. TECHNICAL BRIEF 3.10.11 Audio and Sound 3.10.11.1 Overview of Audio & Sound path SUB b'd Head Set Conn. Jack Head_Set LCD Conn Module Receiver MSM6250A (U201) LCD Conn Stereo Speaker Module SUB b'd Head Set Head_set MIC Conn. Jack Figure Audio &...
  • Page 59 3. TECHNICAL BRIEF 3.10.11.2 Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250A). This transmitted signal is reformed to fit in GSM &...
  • Page 60 3. TECHNICAL BRIEF MSM6250 BLK MIC_Feedback MICFBP MICINN 180K MICOUTP C202 0.1u C203 0.1u R202 C204 0.015u Near to MSM 470K R205 C223 0.015u 180K MICOUTN C224 0.1u C225 0.1u R207 MICINP MICFBN Head Set Jack BLK DAUGHTER_HEADSET C914 R905 2.2K R903 CN901...
  • Page 61 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS C523 C525 SP0102BE3 U503 C528 MIC1N C529 MIC1P Audio Amp for loud Speaker Audio AMP C535 R512 100K U504 LM4898ITLX-NOPB R513 VREG_5V AMP_PWR AMP_PWR SPK_P ⇒ R516 Speaker C536 22n M_SPK- SPK_N R517 C538 C537...
  • Page 62 3. TECHNICAL BRIEF 3.10.12 Trans Flash MSM6250 BLK BT_CLK BT_CLK_GPIO[25] BT_SBST BT_SBST_GPIO[24] BT_SBCK BT_SBCK_GPIO[23] BT_SBDT BT_SBDT_GPIO[22] BT_TX_RX_N BT_TX_RN_N_GPIO[21] BT_DATA BT_DATA_GPIO[20] Trans Flash BLK T-FLASH SOCKET R920 <= VREG_MMC_3.0V from PM6650 S900 500873-0802 DAT2_RSV CD_DAT3_CS MMC_CD CMD_DI MMC_CMD CLK_SCLK MMC_CLK DAT0_DO MMC_DATA DAT1_RSV C905...

  • Page 63: Main Features

    3. TECHNICAL BRIEF 3.11 Main Features 3.11.1 LG-U890(MUSE2) Main features - Folder Type - WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode - Dual color LCD(Main:260K TFT, Sub:65K TFT) - 1.3M Pixel CMOS VGA Camera - 20*14 pi Stereo speaker - Stereo Head_set...

  • Page 64: Main Component

    3. TECHNICAL BRIEF 3.12 Main Component 3.12.1 LG-U890 Main Components SUB Top Side MAIN Bottom Side MAIN Top Side SUB Bottom Side 1.3M Camera Module U890 LCD & Folder Assy Stereo Headset - 65 -...

  • Page 65: Main Top Side

    3. TECHNICAL BRIEF 3.12.2 Main Top Side U601 U400 U600 D600, D602 RA600 CN601 CN600 EL Sheet Reference Description Reference Description U400 LCD 2.8V LDO U601 LCD Backlight power charge pump U600 Folder close(Flip) detection IC D600, Diode for On Sw detection D602 RA600 Key Sense control signal(ROW[])

  • Page 66: Main Bottom Side

    3. TECHNICAL BRIEF 3.12.3 Main Bottom Side U501 U500 FL600 CN501 CN602 CN500 U602 U505 U504 U300 X400 U201 U401 X200 U402 J300 X100 Q403,Q404 U403 CN502 U503 Q400 CN503 Q401 TR100 Q402 Reference Description Reference Description U500 Camera Dual LDO(2.7V/1.8V) U501 Camera direction detection IC CN501...
  • Page 67 3. TECHNICAL BRIEF Main Bottom Side(continued) U501 U500 FL600 CN501 CN602 CN500 U602 U505 U504 U300 X400 U201 U401 X200 U402 J300 X100 Q403,Q404 U403 CN502 U503 Q400 CN503 Q401 TR100 Q402 Reference Description Reference Description Q403, N/P-MOS FET for WCDMA PAM X200 48MHz Crystal for USB power control...

  • Page 68: Sub Bottom Side

    3. TECHNICAL BRIEF 3.12.4 SUB Bottom Side CN901 S900 U901 BAT900 D901 3.12.5 SUB Top Side CN902 Reference Description Reference Description S900 Trans Flash Socket CN901 Headset Jack U901 TVS for Trans flash data signal BAT900 Back Up battery D901 TVS for audio signal CN902 24pin connector for MAIN PCB...

  • Page 69: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component U105 X100 U1000 FL102 U104 U100 U1004 SW1002 ANT 100 U103 U102 ANT 102 ANT500 RF component (Bottom) - 70 -...

  • Page 70: Signal Path

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH - 71 -...

  • Page 71: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VCXO Block The reference frequency (19.2MHz) from X100 (VCXO) is used WCDMA TX part, GSM part and BB part. - 72 -...
  • Page 72 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) C157 1000p VREG_TCXO_2.85V C162 C163 1000p 0.1u 19.2MHz X100 R126 TRK_LO_ADJ VCONT TG-5001LA-19.2MHz C172 C173 0.01u 1000p C177 100p TCXO_PM...
  • Page 73 4. TROUBLE SHOOTING Check TP1 VCC of VCXO ≥ 2.8V Check PMIC Check TP2 TRK_LO_ADJ ≥ ≥ Check MSM 3V Voltage 0V Check TP3,4,5 With Oscilloscope Check soldering ≥ ≥ 3V Voltage 0V and components VCXO is OK Check other part - 74 -...

  • Page 74: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block ANT_SEL2 M054E ANT_SEL1 ANT_SEL0 VREG_RFRX_0_2.85V Antenna Switch Block(Bottom) ANT100 ANT102 SW100 C100 6.8p KMS-512 C101 L100 C102 10nH D1040 U100 ANT_SEL0 CTRL1 RX_DCS1 ANT_SEL1 CTRL2 RX_DCS2 CTRL3 RX_PCS1 ANT_SEL2 CTRL4 RX_PCS2 RX_EGSM1 RX_EGSM2 UMTS...
  • Page 75 4. TROUBLE SHOOTING Checking Switch Block power source Check Soldering of ANT_SEL 0, 1, 2 High Level Check VCC 2.5V < Voltgae < 3.0V TP1 VREG_RFRX_0_2.85V Check the Logic in each mode - 76 -...

  • Page 76: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5. Checking WCDMA Block START 1. Check VCXO 19.2MH z 2. Check ANT. SW Module ANT_SEL0, 1, 2 3. Check RF Tx Level 3. 4. 4. Check PAM Block 5. Check RF Rx L evel 6. Re-download SW & CAL. - 77 -...
  • Page 77 4. TROUBLE SHOOTING 4.5.1 Checking VCXO Block Refer to 3.3 4.5.2 Checking Ant. SW module Refer to 3.4 4.5.3 Checking RF TX Level Test Point (RF TX Level) ANT100 ANT102 SW100 C100 6.8p KMS-512 C101 L100 C102 10nH D1040 U100 ANT_SEL0 CTRL1 RX_DCS1...
  • Page 78 4. TROUBLE SHOOTING SKY77410 U104 C158 RF_OUT RF_IN 3.9nH C164 L128 VREG_W_PA C165 2.2u R127 TX_AGC_ADJ TR100 UMC4N C174 +VPWR 0.01u C175 PA_ON 0.01u C176 0.01u VREG_RFTX_2.85V U105 LMV225TLX R129 1.8K C188 100p VREG_RFTX_2.85V C189 RFIN_EN HDET1 R130 HDET PA_ON C190 C191 1200p...
  • Page 79 4. TROUBLE SHOOTING For testing, Max power output is needed. Set the Phone Tx is ON and PDM is 450 Check TP1 RF Tx Level is OK Over 21dBm ? Check TP2 Check FEM Over 19dBm ? Check TP3 Check Duplexer Over 16dBm ? Check TP4 Check PAM Block...
  • Page 80 4. TROUBLE SHOOTING 4.5.4. Checking PAM Block PAM control signal PA_ON : WCDMA Tx Power Detect IC(HDET) Enable TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control PA_ON TX_AGC_ADJ PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) PAM IN/OUT Signal PAM_OUT PAM_IN...
  • Page 81 4. TROUBLE SHOOTING 4.5.5. Check RF Rx Level Bias1 Test Point (RF Rx Level) ANT100 ANT102 SW100 C100 6.8p KMS-512 C101 L100 C102 10nH C154 IMT_RX_P L122 D1040 U100 3.9nH FL100 ANT_SEL0 CTRL1 RX_DCS1 C155 R123 C156 0.1u ANT_SEL1 CTRL2 RX_DCS2 L123 ILNA_OUT...
  • Page 82 4. TROUBLE SHOOTING Set the Phone Rx is ON Check bias1 Check bias block Over 2V ? soldering Check TP1 Check RF s/w Signal exist? Check TP2 Check FEM Signal exist? Check TP3 Check Duplexer Signal exist? Check TP4 Check RFR6250 Signal exist? Change the board - 83 -...

  • Page 83: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6. Checking GSM Block START 1. Check TXV CO Block 2. Check ANT. SW M odule 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re -download SW & CA L. - 84 -...
  • Page 84 4. TROUBLE SHOOTING 4.6.1 Checking VCO Block Test Point (TXVCO Level) VDDA11 R106 C125 TX_MOD_CP 1000p VDDA12 L120 C126 C127 C128 (PPS) TX_VCO_FB 9.1nH 120p 1000p (2012) L121 10nH C133 R110 MQW5V0C869M U103 FB100 R109 VREG_RFTX_2.85V R111 R112 GSM_TX_VCO_0_EN_N OUT_GSM R113 GSM_TX_VCO_1_EN_N OUT_DCSPCS...
  • Page 85 4. TROUBLE SHOOTING START Check TP1 Check RTR6250 0.5V < TP1 < 2. 5 V Check TP2, TP3 I f GSM TP2=High , TP3=Low Check Soldering I f DCS/PCS TP2=Low , TP3=High & MSM 6250A Check TP4 Check PMIC( U401) 2.8V <...
  • Page 86 4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 4.4 4.6.3 Checking RF Tx level Test Point (RF Tx Level) ANT100 ANT102 SW100 C100 6.8p KMS-512 C101 L100 C102 10nH D1040 U100 ANT_SEL0 CTRL1 RX_DCS1 ANT_SEL1 CTRL2 RX_DCS2 CTRL3 RX_PCS1 ANT_SEL2...
  • Page 87 4. TROUBLE SHOOTING START Check TP1 GSM/ DCS/PCS If GSM over 31dBm ? Tx is Ok If DCS/PCS over 28dBm ? Check other part Check TP2, TP3 Check ANT . SW If T P2 ove r 29dBm ? M odule (U100) If T P3 ove r 25dBm ? Re fer to chapter 3.4 Check PAM Block (U102)
  • Page 88 4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.
  • Page 89 4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block DCS.RX PCS.RX GSM.RX Test Point (RF Rx Level) L101 2.7nH L102 3.6nH PCS RX 1930-1990 MHz C105 1000p L105 3.6nH L108 2.7nH VREG_RFTX_2.85V C106 VREG_RFRX_0_2.85V L110 5.1nH C108 0.1u DCS RX L111 7.5nH 1805-1880 MHz C112...
  • Page 90 4. TROUBLE SHOOTING Set the Phone Rx is ON Check Resoldering soldering Check Change FEM & buffer FEM & buffer Change the board - 91 -...

  • Page 91: Bluetooth Rf Block

    4. TROUBLE SHOOTING 4.7 Bluetooth RF Block TC-3000A (Bluetooth Tester) 1. Set phone to bluetooth test-mode : Enter Test Mode(277634#*#) → Module Test Set → BT DUT → BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4.
  • Page 92 4. TROUBLE SHOOTING Test Point (Bluetooth Block ) VREG_MSMP_2.7V R505 VREG_BT_2.85V TP500 TP501 1.8p C612 U502 L500 BT_CLK CLK_REF SBST BT_SBST C521 2.7nH SBCK BT_SBCK VDD_MSM SBDT BT_SBDT SYNC_DET_TX_EN BT_TX_RX_N VDD_A RX_BB_TX_BB BT_DATA C524 1000p LDO1 XTAL_IN TCXO_BT LDO2 C526 C527 2.2u 1608...
  • Page 93 4. TROUBLE SHOOTING Set the Phone Rx is ON Check BT Antenna TP1 < -6dBm soldering TP2 > 2.5V Replace PCB TP3 > 2.8V Replace PMIC @TP4 @TP5 Replace PCB 19.2MHz ? 19.2MHz ? Replace BT module Change U402 (U502) - 94 -...

  • Page 94: Power On Trouble

    4. TROUBLE SHOOTING 4.8 Power ON Trouble Power On sequence of U890 is : PWR(END) key press -> PM_ON_SW_N go to low(D602),PM6650-2 KPDPWR_N pin(24) -> PM6650-2 Power Up -> VREG_MSMC_1.375V(C436), VREG_MSME_1.8V(C437), VREG_MSMP_2.7V(C426), VREG_MSMA_2.6V(C424), VREG_TCXO_2.85V(C404) power up and system reset assert to MSM ->...
  • Page 95 4. TROUBLE SHOOTING VREG_MSMC_1.375V VREG_MSME_1.8V MSM6250 19.2MHz(R405) VREGC_MSMP_2.7V PM6650 VREGC_MSMA_2.6V 19.2MHz(C435) 32.768KHz VREG_TCXO_2.85V - 96 -...

  • Page 96: Usb Trouble

    4. TROUBLE SHOOTING 4.9 USB Trouble USB Initial sequence of U890 is : USB connected to U890 -> USB_VBUS(U403 Pin_4) go to 5V -> USB_D+(U403 Pin_1) go to 3.3V -> 48M Crystal on -> USB_DATA(TP_210) is triggered -> USB work. Start...

  • Page 97: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.10 SIM Detect Trouble USB Initial sequence of U890 is : VREG_USIM_2.85V(C432 of PM6650-2) go to 3.0V -> USIM_CLK,USIM_RST,USIM_DATA triggered -> USIM IF work(Schematic and place are refer to SIM technical brief) Start Re-insert the SIM card...

  • Page 98: Key Sense Trouble

    4. TROUBLE SHOOTING 4.11 Key Sense Trouble Key Sense sequence of U890 is : Default condition ROW(0-4) is 2.7V -> Press the key -> Corresponding row(x) and col(x) go to 0V -> Key sensing Start Change the side key Work well?

  • Page 99: Camera Trouble

    4. TROUBLE SHOOTING 4.12 Camera Trouble Camera control signals are generated by MSM6250A and directly connected with MSM6250A. Start Check the camera conn. and reconnect the camera Camera is OK? Check VREG_CAM_2.7V, Change the U500 VREG_CAM_1.8V Check the DSP_CLK Change the Main board (FB500) Change the camera Camera is OK?

  • Page 100: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.13 Main LCD Trouble Main LCD control signals are generated by MSM6250A. Those signal’s path are : MSM6250A -> MAIN B’d -> CN602 -> LCD FPCB and LCD Module START Press END key to turn the power on Follow the Power ON Is the circuit powered? trouble shooting...
  • Page 101 4. TROUBLE SHOOTING LCD Control data flow LCD Module 40pin LCD co nnect or FPCB for LCD Module CN600(50pin LCD connector) - 102 -...

  • Page 102: El Sheet Trouble

    4. TROUBLE SHOOTING 4.14 EL Sheet Trouble EL Sheet (Key Pad Back Light) is on as below : Key pressing -> KEYD_EN go to High -> EL Sheet On Key Pad Led controlled by PM6650-2. Start Key press Signal VPWR is OK? Change the Main board ( Check C611 ) Change the Main...

  • Page 103: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.15 Folder ON/OFF Trouble Folder On/Off(Close/Open) is worked as below : Folder On/Off Event -> Flip(U600 pin 1) is triggered(Open : about 2.6V, Close : 0V) -> MSM6250A Sense the Folder Flip Event. Sensing signal is directly connected to MSM6250A. Start Check the magnet in Insert the magnet...

  • Page 104: Camera Direction Detection Trouble

    4. TROUBLE SHOOTING 4.16 Camera Direction Detection Trouble Camera direction detection is worked as below : Camera direction change Event -> CAM_SENSE(U501 pin out) is triggered as this (Cam front side view : 0V, Cam back side view : about 2.5V) -> MSM6250A Sense the Camera direction change Event Start Check the magnet in the mechanics of camera module...

  • Page 105: Trans Flash Trouble

    4. TROUBLE SHOOTING 4.17 Trans Flash Trouble Trans Flash is worked as below : Trans Flash insertion -> VREG_MMC_3.0V is 3.0V -> MMC_CD go to High -> Trans Flash Insertion detecting by MSM6250A -> go working Start Check the B-to-B connector for SUB PCB Insert the Trans Flash Card Trans Flash insertion...

  • Page 106: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.18 Audio Trouble Shooting 4.18.1 Receiver Path Voice Receiver path as below: MSM6250A Ear1ON/Ear1OP -> R523,R525 -> U505(Speaker/receiver switch) -> FB503, FB504 -> CN602(b’d to b’d connector for LCD Module) -> LCD b’d to b’d connector of LCD FPCB -> LCD module ->...
  • Page 107 4. TROUBLE SHOOTING Speaker Speaker soldering point FPCB for LCD Module R523,R525(receiver signal serial resistor) CN602(50pin LCD connector) U505(Speaker/receiver switch) FB503,FB504 (audio signal serial bead) - 108 -...
  • Page 108 4. TROUBLE SHOOTING 4.18.2 Voice and Sound Path for Head_set Voice and Multimedia Sound path for Head_Set as below: MSM6250A HPH_R, HPH_L -> CN500 pin 17,18 for SUB b’d -> FB901, FB902 in SUB b’d -> C907,C911 in SUB b’d -> CN901 headset Jack pin 4,5 in SUB b’d Start Connect the phone to network Equipment and setup call...
  • Page 109 4. TROUBLE SHOOTING FB901, FB902 CN901 C907,C911 CN600(50pin LCD connector) - 110 -...
  • Page 110 4. TROUBLE SHOOTING 4.18.3 Loud Speaker path(voice speaker phone, VT, multimedia play, etc) Loud speaker path as below: MSM6250A AUXOP_AUXOL, AUXOP_AUXOR -> C536,C537 -> R516,R517 -> U504(amp) -> U505(Receiver/Speaker switch) -> FB503, FB504 -> CN602 -> LCD FPCB -> Speaker Start Connect the phone to network Equipment and setup call...
  • Page 111 4. TROUBLE SHOOTING Speaker Speaker soldering point FPCB for LCD Module CN602(50pin LCD connector) U505(Speaker/receiver switch) U504(Amp) C536, C537, R516, R517 FB503,FB504 (audio signal serial bead) - 112 -...
  • Page 112 4. TROUBLE SHOOTING 4.18.4 Microphone for Main MIC Main Microphone path as below: MIC -> C528,C529 -> MSM6250A -> MIC feed back gain logic -> MSM internal CODEC MICBIAS C523 C525 SP0102BE3 Near to MSM U503 C528 MIC1N C529 MIC1P Start Make a call MIC_BIAS(C525) is 1.8V...
  • Page 113 4. TROUBLE SHOOTING U503(MIC for Handset) MICBIAS C523 C525 SP0102BE3 U503 C528 MIC1N C529 MIC1P - 114 -...
  • Page 114 4. TROUBLE SHOOTING 4.18.5 Microphone for Head_Set MIC for Head_Set path as below: Insert Headset -> EAR_SENSE_N(pin6) go 0V -> MSM6250A sense Head_Set insertion -> MIC signal go to MSM(C226, C227) by through b-to-b connector DAUGHTER_HEADSET C914 R905 2.2K R903 CN901 VREG_MSMP_2.7V R907...
  • Page 115 4. TROUBLE SHOOTING C226,C227 for MIC serial capacitor - 116 -...

  • Page 116: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.19 Charger Trouble Shooting Charging Current Flow USB Cable USB_VBUS (5.0V) Pass control Tr (ON) USB Charging control USB_CNT_N +5V_PWR (4.6V) Pass control Tr (ON) TA Charging control CHG_CNT_N Charging current ICHARGE sensing ICHARGEOUT 4.2~4.25V +VPWR Main VBATT Battery Battery FET...
  • Page 117 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector Connection OK? Change I/O connector Is the TA voltage 4.6V? Change TA/USB cable Is the USB voltage 5.0V? Check the Q400,Q401,Q402 Charging OK? Change the board - 118 -...
  • Page 118 4. TROUBLE SHOOTING Q400 Q401 Q402 VBATT - 119 -...

  • Page 119: Download

    LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 8 handsets at the same time.
  • Page 120 5. DOWNLOAD 5.2.1 Connecting to PC • Choose desired country and then click on the OK button. Once the desired country is selected, the selected country name will be displayed at the bottom of left corner screen. For instance, if the selected country is “Italy”, then LGMDP will operate based on the Italy Setting Values.
  • Page 121 5. DOWNLOAD • Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. The current security status will be displayed under Security column. Make sure that the selected country is valid. If the selected country is invalid, select the country name again.
  • Page 122 5. DOWNLOAD • The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. - 123 -...
  • Page 123 5. DOWNLOAD 1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse... button. The edit box shows the file path where new images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse...
  • Page 124 5. DOWNLOAD 5.2.2 Choosing image files • Select the image folder, where all the image files are located, by clicking on the Browse..(The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) •...
  • Page 125 5. DOWNLOAD • Select the path, where Media Image file is located by clicking on the Browse... button. The selected Media image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen the right media image file. •...
  • Page 126 5. DOWNLOAD • Choose a Module Image file after clicking on the Browse... button. The selected Module image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen the right Module image file. •...
  • Page 127 5. DOWNLOAD • If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse... button. •...
  • Page 128 5. DOWNLOAD 5.2.3 Downloading • The following flow chart is whole process for downloading images to the handset. You will see snapshots for each step in the succeeding slides. Download Start (NV Backup) (NV Restore) Erase MEDIA directory Reset Download MEDIA Erase MODULE directory Download MODULE (Erase EFS)
  • Page 129 5. DOWNLOAD • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
  • Page 130 5. DOWNLOAD • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection. • Rebooting the handset and re-establishing the connection •...
  • Page 131 5. DOWNLOAD • Downloading Media image in progress • Downloading Module image in progress • Downloading process has completed successfully - 132 -...
  • Page 132 5. DOWNLOAD 5.2.4 Tools • Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu. •...

  • Page 133: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting Download Errors 1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error 5.3.1 When the phone does not work • Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images again including AMSS modem, Media, and Module image.
  • Page 134 5. DOWNLOAD • Choose Image file after clicking on the Browse... button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode.
  • Page 135 5. DOWNLOAD • Reboot the phone and then re- try to download only the Media and Module images again. Both Media and Module image have to be downloaded at the same time. 5.3.3 NV Restore Error • Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt. - 136 -...
  • Page 136 5. DOWNLOAD • Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.) • Click on NV Restore. A list of NV Backup files(*.nv2) will be shown. These files were saved every time NV Backup option was selected.

  • Page 137: Caution

    5. DOWNLOAD • Choose the desired NV file to be downloaded on the handset, and click on Restore. • Snapshot showing the error, Reading the NV file and restore NV. 5.4 Caution 1) Not recommended that multi-downloading using the USB hub. 2) Recommended that the Module and Media Image have to be downloaded at the same time.

  • Page 138: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block Fig 6.1-1.UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram - 139 -...
  • Page 139 6. BLOCK DIAGRAM Table 2.1-1. RF Block Component - 140 -...

  • Page 140: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram U890 Interface Diagram - 141 -...
  • Page 141 6. BLOCK DIAGRAM Main RF signal (black) GSM TX : GSM Tx RF signal GSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal Control signal(red) ANT_SEL 0,1,2 : Ant Switch Module Mode Selection...
  • Page 142 6. BLOCK DIAGRAM *Top Side - 143 -...
  • Page 143 6. BLOCK DIAGRAM Bottom Side - 144 -...

  • Page 144: Circuit Diagram

    U890 J.H. KIM MODEL Designer 2005 VREG_RFRX_1_2.85V C198 C199 0.1u Checked RX_QM R137 DRAWING 0.1u RX_QP R138 Approved RX_IM 470p 3.9n 3.3K 0.01u RX_IP 0.1u 100p R139 4.7K DRAWING Rev_1.1 LG Electronics Inc. LG(42)-A-5505-10:01 LG Electronics Inc. - 145 -...
  • Page 145 BT_DATA EBI2_ADD[6] AC10 EBI2_ADD[5] EBI2_ADD[4] AA10 EBI2_ADD[3] EBI2_ADD[2] EBI2_ADD[1] Section Date Sign & Name Sheet/ Sheets 12/10 MUSE II KIM.D.K MODEL Designer 2005 Checked DRAWING MSM6250A NAME Approved DRAWING LG Electronics Inc. Rev_1.1 LG(42)-A-5505-10:01 LG Electronics Inc. - 146 -...
  • Page 146 NC86 NC27 NC87 NC28 NC88 NC29 NC89 Section Date Sign & Name Sheet/ Sheets MODEL MUSE II 12/10 Designer KIM.D.K 2005 Checked DRAWING MEMORY & SIM NAME Approved DRAWING Rev_1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 147 -...
  • Page 147 100K R411 R412 VREG_W_PA PA_FET_N USB_VBUS Section Date Sign & Name Sheet/ Sheets C441 MODEL MUSE II 12/10 EDTY0008607 0.1u Designer KIM.D.K 2005 Checked DRAWING PMIC NAME Approved DRAWING Rev_1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 148 -...
  • Page 148 VREG_5V Checked R519 DRAWING CAM & AUDIO & I/O +VPWR R521 100K NAME C541 BLUETOOTH FB503 Approved SPK_RCV+ SPK_RCV_P FB504 R523 M_RCV- RCV- SPK_RCV- SPK_RCV_N R525 M_RCV+ RCV+ DRAWING Rev_1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 149 -...
  • Page 149 2005 KYPD_EN VOUT L601 470uH EL_GND Checked C608 DRAWING 2200p KEY & LCD CONN NAME C609 C610 EL OFF ZD601 Approved 6800p C611 KDZ100VW R610 HIGH EL ON DRAWING LG Electronics Inc. Rev_1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 150 -...
  • Page 150 HOOK_SENSE_N C915 C917 C931 C932 C-1827541 MSMF05C-P D901 Section Date Sign & Name Sheet/ Sheets MODEL MUSE II 11/16 Designer KIM.D.K 2005 Checked DRAWING SUB BíD NAME Approved DRAWING Rev_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 151 -...
  • Page 151 M_PWR MOTOR_PWR- EVLC14S02050 EVLC14S02050 VISION MARK CAMERA FLASH LED Section Date Sign & Name Sheet/ Sheets MODEL MUSE II 12/27 Designer KIM.D.K 2005 Checked DRAWING LCD_FPCB NAME Approved DRAWING LG Electronics Inc. Rev_1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 152 -...

  • Page 152: Pcb Layout

    8. pcb layout - 153 -...
  • Page 153 8. pcb layout - 154 -...
  • Page 154 8. pcb layout - 155 -...
  • Page 155 8. pcb layout - 156 -...
  • Page 156 8. pcb layout - 157 -...
  • Page 157 8. pcb layout - 158 -...

  • Page 158: Calibration

    9. CALIBRATION 9. CALIBRATION 9.1 HOT KIMCHI 9.1.1 Directory structure HOT KIMCHI PROJECT Auto_Model U890 AutoSetup.xml Procedure_U890_Ver0.99.xml Spec_U890_Ver0.95.xml Cal_Model U890 Main_SequenceD.dll Dll_SerialATD.dll HOT_KIMCHI CmMqDll.dll DLL_PwrControlD.dll ComLMPLib_06.dll DLL_E5515CD.DLL Hot_KimchiD.exe AT_Serial_Cmd.xml ShieldBox_DllD.dll PwrSupply_Cmd.xml RF_Auto Main_SequenceD.dll Setup_Cal_Test.xml Info_Db.txt Dll_SerialATD.dll Jay_Ver0.8A_U890.dll DLL_PwrControlD.dll DLL_E5515CD.DLL AT_Serial_Cmd.xml : Directory PwrSupply_Cmd.xml...
  • Page 159 9. CALIBRATION 9.1.2 Setup file (Info_Db.txt) /*cal*/[Default]=[U890] /*cal*/[U890]=[..\\Cal_Model\\U890\\Jay_Ver0.8A_U890.dll] /*auto*/[U890]=[..\\RF Auto\\Rf_AutoMain_Ver1114.dll] [ezlooks]=[off] [batcal]=[off] [svc]=[off] [standalone]=[off] [tescom]=[off] [process]=[cal] [U890]=[..\\Auto_Model\\U890\\Procedure_U890_Ver0.99.xml,..\\Auto_Model\\U890\\Spec_U890_ Ver0.95.xml,..\\Auto_Model\\U890\\AutoSetup.xml] 1: Indication of ‘cal process’ or ‘auto process’ 2: Model name which is displayed on Hot Kimchi program 3: Relative path of Main Sequence dll file from Hot_KimchiD.exe 4: You can change this as ‘on’...
  • Page 160 [svc]=> If you use this program in svc, turn it on. Domestic: ‘on’, Oversea:’off’ [standalone]=> Oversea factory or SVC: ‘on’, Domestic factory: ‘off’ [tescom]=> If you use TESCOM shiedbox, turn it on. [process]=> auto process or cal process [U890]=> procedure, spec, setup file name(auto process only) - 161 -...
  • Page 161 9. CALIBRATION 9.1.4 Example for setting file CAL Process AUTO Process Ex1) Service center Ex1) Service center, Oversea factory, repair [ezlooks]=[off] [ezlooks]=[off] [batcal]=[off] [batcal]=[off] [svc]=[on] [svc]=[off] [standalone]=[off] [standalone]=[off] [tescom]=[off] [tescom]=[off] [process]=[cal] [process]=[auto] Ex2) Domestic factory Ex2) Oversea factory or repair [ezlooks]=[on] [ezlooks]=[off] [batcal]=[off]...

  • Page 162: How To Use Hot Kimchi

    9. CALIBRATION 9.2 How to use Hot Kimchi *Flow 1.Select the model name which you want 2.Click APPLY button to load the ‘cal’ or ‘auto’ lib file 3.Click START button to run the procedure which you want - 163 -...

  • Page 163: Hot Kimchi Example

    9. CALIBRATION 9.3 HOT KIMCHI Example Choose_U890 - 164 -...
  • Page 164 9. CALIBRATION Click APPLY button Click START button - 165 -...
  • Page 165 9. CALIBRATION Click Run button to lunch RF AUTOTEST - 166 -...

  • Page 166: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 12 13 - 167 -...
  • Page 167 - 168 -...

  • Page 168: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark White Gold GSM(FOLDER) TGFF0069602 Pearl White Gold AAAY00...
  • Page 169 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark White Gold MDAJ00 DECO,HINGE MDAJ0009401 Pearl Without MDAY00 DECO MDAY0006801 0.2t Color White Gold MPBJ00 PAD,MOTOR MPBJ0029401 Pearl White Gold MPBN00 PAD,SPEAKER MPBN0026301 Pearl White Gold MPBQ00 PAD,LCD(SUB) MPBQ0026301...
  • Page 170 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark White Gold MCCH01 CAP,SCREW MCCH0073801 Pearl White Gold MDAN00 DECO,SPEAKER MDAN0008701 Pearl Without MHFD00 HINGE,FOLDER MHFD0011901 Color MIDZ00 INSULATOR MIDZ0097901 Silver Without MPBF00 PAD,FLEXIBLE PCB MPBF0012501 Color MPBZ00...
  • Page 171 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MTAB00 TAPE,PROTECTION MTAB0098201 0.06t Color White Gold ACGN00 COVER ASSY,CAMERA ACGN0005101 Pearl COVER ASSY, White Gold ACGP00 ACGP0003301 CAMERA(FRONT) Pearl ATBZ00 TERMINAL ASSY ATBZ0001301 Black White Gold MCJP00...

  • Page 172: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0041801 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0036901...
  • Page 173 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C102 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C103 CAP,CERAMIC,CHIP ECCH0000130 150 pF,50V ,J ,SL ,TC ,1005 ,R/TP C104 CAP,CERAMIC,CHIP ECCH0000130 150 pF,50V ,J ,SL ,TC ,1005 ,R/TP C105 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 174 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C136 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C137 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C138 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C139 CAP,CERAMIC,CHIP ECCH0000112...
  • Page 175 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C171 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C172 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C173 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C174 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C175 CAP,CERAMIC,CHIP ECCH0000155...
  • Page 176 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C205 CAP,TANTAL,CHIP ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP C206 CAP,TANTAL,CHIP ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP C207 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C208 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C209...
  • Page 177 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C241 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C242 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C243 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP C244 CAP,CERAMIC,CHIP ECCH0000155...
  • Page 178 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C415 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C416 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C417 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C418 CAP,CERAMIC,CHIP ECCH0006201...
  • Page 179 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C515 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C516 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C517 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C518 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 180 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP CONNECTOR,BOARD TO CN500 ENBY0021001...
  • Page 181 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb- FL602 FILTER,EMI/POWER SFEY0007103 free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb- FL603 FILTER,EMI/POWER SFEY0007103 free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb- FL604 FILTER,EMI/POWER SFEY0007103...
  • Page 182 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L130 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , L131 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP , L300 INDUCTOR,CHIP ELCH0001550 56 nH,J ,1608 ,R/TP , L400 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE...
  • Page 183 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R117 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP R118 RES,CHIP ERHY0000226 220 ohm,1/16W,J,1005,R/TP R119 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R120 RES,CHIP ERHY0000228 270 ohm,1/16W,J,1005,R/TP R121 RES,CHIP ERHY0000214 51 ohm,1/16W,J,1005,R/TP R122 RES,CHIP ERHY0000241...
  • Page 184 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R213 RES,CHIP ERHY0000112 1K ohm,1/16W,F,1005,R/TP R214 RES,CHIP ERHY0000246 2K ohm,1/16W,J,1005,R/TP R215 RES,CHIP ERHY0000274 51K ohm,1/16W,J,1005,R/TP R216 RES,CHIP ERHY0000274 51K ohm,1/16W,J,1005,R/TP R217 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R218 RES,CHIP ERHY0000274...
  • Page 185 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R516 RES,CHIP ERHY0000131 20K ohm,1/16W,F,1005,R/TP R517 RES,CHIP ERHY0000131 20K ohm,1/16W,F,1005,R/TP R518 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R520 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R521 RES,CHIP,MAKER ERHZ0000360 100 Kohm,1/16W ,D ,1005 ,R/TP R523 RES,CHIP ERHY0000102...
  • Page 186 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 4X3 UCSP / CODE : B12-4 ,10 PIN,R/TP ,DUAL SPDT U505 EUSY0119002 ANALOG SWITCHES(Pb Free) U602 EUSY0250101 MSOP ,8 PIN,R/TP ,AC_182Vpp EL DRIV VA300 VARISTOR SEVY0003801 18 V, ,SMD , VA301...
  • Page 187 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C227 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C406 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C407 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C500 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 188 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R601 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R603 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R604 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R605 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R606 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R607 RES,CHIP ERHY0000280...
  • Page 189 SEVY0001001 14 V, ,SMD ,50pF, 1005 VA902 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 SAJD00 PCB ASSY,SUB,SMT TOP SAJD0011101 CONNECTOR,BOARD TO CN902 ENBY0019601 24 PIN,.4 mm,ETC , ,H=1.5, Header BOARD SPJY00 PCB,SUB SPJY0022901 FR-4 ,0.8 mm,MULTI-4 ,U890,SUB - 190 -...

  • Page 190: Accessory

    Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark BATTERY PACK,LI- 3.7 V,1000 mAh,1 CELL,PRISMATIC ,U890 HITGP, White Gold SBPP00 SBPP0018001 POLYMER BATT(Extended), Pb-Free Pearl SGDY00 DATA CABLE SGDY0010701...
  • Page 191 Note...
  • Page 192 Note...

This manual is also suitable for:

U890c

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