Page 1 Toshiba Personal Computer TECRA S3 TECRA S4 Maintenance Manual TOSHIBA CORPORATION File Number 960-532 [CONFIDENTIAL]...
Page 2 © 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.
Page 3 NOTE: “Note” contains general information that relates to your safe maintenance service. Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
Page 4 Replacement Procedures describes the removal and replacement of the FRUs. Appendices The appendices describe the following: Handling the LCD module Board layout Pin assignments Keyboard scan/character codes Key layout Wiring diagrams BIOS rewrite procedures EC/KBC rewrite procedures Reliability Maintenance of TOSHIBA RAID TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 5 Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations.
Page 6: Table Of Contents
Table of Contents Chapter 1 Hardware Overview Features ........................1-1 2.5-inch Hard Disk Drive..................1-11 Keyboard........................1-13 Optical Drive......................1-14 TFT Color Display....................1-16 Power Supply ......................1-18 Batteries ........................1-20 AC Adapter ......................1-22 Chapter 2 Troubleshooting Procedures Troubleshooting ......................2-1 Troubleshooting Flowchart..................
Page 7 Chapter 3 Tests and Diagnostics The Diagnostic Test ....................3-1 Executing the Diagnostic Test ................... 3-4 Check of the RAID configuration................3-9 Setting of the hardware configuration ..............3-17 Heatrun Test......................3-20 Subtest Names......................3-21 System Test......................3-23 Memory Test......................3-25 Keyboard Test......................
Page 8 Chapter 4 Replacement Procedures General........................4-1 Battery pack ....................... 4-8 PC card........................4-10 SD card........................4-11 Memory module....................... 4-12 HDD......................... 4-14 Wireless LAN card ....................4-17 Slim select bay module .................... 4-19 Keyboard........................4-22 4.10 Touch pad......................... 4-25 4.11 Bluetooth module..................... 4-27 4.12 Switch membrane.....................
Page 9 Keyboard Scan/Character Codes ..............D-1 Appendix E Key Layout.....................E-1 Appendix F Wiring Diagrams.................... F-1 Appendix G BIOS rewrite Procedures ................G-1 Appendix H EC/KBC rewrite Procedures ................. H-1 Appendix I Reliability......................I-1 Appendix J Maintenance of TOSHIBA RAID ..............J-1 TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 10 TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 11: Hardware Overview
Chapter 1 Hardware Overview [CONFIDENTIAL]...
Page 12 1 Hardware Overview 1-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 13 1 Hardware Overview Chapter 1 Contents Features........................1-1 2.5-inch Hard Disk Drive ..................1-11 Keyboard ........................1-13 Optical Drive ......................1-14 1.4.1 DVD-ROM & CD-R/RW Drive ............1-14 1.4.2 DVD Super Multi (DVD±R/±RW/-RAM) Drive .......1-15 TFT Color Display ....................1-16 1.5.1 LCD Module ..................1-16 1.5.2 FL Inverter Board ................1-17 Power Supply......................1-18 Batteries........................1-20 1.7.1...
Page 14 1 Hardware Overview Figures Figure 1-1 Front of the computer ..................1-5 Figure 1-2 System unit configuration................1-6 Figure 1-3 System unit block diagram ................1-7 Figure 1-4 2.5-inch HDD ....................1-11 Figure 1-5 Keyboard ......................1-13 Figure 1-6 LCD module ....................1-16 Tables Table 1-1 2.5-inch HDD specifications ................1-11 Table 1-2 DVD-ROM &...
Page 15: Features
1 Hardware Overview Features Features The Toshiba TECRA S3 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features and benefits:...
Page 16 1 Hardware Overview 1.1 Features Display The PC comes in with one of the following two types: • 15.0” XGA-TFT color display, resolution 1,024×768, 16M colors • 15.0” SXGA+-TFT color display, resolution 1,400×1,050, 16M colors External monitor Supported via a RGB connector. Slim Select Bay A DVD-ROM &...
Page 17 1.1 Features 1 Hardware Overview Toshiba Assist button When this button is pressed during power-on, the PC is connected to “Toshiba Assist”. When this button is pressed during power-off, the PC is turned on and connected to “Toshiba Assist”. Toshiba Presentation button This button switches the display between internal display, external display, simultaneous display and multi-monitor display.
Page 18 1 Hardware Overview 1.1 Features Fingerprint sensor The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer. [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 19: Figure 1-1 Front Of The Computer
1.1 Features 1 Hardware Overview The front of the computer is shown in figure 1-1. Figure 1-1 Front of the computer TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 20: Figure 1-2 System Unit Configuration
1 Hardware Overview 1.1 Features The system unit configuration is shown in figure 1-2. Figure 1-2 System unit configuration [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 21: Figure 1-3 System Unit Block Diagram
1.1 Features 1 Hardware Overview Figure 1-3 is a block diagram of the system unit. Figure 1-3 System unit block diagram TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 22 1 Hardware Overview 1.1 Features The system unit is composed of the following major components: Processor • Intel Mobile Pentium-M Processor – Processor core speed: 1.73GHz/1.86GHz/2.0AGHz/2.13GHz/2.26GHz – Processor bus speed: 533MHz – Integrated L1 cache memory: 32KB instruction cache and 32KB write-back data cache –...
Page 23 – 208-ball, 16.0×16.0×1.4mm, BGA Package Other main system chips • Clock Generator (ICS950812CG) • Super I/O (SMSC Kona-Life) • EC/KBC (Mitsubishi M306KA) • PSC (TOSHIBA TMP87PM48U) • LCD Sensor (NRS-701-1015T) • Thermal Sensor (ADM1032×2) • AXIS accelerometer (STMicro LIS3L02AQ) Modem Controller Supported by Azallia MDC 1.5 using the Azallia link.
Page 24 1 Hardware Overview 1.1 Features Internal LAN Controller (Marvell maid) Controls LAN and supports Gigabit Ethernet. Gigabit is connected to PCI-Express. Sound Controller Azallia and CODEC (STAC9200) are used. 1-10 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 25: Figure 1-4 2.5-Inch Hdd
1.2 2.5-inch Hard Disk Drive 1 Hardware Overview 2.5-inch Hard Disk Drive The HDD is a random access non-volatile storage device. The computer supports a 40GB, 60GB, 80GB and 100GB HDD. The HDD is shown in figure 1-4. Specifications are listed in Table 1-1. Figure 1-4 2.5-inch HDD Table 1-1 2.5-inch HDD specifications (1/2) Specifications...
Page 26 1 Hardware Overview 1.2 2.5-inch Hard Disk Drive Table 1-1 2.5-inch HDD specifications (2/2) Items Specifications TOSHIBA TOSHIBA TOSHIBA TOSHIBA HDD2D34BZK01 HDD2D33BZK01 HDD2D32BZK01 HDD2D30BZK01 Outline Width (mm) 69.85 dimensions Height (mm) Depth (mm) Weight (g) 98 max. 102 max. Storage size (formatted)
Page 27: Keyboard
1.3 Keyboard 1 Hardware Overview Keyboard The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-5 is a view of the keyboard. See Appendix E about a layout of the keyboard.
Page 28: Optical Drive
1 Hardware Overview 1.4 Optical Drive Optical Drive 1.4.1 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15- inch) CDs, CD-R/RW and DVDs. It is a high-performance drive that writes CD-R at maximum 24-speed and CD-RW at maximum 24-speed (Ultra Speed CD-RW) and reads DVD-ROM at maximum 8-speed and CD-ROM at maximum 24-speed.
Page 29: Dvd Super Multi (Dvd±R/±Rw/-Ram) Drive Specifications
1.4 Optical Drive 1 Hardware Overview 1.4.2 DVD Super Multi (DVD±R/±RW/-RAM) Drive The DVD Super Multi drive is capable of driving either 12cm (4.72-inch) or 8cm (3.15-inch) DVD and CD without using an adaptor. This drive reads DVD-ROM at maximum 8-speed, reads CD-ROM at maximum 24-speed, writes CD-R at maximum 24-speed, writes CD-RW at maximum 10-speed, writes DVD-R at maximum 4-speed, writes DVD-RW at maximum 2- speed, writes DVD+R at maximum 4-speed, writes DVD+R DL at maximum 2.4-speed,...
Page 30: Tft Color Display
1 Hardware Overview 1.5 TFT Color Display TFT Color Display The TFT color display consists of 15.0-inch XGA/SXGA+ LCD module and FL inverter board. 1.5.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 16M colors with 1,024 x 768 or 1,400x 1,050 resolution.
Page 31: Fl Inverter Board Specifications
1.5 TFT Color Display 1 Hardware Overview Table 1-4 LCD module specifications (2/2) Specifications (15.0-inch SXGA+ TFT) Item LG Philips G33C0001X210 Number of Dots 1,400(W) x 1,050 (H) Dot spacing (mm) 0.2175 (H) x 0.2175 (V) Display range (mm) 304.5 (W) x 228.38 (H) 1.5.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL.
Page 32: Power Supply
1 Hardware Overview 1.6 Power Supply Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3.
Page 33: Table
1.6 Power Supply 1 Hardware Overview Table 1-6 Power supply output rating Name Voltage (V) 1.404-0.748 1.05 CPU, MCH, ICH6-M 1.056 1R5-P1V CPU, MCH, ICH6-M, Express Card 1R8-B1V MCH, DDR2-SDRAM VG1R8-P1V 2R5-P2V MCH, ICH6-M MR0R9-B0V MCH, DDR2-SDRAM 0R9-P0V DDR2-SDRAM Clock Generator, Thermal Sensor, SDRAM(SPD), ICH6- M,Super I/O, GPU, Mini-PCI, TPM, LCD, Express Card, FWH, FIR, STAC9200, HDD (SATA), Finger Print Sensor ICH6-M, TI CARD Cont., PC Card Power, Mini-PCI,...
Page 34: Batteries
1 Hardware Overview 1.7 Batteries Batteries The computer has two types of batteries as follows: Main battery pack RTC battery The battery specifications are listed in Table 1-7. Table 1-7 Battery specifications Battery name Material Output voltage Capacity G71C0003W510 8,800 mAh G71C0003W610 Main battery Lithium-Ion...
Page 35: Rtc Battery
1.7 Batteries 1 Hardware Overview RTC battery The RTC battery provides power to keep the current date, time and other setup information in memory while the computer is turned off. Table 1-9 lists the charging time and data preservation period of the RTC battery. Table 1-9 RTC battery charging/data preservation time Status Time...
Page 36: Ac Adapter
1 Hardware Overview 1.8 AC Adapter AC Adapter The AC adapter is used to charge the battery. Table 1-10 lists the AC adapter specifications. Table 1-10 AC adapter specifications Specification Parameter G71C00043310 G71C00049410 (two-pins) (three-pins) Voltage 75W (Peak 90W) Input voltage 100V/240V Input frequency 47Hz to 63Hz...
Page 37: Troubleshooting Procedures
Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]...
Page 38 2 Troubleshooting Procedures 2-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 39 2 Troubleshooting Procedures Chapter 2 Contents Troubleshooting......................2-1 Troubleshooting Flowchart ..................2-2 Power Supply Troubleshooting ..................2-6 Procedure 1 Icons in the LCD Check...............2-6 Procedure 2 Error Code Check ................2-8 Procedure 3 Connection Check ..............2-13 Procedure 4 Charge Check................2-13 Procedure 5 Replacement Check..............2-14 System Board Troubleshooting ................2-15 Procedure 1 Message Check ................2-16...
Page 40 2 Troubleshooting Procedures Display Troubleshooting ..................2-48 Procedure 1 Diagnostic Test Program Execution Check .......2-48 Procedure 2 Connector Check and Cable Check ...........2-48 Procedure 3 Replacement Check..............2-49 Optical Drive Troubleshooting.................2-50 Procedure 1 Diagnostic Test Program Execution Check .......2-50 Procedure 2 Connector Check and Replacement Check........2-50 2.10 Modem Troubleshooting ..................2-51 Procedure 1...
Page 41 2 Troubleshooting Procedures 2.17 Fingerprint sensor.....................2-64 Procedure 1 Setting Windows Log-ON password .........2-65 Procedure 2 Registration of fingerprint............2-65 Procedure 3 Authentication of fingerprint .............2-69 Procedure 4 Connector Check and Replacement Check........2-70 Figures Figure 2-1 Troubleshooting flowchart ..................2-3 Figure 2-2 Printer port LED board ..................2-18 Figure 2-3 Printer port LED board status................2-18 Tables Table 2-1 Battery icon......................2-6...
Page 42 2 Troubleshooting Procedures 2-vi [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 43: Troubleshooting
The following tools are necessary for implementing the Diagnostics procedures: For tools required for executing the Test Program, refer to the Chapter3. For tools required for disassembling/assembling, refer to the Chapter 4. 1. Toshiba MS-DOS system FD 2. LED board 3. Headphone (for Sound troubleshooting) 4.
Page 44: Troubleshooting Flowchart
Make sure that Toshiba Windows XP/ Windows 2000 is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction. Make sure all optional equipment is removed from the computer. Make sure the USB FDD is empty. [CONFIDENTIAL]...
Page 45 2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (1/2) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 46 2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Figure 2-1 Troubleshooting flowchart (2/2) [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 47 2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Running Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error, then perform the appropriate troubleshooting procedures as follows: 1.
Page 48: Power Supply Troubleshooting
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed. The procedures described in this section are: Procedure 1: Icons in the LCD Check Procedure 2: Error Code Check Procedure 3: Connection Check...
Page 49 2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Blinks orange There is a problem with the power supply.*1 Doesn’t light Any condition other than those above.
Page 50: Procedure 2 Error Code Check
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 2 Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1”...
Page 51 2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures DC IN Error code Meaning AC Adaptor output voltage is over 16.5V. Common Dock voltage is over 16.5V. Current from the DC power supply is over 7.00A. Current from the DC power supply is over 0.5A when there is no load. Current sensing IC is not normal.
Page 52 2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting E5V output Error code Meaning E5V voltage is over 6.00V when the computer is powered on/off. E5V voltage is under 4.50V when the computer is powered on. E5V voltage is under 4.50V when the computer is booting up. E5V voltage is over 4.50V when the computer is powered off.
Page 53 2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures PPV output Error code Meaning PPV voltage is over 1.80V when the computer is powered on/off. PPV voltage is under 0.56V when the computer is powered on. PPV voltage is under 0.56V when the computer is booting up. PPV voltage is over 0.56V when the computer is powered off.
Page 54 2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting VG1R8-P1V output Error code Meaning VG1R8-P1V voltage is over 2.16V when the computer is powered on/off. VG1R8-P1V voltage is under 0.89V when the computer is powered on. VG1R8-P1V voltage is under 0.89V when the computer is booting up. VG1R8-P1V voltage is over 0.89V when the computer is powered off.
Page 55: Procedure 3 Connection Check
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connection Check The power supply wiring diagram is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Disconnect the AC power cord from the wall outlet. Check the power cable for breaks.
Page 56: Procedure 5 Replacement Check
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 5 Replacement Check The system board processor module may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. Check the connection between the AC adaptor and system board. After checking the connections, perform the following Check 1: Check 1 Replace the AC adaptor with a new one.
Page 57: System Board Troubleshooting
2.4 System Board Troubleshooting 2 Troubleshooting Procedures System Board Troubleshooting This section describes how to determine if the system board and CPU are defective or not functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. The procedures described in this section are: Procedure 1: Message Check Procedure 2: Printer Port LED Check on Boot Mode...
Page 58: Procedure 1 Message Check
If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If Toshiba MS-DOS or Windows XP is properly loaded, go to Procedure 4. Check 1 If one of the following error messages appears on the screen, press F1 as the message instructs.
Page 59 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Check 3 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (22) or (23) is displayed, go to Procedure 4.
Page 60 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 2 Printer Port LED Check on Boot Mode The printer port LED displays the IRT status and test status by turning lights on and off as an eight-digit binary value for boot mode. Figure 2-2 shows the printer port LED. Figure 2-2 Printer port LED board Figure 2-3 shows the function of the printer port LED board.
Page 61 2.4 System Board Troubleshooting 2 Troubleshooting Procedures To use the printer port LED, follow the steps below: 1. Turn on the computer’s power and set it to boot mode. 2. Turn off the computer’s power. 3. Plug the printer port LED into the parallel port. 4.
Page 62 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED boot mode status (1/9) LED Status Test item Contents Permission of A20 and clear of software reset bit Prohibition of APIC Initialization of MCH, ICH Initialization of Super I/O Initialization of debug port (For models supporting debug port) Dummy read of 3...
Page 63 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Printer port LED boot mode status (2/9) LED Status Test item Contents Saving of key scan code Setting of TASK_1ms_TSC FAN control Sound initialization (for BEEP sound) Cancel of sound mute Setting of volume to max (model that can control volume) When BIOS, EC/KBC rewriting is...
Page 64 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED boot mode status (3/9) LED Status Test item Message Prohibition of cache Permission of L1/L2 cache in FlashROM area Initialization of H/W (before Initialization of MCH DRAM recognition) Initialization of ICH.D30.Func0 Initialization of ICH.D31.Func0 Initialization of ICH.D31.Func1/2...
Page 65 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Printer port LED boot mode status (4/9) LED Status Test item Contents (03h) Expansion memory checksum check resume error (Resume error LED=76H) PnP RAM checksum check (Resume error LED=77H) Transition to RESUME-MAIN Resume error process Reset of CPU clock to low Prohibition of all SMI...
Page 66 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED boot mode status (5/9) LED Status Test item Contents (06h) Battery discharging current control (1CmA). Dividing procedures for time measuring by Setting for clock generator Check of CMOS default setting Default is set, when there are Bad Battery and Bad CheckSum (ROM, CMOS).
Page 67 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Printer port LED boot mode status (6/9) LED Status Test item Contents PCI bus initialization (connection of DS Bus) Initialization of LAN information WakeUp factor check Task generation for waiting INIT_PCI completion CMOS data initialization (2) PnP initialization...
Page 68 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED boot mode status (7/9) LED Status Test item Contents INIT_SYSTEM (Initialization of system) Storing of CMOS error information to IRT_ERR_STS_BUF Controlling CD POWER SW (model supporting CD play) Timer initialization start EC initialization &...
Page 69 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Printer port LED boot mode status (8/9) LED Status Test item Contents (1Eh) (In the case of “Boot”) Check of key input during IRT (waiting for KBC initialization completion) Input of password (waiting for HDD initialization completion) I/O LOCK Processing (For models supporting I/O LOCK) TPM Initialization (model supporting TPM)
Page 70 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED boot mode status (9/9) LED Status Test item Contents (20h) HW initialization before Boot, Waiting for initialization completion Notifies the DVI connection status to VGA BIOS (For models supporting DVI) Setting of battery save mode Setting of date Waiting for Bluetooth initialization completion...
Page 71 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Check 1 If error code 1Eh or 20h is displayed, go to the following Sections: Section 2.6 “2.5” HDD Troubleshooting” Check 2 If the final status of the LED are the followings, perform Procedure 4. Printer port LED error status Error Content...
Page 72 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED suspend mode error status (1/3) LED Status Test item Contents Sets the parallel port to D0 state. (For models supporting PRT port) When powering-off request from OS is required, waiting for the completion of dividing process because waiting in SUSPEND of Runtime returns the process...
Page 73 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Printer port LED suspend mode error status (2/3) LED Status Test item Contents Check if IRT process is being executed Resume error check in suspend mode. Check if external option ROM exists Check if FDD motor is rotating (For models supporting built-in FDD) Execution of driver for suspend...
Page 74 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED suspend mode error status (3/3) LED Status Test item Contents Prohibition of PCI arbiter Setting of Wakeup event Power-off of PC card Re-setting backup current Forced off of fan Checks whether off-process for resume is needed Power LED control during suspending...
Page 75 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Printer port LED resume mode error status (1/4) LED Status Test item Contents Refer to IRT printer LED error status. Refer to IRT printer LED error status. Refer to IRT printer LED error status. Refer to IRT printer LED error status.
Page 76 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Printer port LED resume mode error status (2/4) LED Status Test item Contents (28h) Initializing of sound Initializing of PCI Express Acquires the multi-box status (For models supporting Select bay) Initializing of HC and recognizing of devices Initializing and recognizing of SD card Check of the checksum of conventional Resume error LED=74H...
Page 77 2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Printer port LED resume mode error status (3/4) LED status Test item Contents Initializing printer mode (For models supporting (2Bh) Printer port) Initializing VGA BIOS, when resume Waiting for VGA power on Calling VGA BIOS Processing of password for RESUME Recovery of COM register (For models...
Page 78 2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Printer port LED resume mode error status (4/4) LED status Test item Contents Waiting for the completion of recovery (30h) of VGA register Recovery of PIT register Recovery of PCI configuration register Recovery of PIC MASK Executing of driver for RESUME Waiting for the completion of recovery...
Page 79: Procedure 4 Diagnostic Test Program Execution Check
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform these tests. 1. System test 2.
Page 80: Usb Fdd Troubleshooting
2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting USB FDD Troubleshooting This section describes how to determine if the USB FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: USB FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1...
Page 81: Procedure 2 Diagnostic Test Program Execution Check
2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Floppy disk drive test error codes and their status names are listed in Table 2-7.
Page 82: Procedure 3 Connector Check And Replacement Check
2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting Procedure 3 Connector Check and Replacement Check The USB FDD is connected to the US board or SR board via the USB port. Check 1 Make sure the USB FDD cable is firmly connected to the connector CN4620/CN4621 on the US board or CN4630 on the SR board.
Page 83: Hdd Troubleshooting
Procedure 1 Partition Check Insert the Toshiba MS-DOS system disk and start the computer. Perform the following checks: Check 1 Type C: and press Enter. If you cannot change to drive C, go to Check 2. If you can change to drive C, go to Check 3.
Page 84: Procedure 2 Message Check
“Not used”, choose another setting and return to Check 1. If it is not set to “Not used”, go to Check 4. Check 4 Using the SYS command on the Toshiba MS-DOS system disk, install system files on the HDD. If it is not installed, go to procedure 3. Refer to MS-DOS manual.
Page 85: Procedure 3 Format Check
2.6 HDD Troubleshooting 2 Troubleshooting Procedures Procedure 3 Format Check The computer’s 2.5” HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the 2.5” HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS.
Page 86 2 Troubleshooting Procedures 2.6 HDD Troubleshooting Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
Page 87 2.6 HDD Troubleshooting 2 Troubleshooting Procedures Procedure 5 Connector Check and Replacement Check The HDD may be disconnected, or the HDD or the system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the HDD is firmly connected to CN1850 on the system board.
Page 88: Keyboard/Touch Pad Troubleshooting
2 Troubleshooting Procedures 2.7 Keyboard/Touch pad Troubleshooting Keyboard/Touch pad Troubleshooting To determine if the computer’s keyboard or touch pad is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check...
Page 89 2.7 Keyboard/Touch pad Troubleshooting 2 Troubleshooting Procedures Check 3 Make sure the touch pad cable is securely connected to the touch pad and connector CN3201 on the system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If there is still an error, go to Check 4.
Page 90: Display Troubleshooting
2 Troubleshooting Procedures 2.8 Display Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Cable Check Procedure 3: Replacement Check Procedure 1...
Page 91: Procedure 3 Replacement Check
2.8 Display Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check Units related to display are a FL inverter board, Display module, System board, LCD/FL cable and display ON/OFF sensor. Any of the components may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, then perform the following checks: (1) If the FL does not light, perform Check 1.
Page 92: Optical Drive Troubleshooting
2 Troubleshooting Procedures 2.9 Optical drive Troubleshooting Optical drive Troubleshooting This section describes how to determine if the optical drive in the Slim Select Bay is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1...
Page 93: Modem Troubleshooting
2.10 Modem Troubleshooting 2 Troubleshooting Procedures 2.10 Modem Troubleshooting This section describes how to determine if the computer’s modem is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check...
Page 94: Procedure 2 Connector Check And Replacement Check
2 Troubleshooting Procedures 2.10 Modem Troubleshooting Procedure 2 Connector Check and Replacement Check The Modem is installed as a Modem Daughter Card (MDC). If the modem malfunctions, there may be a bad connection between the MDC and the system board or their connectors might be damaged.
Page 95: Lan Troubleshooting
2.11 LAN Troubleshooting 2 Troubleshooting Procedures 2.11 LAN Troubleshooting This section describes how to determine if the computer’s LAN is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check...
Page 96: Sound Troubleshooting
2 Troubleshooting Procedures 2.12 Sound Troubleshooting 2.12 Sound Troubleshooting This section describes how to determine if the computer’s sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1...
Page 97: Procedure 2 Connector Check
2.12 Sound Troubleshooting 2 Troubleshooting Procedures Procedure 2 Connector Check The sound function-wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: 1.
Page 98 2 Troubleshooting Procedures 2.12 Sound Troubleshooting Procedure 3 Replacement Check Check 1 If the stereo speaker or internal microphone does not sound properly, the stereo speaker or internal microphone may be defective or damaged. Replace it with a new one. If the stereo speaker or internal microphone still does not work properly, go to Check 3.
Page 99: Sd Card Slot Troubleshooting
2.13 SD Card Slot Troubleshooting 2 Troubleshooting Procedures 2.13 SD Card Slot Troubleshooting This section describes how to determine if the computer’s SD card functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
Page 100: Wireless Lan Troubleshooting
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting 2.14 Wireless LAN Troubleshooting This section describes how to determine if the computer’s Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Transmitting-Receiving Check Procedure 2: Antenna Connection Check Procedure 3: Replacement Check...
Page 101 2.14 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antenna Connection Check The wireless LAN wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless LAN card is firmly connected to CN2200 on the system board.
Page 102: Bluetooth Troubleshooting
2 Troubleshooting Procedures 2.15 Bluetooth Troubleshooting 2.15 Bluetooth Troubleshooting To check if the Bluetooth is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antenna Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the “ON”...
Page 103 2.15 Bluetooth Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antenna Connection Check The Bluetooth function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure that the wireless communication switch is “On”.
Page 104 2 Troubleshooting Procedures 2.15 Bluetooth Troubleshooting Procedure 3 Replacement Check Bluetooth module, Bluetooth antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The Bluetooth antenna may be faulty.
Page 105: Pci Expresscard Slot
2.16 PCI ExpressCard slot 2 Troubleshooting Procedures 2.16 PCI ExpressCard slot This section describes how to check PCI ExpressCard slot by inspecting a card with PCI Express interface and a card with USB 2.0 interface. 1. Gigabit Ether ExpressCard 2. USB2.0 5in1 ExpressCard 1.
Page 106: Fingerprint Sensor
2 Troubleshooting Procedures 2.17 Fingerprint sensor 2.17 Fingerprint sensor CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor work correctly or not, follow the troubleshooting procedures below as instructed.
Page 107 4. Click “Create Account” button in the (default) condition that the “Computer administrator” is selected in [Pick an account type]. 5. Select the icon of Account (e.g. “TOSHIBA”) that has been made in item 2 to item 4 in [User Accounts] display.
Page 108 2 Troubleshooting Procedures 2.17 Fingerprint sensor 3. Input the name of Account (e.g. “TOSHIBA”), which has been inputted in item 3 in Procedure 1, in the box at the right of [User Name:] on the [Verify Username and Password]. In addition, input the password, which has been inputted in item 7 in Procedure 1, in the box at the right of name (e.g.
Page 109 2.17 Fingerprint sensor 2 Troubleshooting Procedures 5. After displaying [Capture Fingerprint], scan the fingerprint of your right index finger on the finger sensor. When it successes the number at the center of display of display changes to “2”, then scan again. When it successes the number changes to “3”, again scan (total three times).
Page 110 2 Troubleshooting Procedures 2.17 Fingerprint sensor 8. When [Audio and Taskbar Settings] is displayed, click [Next]. 9. When [Congratulations] is displayed, click [Done]. 10. When [OmniPass-Logon New User?] is displayed, click [Yes]. 2-68 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 111 2.17 Fingerprint sensor 2 Troubleshooting Procedures 11. Close all applications and power off the computer. Procedure 3 Authentication of fingerprint 1. Turn on the computer and start up the Windows. 2. In the Windows Log-ON window, scan the fingerprint of your right index finger. Make sure that scanned fingerprint is displayed on the frame of [Logon Authentication] in red and you can not log on.
Page 112 2 Troubleshooting Procedures 2.17 Fingerprint sensor 4. After starting Windows, Make sure that the name of Account (e.g. “TOSHIBA”), which has been inputted in item 3 in Procedure 1 at the top of [Start]. 5. Open [User Accounts] from [Control Panel]. Select [Delete an Account] in [Change an Account] and delete the account registered for fingerprint authentication.
Page 113: Tests And Diagnostics
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]...
Page 114 3 Tests and Diagnostics 3-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 115 3 Tests and Diagnostics Chapter 3 Contents The Diagnostic Test ....................3-1 3.1.1 Diagnostics menu ................. 3-1 3.1.2 H/W (Hardware) initial information setting tool........3-3 3.1.3 Heatrun test program................3-3 Executing the Diagnostic Test ................... 3-4 3.2.1 Diagnostics menu (T&D) ..............3-5 3.2.2 H/W initial information setting tool .............
Page 116 3 Tests and Diagnostics 3.21 ONLY ONE TEST....................3-49 3.21.1 Program Description ................3-49 3.21.2 Operations ..................3-49 3.22 Head Cleaning......................3-59 3.22.1 Function Description ................3-59 3.22.2 Operations ..................3-59 3.23 Log Utilities ......................3-60 3.23.1 Function Description ................3-60 3.23.2 Operations ..................
Page 117: Table
3 Tests and Diagnostics 3.31 SETUP ........................3-100 3.31.1 Function Description ................ 3-100 3.31.2 Accessing the SETUP Program............3-102 Tables Table 3-1 Subtest names ....................3-21 Table 3-2 Error codes and error status names ..............3-44 Table 3-3 Hard disk controller status register contents............3-47 Table 3-4 Error register contents..................
Page 118 3 Tests and Diagnostics 3-vi [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 119: The Diagnostic Test
3.1 The Diagnostic Test 3 Tests and Diagnostics The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
Page 120 A USB test module (USB test ) A USB cable (USB test) An external monitor (Expansion test) A CD test media TOSHIBA CD-ROM TEST DISK or ABEX TEST CD-ROM (Sound test) A DVD test media (DVD-ROM TEST DISK TSD-1) (Sound test)
Page 121: H/W (Hardware) Initial Information Setting Tool
3.1 The Diagnostic Test 3 Tests and Diagnostics 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration DMI information save DMI information recovery System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs.
Page 122: Executing The Diagnostic Test
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the USB floppy disk drive. 2. Turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit.
Page 123: Diagnostics Menu (T&D)
To execute this program, select 1- Repair Main (T&D) in the startup menu, press Enter. The following menu appears. TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 - DIAGNOSTIC TEST 2 – ONLY ONE TEST...
Page 124 Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTIC TEST MENU : 1 - SYSTEM TEST 2 - MEMORY TEST...
Page 125 3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1-SYSTEM TEST, the following message will appear: SYSTEM TEST NAME XXXXXX xxxxxxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop SUB-TEST...
Page 126: H/W Initial Information Setting Tool
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]] 1: Test end 2: Continue...
Page 127: Check Of The Raid Configuration
Check of the RAID configuration Following screen is displayed for checking the RAID configuration and specifying a failed drive. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity LD0 RAID-1 DEGRADE xxGB...
Page 128 3 Tests and Diagnostics 3.3 Check of the RAID configuration Logical Drive Information: Displays logical drive number, RAID level, RAID status, contents and setting. Physical Drive Information: Displays port number, logical drive number belonged, status and disk information. RAID level: Displays RAID level configured.
Page 129: Check Of The Screen Display
When the “RAID-1” is displayed in the shown below, it is judged that the RAID is configured by two drives. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity LD0 RAID-1...
Page 130: Specification Of The Failed Hdd
3 Tests and Diagnostics 3.3 Check of the RAID configuration TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity LD0 RAID-0 OPTIMAL xxGB Write cache : Enable MBR Protection : Disable S.M.A.R.T...
Page 131 3.3 Check of the RAID configuration 3 Tests and Diagnostics TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity LD0 RAID-1 DEGRADE xxGB Write cache : Enable MBR Protection : Disable S.M.A.R.T...
Page 132 RAID console and installed again. When the drive is unlocked, “ABSENT” is displayed. When the drive is locked, “OFFLINE” is displayed. Repair is not needed in this case. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity LD0 RAID-1...
Page 133 (2) When a new HDD is recognized, It is judged that the HDD removed is failed. Specify the reason by using the Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity...
Page 134 One drive in the “RAID-1”is failed and degraded. This may look like failure by wrong operation. Specify the reason by using Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity...
Page 135: Setting Of The Hardware Configuration
3.4 Setting of the hardware configuration 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config set in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of six subtests.
Page 136 3 Tests and Diagnostics 3.4 Setting of the hardware configuration Setting of the HWSC • Setting of the UUID • Display of the DMI information (including UUID) • After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Subtest 03 DMI information save NOTE: Before replacing the system board, be sure to execute this subtest and save the...
Page 137 3.4 Setting of the hardware configuration 3 Tests and Diagnostics Subtest 08 System configuration display This subtest displays the information of the system configuration. When the following message appears, confirm the contents and press Enter. Press [Enter] key For more details on the system configuration information, refer to “3.26 System configuration”.
Page 138: Heatrun Test
3 Tests and Diagnostics 3.5 Heatrun Test Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. When selecting the option you want to execute, the message shown below will appear and 01-ROM Checksum of the SYSTEM test will be executed. SYSTEM TEST NAME XXXXXX xxxxxxx DIAGNOSTIC TEST VX.XX...
Page 139: Figure 1-5 Keyboard
3.6 Subtest Names 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) Test Name Subtest No. Subtest Name SYSTEM ROM checksum Fan ON/OFF Geyserville Quick charge DMI read...
Page 140: Table
3 Tests and Diagnostics 3.6 Subtest Names Table 3-1 Subtest names (2/2) Test Name Subtest No. Subtest Name HARD DISK Sequential read Address uniqueness Random address/data Cross talk & peak shift Partial Read Write specified address Read specified address Sequential write W-R-C specified address REAL TIMER Real time...
Page 141: System Test
3.7 System Test 3 Tests and Diagnostics System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
Page 142 3 Tests and Diagnostics 3.7 System Test Subtest 03 Geyserville If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. Subtest 04 Quick charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following...
Page 143: Memory Test
3.8 Memory Test 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
Page 144: Keyboard Test
3 Tests and Diagnostics 3.9 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
Page 145: Display Test
3.10 Display Test 3 Tests and Diagnostics 3.10 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
Page 146 3 Tests and Diagnostics 3.10 Display Test Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode 12] [Mode 13] [Mode 3 ] [Mode 111 640*480 64K] [Mode 112 640*480 16M] [Mode 114 800*600 64K]...
Page 147 3.10 Display Test 3 Tests and Diagnostics Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns. HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH To exit this subtest and return to the DISPLAY TEST menu, press Enter. NOTE: The last row may not be completely filled.
Page 148: Floppy Disk Test
3 Tests and Diagnostics 3.11 Floppy Disk Test 3.11 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD because the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
Page 149 3.11 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. xxx DIAGNOSTIC TEST VX.XX FLOPPY DISK IN PROGRESS XXXXXXX [Ctrl]+[Break] : test end [Ctrl]+[C]...
Page 150: Printer Test
3 Tests and Diagnostics 3.12 Printer Test 3.12 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
Page 151 3.12 Printer Test 3 Tests and Diagnostics Subtest 02 Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to...
Page 152: Async Test
3 Tests and Diagnostics 3.13 Async Test 3.13 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
Page 153: Hard Disk Test
3.14 Hard Disk Test 3 Tests and Diagnostics 3.14 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed.
Page 154 3 Tests and Diagnostics 3.14 Hard Disk Test 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press [Enter]. The following message will appear during each subtest. XXX DIAGNOSTIC TEST VX.XX HARD DISK TEST XXXXXXX [Ctrl]+[Break] :...
Page 155 3.14 Hard Disk Test 3 Tests and Diagnostics Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder and then reads the data while moving from cylinder to cylinder. (Tests the data interference in the neighbor track.) Worst pattern data Cylinder...
Page 156: Real Timer Test
3 Tests and Diagnostics 3.15 Real Timer Test 3.15 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
Page 157 3.15 Real Timer Test 3 Tests and Diagnostics Subtest 03 Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments, making sure the date and time are displayed in the following format: Current date : 12-31-1999 Current time : 23:59:58 The real time increments are automatically executed and the following is...
Page 158: Ndp Test
3 Tests and Diagnostics 3.16 NDP Test 3.16 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 This test checks the following functions of NDP: Control word Status word Addition...
Page 159: Expansion Test
3.17 Expansion Test 3 Tests and Diagnostics 3.17 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound [not supported] CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
Page 160 3 Tests and Diagnostics 3.17 Expansion Test Subtest 02 RGB monitor ID NOTE: To execute this subtest, monitor supporting EDID is required. Connect the external monitor supporting EDID to the PC for the test of ID acquisition. This test is executed by VESA command. 3-42 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 161: Cd-Rom/Dvd-Rom Test
To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
Page 162: Error Code And Error Status Names
3 Tests and Diagnostics 3.19 Error Code and Error Status Names 3.19 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test. Table 3-2 Error codes and error status names (1/3) Device name Error code Error status name...
Page 163 3.19 Error Code and Error Status Names 3 Tests and Diagnostics Table 3-2 Error codes and error status names (2/3) Device name Error code Error status name FDD - BAD COMMAND ERROR FDD - ADDRESS MARK NOT FOUND FDD - WRITE PROTECTED FDD - RECORD NOT FOUND FDD - DMA OVERRUN ERROR FDD - DMA BOUNDARY ERROR...
Page 164 3 Tests and Diagnostics 3.19 Error Code and Error Status Names Table 3-2 Error codes and error status names (3/3) Device name Error code Error status name HDD - WRITE FAULT HDD - STATUS ERROR HDD - BAD SECTOR HDD - ACCESS TIME ERROR HDD - NO HDD HDD - DMA CRC ERROR NDP - NO CO-PROCESSOR...
Page 165: Hard Disk Test Detail Status
3.20 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight- digit number.
Page 166 3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status Table 3-4 Error register contents Name Description “0” … Not used (Bad block mark) “1” … A bad block mark is detected. “0” … There is no uncorrectable data error. (Uncorrectable) “1”...
Page 167: Only One Test
3.21 ONLY ONE TEST 3 Tests and Diagnostics 3.21 ONLY ONE TEST 3.21.1 Program Description This program tests the unique functions of this model. 3.21.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display.
Page 168 3 Tests and Diagnostics 3.21 ONLY ONE TEST Subtest 01 Pressed Key Display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed.
Page 169 3.21 ONLY ONE TEST 3 Tests and Diagnostics Subtest 02 Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the <POINTING>...
Page 170 3 Tests and Diagnostics 3.21 ONLY ONE TEST Subtest 03 GP Button This subtest checks moving of the front operation panel button. Press the Toshiba Presentation button after the following message appears. Press [Assist] button Power switch Assist Presentation Press the Toshiba Assist button after the following message appears.
Page 171 3.21 ONLY ONE TEST 3 Tests and Diagnostics Subtest 05 NOTE: When executing this subtest, USB test module and USB cable must be connected. This subtest checks if USB port works properly. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (XXXXXXXXX) #######...
Page 172 3 Tests and Diagnostics 3.21 ONLY ONE TEST Subtest 06 Docker Dock/Undock This subtest is executed with Common Dock 3 installed. Press Enter while pushing the eject button of the Common Dock 3 after the following message appears. Slide Eject-SW, and press [Enter] Key Press Enter without pushing the eject button of the Common Dock 3 after the following message appears.
Page 173 3.21 ONLY ONE TEST 3 Tests and Diagnostics Subtest 07 This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Press any key and following message appears in the display.
Page 174 3 Tests and Diagnostics 3.21 ONLY ONE TEST Subtest 08 PC-Card Device Lock This subtest checks the device lock function. This test needs a PC card, not a PC wraparound card. Before this test, inset a PC card. Turn on the computer and select 8 from the only one test menu. When it passes the test, following message appears.
Page 175 3.21 ONLY ONE TEST 3 Tests and Diagnostics Subtest 0A Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2.
Page 176 3 Tests and Diagnostics 3.21 ONLY ONE TEST When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk.
Page 177: Head Cleaning
3.22 Head Cleaning 3 Tests and Diagnostics 3.22 Head Cleaning 3.22.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.22.2 Operations 1.
Page 178: Log Utilities
3 Tests and Diagnostics 3.23 Log Utilities 3.23 Log Utilities 3.23.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display.
Page 179: Operations
3.23 Log Utilities 3 Tests and Diagnostics 3.23.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, the error information is displayed in the following format: XXXXX ERRORS TS-NO PASS STS ADDR WD RD HSTS [ERROR STATUS NAME] FDD 02 0000 103 00001 00 00 0000 FDD-WRITE PROTECTED...
Page 180: Running Test
3 Tests and Diagnostics 3.24 Running Test 3.24 Running Test 3.24.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5.
Page 181: Floppy Disk Drive Utilities
FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. It is different from the Toshiba MS-DOS FORMAT command. This program can format a floppy disk in the following formats: (a) 2D : Double-sided (b) 2DD: Double-sided, double-density, double-track, 96/135 TPI, MFM mode, 512 bytes, 9 sectors/track.
Page 182: Operations
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message. [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 – HDD-ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
Page 183 3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears. FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below.
Page 184 3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears. DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If is selected, the display will go to step (h).
Page 185 3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5.
Page 186: System Configuration
3 Tests and Diagnostics 3.26 System Configuration 3.26 System Configuration 3.26.1 Function Description NOTE: To display the system configuration, the write protect tab should be OFF position. If the tab is ON position, move the tab to OFF position and restart the test.
Page 187: Operations
3.26 System Configuration 3 Tests and Diagnostics 3.26.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.XX [Machine Name ???] - Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB - Chip set...
Page 188: Wireless Lan Test Program (Intel-Made B/G)
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made b/g) 3.27 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intel- made Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
Page 189 3.27 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Bad connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) •...
Page 190: Setting The Responder Machine
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made b/g) Subtest03 Antenna Check & communication test of 11b mode CAUTION: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine. Access points are also required.
Page 191 3.27 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics Subtest04 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key to return to the test menu.
Page 192: Wireless Lan Test Program (Intel-Made A/G)
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/g) 3.28 Wireless LAN Test Program (Intel-made a/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intel- made Calexico 802.11a/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
Page 193 3.28 Wireless LAN Test Program (Intel-made a/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************ SKU NG !! Other Card or Module not found ************************************************************ Press any key and return to the test menu.
Page 194 3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again.
Page 195 3.28 Wireless LAN Test Program (Intel-made a/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) •...
Page 196 3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/g) Subtest05 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a mode.
Page 197: Lan/Modem/Bluetooth/Ieee1394 Test Program
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear. Microsoft Windows XX Startup Menu ---------------------------------- Modem...
Page 198 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 (i82562 + ICHx) NOTE: i82562 + ICHx test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. The following message will appear. [LAN transmit &...
Page 199 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Subtest02 (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear. Testing adapter...hit <ESC> to abort. External Loopback Test...PASSED Testing completed.
Page 200: Modem Test
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.2 Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Electric Manufacture Co.Ltd)” for the tests. To execute Modem test, press 2 and Enter.
Page 201: Bluetooth Test
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29.3 Bluetooth test To execute this test, input 3 and press Enter. NOTE: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
Page 202: Will Appear
1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- Initializing … When the machine has passed the test, it displays BD_ADDR. If BD_ADDR has no problem, the following message is displayed.
Page 203 3 Tests and Diagnostics If the target machine has any problem, it displays Error message. The following message is displayed. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- My BD_ADDR = XXXXXXXXXXXX [h] FFFFFF FFFFFF...
Page 204 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code Meaning 0x01...
Page 205 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collision. 0x24 LMP PDU Not Allowed.
Page 206 When the test begins, the machine displays BD_ADDR of the DUT. The progress bar appears when the preparation is completed. The following message is displayed. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- +----------------------+ BD_ADDR of the DUT = XXXXXXXXXXXXX [h] +----------------------+ <- Progress Bar...
Page 207 BD_ADDR. If the connection with the tester is completed, the progress bar stops. The following message is shown. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- +----------------------+ BD_ADDR of the DUT = XXXXXXXXXXXXX [h]...
Page 208 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If any problem is detected during the test, the massage FAIL is displayed on the tester machine with the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code...
Page 209 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collision. 0x24 LMP PDU Not Allowed.
Page 210 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-8 Common error code Error code Meaning 0x30 BT Control Status should be “Disable”, but it is “Enable”. 0x31 BT Control Status should be “Enable”, but it is “Disable”. 0x32 Power Status should be “OFF”, but it is “ON”. 0x33 Power Status should be “ON”, but it is “OFF”.
Page 211: Ieee1394 Test
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29.4 IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ********...
Page 212: Sound Test Program
3 Tests and Diagnostics 3.30 Sound Test program Tests and Diagnostics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power. The following message will appear: ############################################################### ######...
Page 213 3.30 Sound Test program 3 Tests and Diagnostics *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 (Microphone recording & play) This subtest checks the function of the CODEC A/D, D/A converter.
Page 214: Sound (Legacy) Test
3 Tests and Diagnostics 3.30 Sound Test program Subtest02 (Sine Wave) This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave.
Page 215: Cd Sound (Standard) Test
To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display.
Page 216 3 Tests and Diagnostics 3.30 Sound Test program Subtest03 Test Tone A CAUTION: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. The test returns to the CD Sound (Standard) menu after the test ends. Subtest 04 Test Tone B This subtest plays sine wave while changing its table from 400Hz to 3KHz...
Page 217: Cd Sound (Legacy) Test
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3.2 Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX xxxxxxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop SUB-TEST : XX PASS COUNT : XXXXX...
Page 218 3 Tests and Diagnostics 3.31 SETUP 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time (a) Date (MM-DD-YYYY) (b) Time (HH:MM:SS) 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM 4.
Page 219 3.31 SETUP 3 Tests and Diagnostics 10. I/O Ports (a) Serial (b) Parallel 11. Drives I/O (a) Built-in HDD (b) Select Bay 12. PCI Bus 13. Security Controller (a) TPM (b) Clear TPM Owner 14. Peripheral (a) Internal Pointing Device (b) Ext keyboard “Fn”...
Page 220 3 Tests and Diagnostics 3.31 SETUP 3.31.2 Accessing the SETUP Program Select 0-SETUP in the Main Menu and press Enter key. The following display appears. 3-102 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 221 3.31 SETUP 3 Tests and Diagnostics TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 3-103...
Page 222 3 Tests and Diagnostics 3.31 SETUP Moving Within the SETUP Menu and Changing Values to move between the two columns. Press ↑ and ↓ to move between 1. Press items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages.
Page 223 3.31 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. (a) Total This field displays the total amount of memory installed and is automatically calculated by the computer.
Page 224 3 Tests and Diagnostics 3.31 SETUP User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Processing Speed This feature changes the CPU processing speed. High CPU operates at high speed. (Default in Full Power Mode) CPU operates at low speed.
Page 225 3.31 SETUP 3 Tests and Diagnostics Cooling Method If the CPU becomes too hot, the fan turns on or the processing speed is lowered automatically. When the CPU temperature falls to a normal range, the fan turns off. Maximum performance If the CPU becomes too hot, the fan turns on automatically in a high speed to cool down the CPU.
Page 226 3 Tests and Diagnostics 3.31 SETUP 5. HDD Password This option registers, resets or changes the HDD password. (a) HDD Hard disk for setting the password. When the second HDD is mounted, “Second HDD” can be selected. Built-in HDD The password is set to Built-in HDD. (This cannot be changed, when the second HDD is not mounted.) Second HDD The password is set to Second HDD.
Page 227 3.31 SETUP 3 Tests and Diagnostics 6. Boot Priority This tab sets the priority for booting the computer and the priority for the built-in HDD or optional secondary HDD. (a) Boot Priority HDD→FDD→CD-ROM→LAN The computer looks for bootable files in the following order: HDD, FDD, CD- ROM and LAN.
Page 228 3 Tests and Diagnostics 3.31 SETUP (b) HDD Priority This option enables to select the priority for the Built-in HDD, optional second HDD or PC card. Built-in HDD → Second HDD→USB The priority is set as Built-in HDD → Second HDD→USB. (Default) Second HDD →...
Page 229 3.31 SETUP 3 Tests and Diagnostics (c) TV Type This option allows you to select the type of TV. NTSC (Japan) TV in Japanese system. NTSC (US) TV in the U.S. system. (Default) TV in Europe and China system. 8. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use.
Page 230 3 Tests and Diagnostics 3.31 SETUP (c) Auto Power On The Auto Power On has two functions. The result of setting in the sub- window (OPTIONS) is indicated as follows. Disabled Indicated when “Alarm time” set to “Disabled and “Wake- up on LAN”...
Page 231 3.31 SETUP 3 Tests and Diagnostics (e) Language During Bootup This option selects the language during bootup. This message appears only on the model for TCL(Canada). English The message is displayed in English. (Default) French The message is displayed in French. 9.
Page 232 3 Tests and Diagnostics 3.31 SETUP 10. I/O ports This option controls settings for serial/parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Serial Use this option to set the COM level for the serial port. Not used Does not assign the serial port.
Page 233 3.31 SETUP 3 Tests and Diagnostics 13. Security controller (a) TPM Disables the security controller called TPM (Trusted Platform Module). When the cursor is on the Enable (Disable) and the Space is pressed, message is displayed and the PC waits Y or N key input by the user. When Y is pressed, it is sets to Enable (Disable).
Page 234 3 Tests and Diagnostics 3.31 SETUP When “Enabled” is selected, the following sub-window appears. KEYBOARD = Left Ctrl + Left Alt Use this option to set a key combination on an external keyboard to emulate the Fn key on the computer’s internal keyboard. Setting a Fn key equivalent will enable you to use “Hotkeys”...
Page 235 3.31 SETUP 3 Tests and Diagnostics (c) USB-FDD Legacy Emulation. This option sets the type of the USB memory as a startup device. Sets the type of the USB memory to be equivalent to the HDD (Default). Disabled Sets the type of the USB memory to be equivalent to the FDD.
Page 236 3 Tests and Diagnostics 3.31 SETUP (c) Execute Creation This option is displayed, only when the setting is changed in the “Create State”. Set the cursor bar to “Execute Creation” and press Space or Back Space. The following message will appear: Warning: If you change RAID array, you need to install OSagain.
Page 237: Replacement Procedures
Chapter 4 Replacement Procedures [CONFIDENTIAL]...
Page 238 4 Replacement Procedures 4-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 239 4 Replacement Procedures Chapter 4 Contents General........................4-1 Battery pack ....................... 4-8 PC card........................4-10 SD card........................4-11 Memory module....................... 4-12 HDD......................... 4-14 Wireless LAN card ....................4-17 Slim select bay module .................... 4-19 Keyboard........................4-22 4.10 Touch pad......................... 4-25 4.11 Bluetooth module.....................
Page 240 4 Replacement Procedures 4.30 Fluorescent Lamp..................... 4-75 4.30.1 Replacing the 15.0-inch XGA LG Philips Fluorescent Lamp ... 4-76 4.30.2 Replacing the 15.0-inch XGA Sharp Fluorescent Lamp....4-85 4.30.3 Replacing the 15.0-inch XGA Samsung Fluorescent Lamp .... 4-106 4.30.4 Replacing the 15.0-inch SXGA+ LG Philips Fluorescent Lamp ..4-111 Figures Figure 4-1 Removing the battery pack ................
Page 241 4 Replacement Procedures Figure 4-25 Removing the USB board ................4-39 Figure 4-26 Removing the internal microphone.............. 4-41 Figure 4-27 Removing the SR board/DC-IN jack ............4-43 Figure 4-28 Connecting the SR/USB cable ..............4-44 Figure 4-29 Removing the fan..................4-45 Figure 4-30 Removing the CPU heat sink...............
Page 242 4 Replacement Procedures Figure 4-57 to 4-64 Replacing LG.Philips fluorescent lamp (XGA) (1) to (8) ..4-77 to 4-84 Figure 4-65 to 4-87 Replacing Sharp fluorescent lamp (XGA) (1) to (23) ..4-85 to 4-105 Figure 4-88 to 4-91 Replacing Samsung fluorescent lamp (XGA) (1) to (4) ....4-106 to 4-109 Figure 4-92 to 4-99 Replacing LG.Philips fluorescent lamp (SXGA+) (1) to (8) ....4-112 to 4-121...
Page 243: General
4.1 General 4 Replacement Procedures Replacement Procedures General This section explains how to disassemble the computer and replace Field Replaceable Units (FRUs). It may not be necessary to remove all the FRUs in order to replace one. The chart below is a guide to which FRUs need to be removed in order to remove others. Always start by removing the battery pack, next, optional items such as the optional PC card and optional SD card, then follow the line on the chart to determine which FRU you must remove next in order to repair the one you think is causing the computer to operate improperly.
Page 244: Safety Precautions
Before you begin disassembly, read the following safety precautions and observe them carefully as you work. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode.
Page 245 4.1 General 4 Replacement Procedures Before You Begin Look over the procedures in this section before you begin disassembling the computer. Familiarize yourself with the disassembly and reassembly steps. Begin each procedure by removing the AC adapter and the battery pack as instructed in this section: 1.
Page 246: Disassembly Procedures
4 Replacement Procedures 4.1 General Disassembly Procedures The computer has four basic types of cable connectors: • Pressure Plate connector • Spring connector • Coaxial connector • Normal Pin connector To disconnect a Pressure Plate connector, lift up the tabs on either side of the connector’s plastic pressure plate and slide the cable out of the connector.
Page 247: Assembly Procedures
4.1 General 4 Replacement Procedures Assembly Procedures After you have disassembled the computer and fixed or repaired the problem that was causing the computer to operate abnormally, you will need to reassemble the computer. Install all the removed FRUs following the steps described in the corresponding sections in this chapter.
Page 248: Screw Tightening Torque
CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screw driver for quick and easy operations. • M2 0.167 N·m (1.7 kgf·cm) •...
Page 249 4.1 General 4 Replacement Procedures Marking of Screws on the Computer Body To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Color/Material of screws Symbol Black...
Page 250: Battery Pack
4 Replacement Procedures 4.2 Battery pack Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: When handling battery packs, be careful not to short circuit the terminals. Also do not drop, hit or apply impact; do not scratch, break, twist or bend the battery pack.
Page 251: Installing The Battery Pack
CAUTION: The battery pack is a lithium ion battery, which can explode if not properly replaced, used, handled or disposed of. For environmental reasons, collect the spent battery packs. Use only batteries recommended by Toshiba as replacements. NOTE: Check the battery’s terminals visually. If they are dirty, wipe them clean with a dry cloth.
Page 252: Pc Card
4 Replacement Procedures 4.3 PC card PC card Removing the PC card To remove the PC card, follow the steps below and refer to Figure 4-2. CAUTION: Before you remove a PC card, refer to the card’s documentation and to your operating system documentation for proper procedures and precautions.
Page 253: Sd Card
4.4 SD card 4 Replacement Procedures SD card Removing the SD card To remove the SD card, follow the steps below and refer to Figure 4-3. CAUTION: Before you remove the SD card, refer to the card’s documentation and to your operating system documentation for proper procedures and precautions.
Page 254: Memory Module
4 Replacement Procedures 4.5 Memory module Memory module Removing the Memory module To remove the memory module, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-4. CAUTION: The power must be turned off when you remove/insert the memory module. Removing/inserting a memory module with the power on might damage the module or the computer itself.
Page 255: Installing The Memory Module
4.5 Memory module 4 Replacement Procedures Installing the Memory module To install the memory module, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-4. CAUTION: Do not touch the connectors on the memory module or on the computer. Dust and stains on the connectors may cause memory access problems.
Page 256: Hdd
4 Replacement Procedures 4.6 HDD CAUTION: When handling the HDD, do not press the top surface as shown by the arrow. Hold it by the sides. Removing the HDD To remove the HDD, follow the steps below and refer to Figure 4-5 and 4-6. 1.
Page 257 4.6 HDD 4 Replacement Procedures NOTE: The following steps describe how to disassemble the HDD assembly; however, do not disassemble if the HDD is working properly. 3. Place the HDD assembly on a flat surface, and remove the following screws. •...
Page 258 4 Replacement Procedures 4.6 HDD Installing the HDD To install the HDD, follow the steps below and refer to Figure 4-5 and 4-6. CAUTION: Do not hold the HDD by its top and bottom flat surfaces. It may damage the HDD.
Page 259: Wireless Lan Card
4.7 Wireless LAN card 4 Replacement Procedures Wireless LAN card Removing the Wireless LAN card To remove the wireless LAN card, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-7. CAUTION: Do not try to remove the wireless LAN card with the computer turned on.
Page 260 4 Replacement Procedures 4.7 Wireless LAN card Installing the Wireless LAN card To install the wireless LAN card, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-7. CAUTION: Be sure to switch the computer off before installing the wireless LAN card. Otherwise, the computer or the wireless LAN card may be damaged.
Page 261: Slim Select Bay Module
4.8 Slim select bay module 4 Replacement Procedures Slim select bay module Removing the Slim select bay module To remove the slim select bay module, follow the steps below and refer to Figure 4-8 and 4- 9. The explanation and figure shown below are the optical drive removing/installing. As for other module, the procedure is same.
Page 262 4 Replacement Procedures 4.8 Slim select bay module 3. Remove the following screws, connector cover and connector from the optical drive assembly. • M2×6S ×2 BIND screw 4. Remove the following screw and connector cover from the optical drive assembly. •...
Page 263 4.8 Slim select bay module 4 Replacement Procedures Installing the Slim select bay module To install the slim select bay module, follow the steps below and refer to Figure 4-8 and 4-9. 1. Install the connector cover holder to the optical drive assembly and secure it with the following screws.
Page 264: Keyboard
4 Replacement Procedures 4.9 Keyboard Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to Figure 4-10 to 4-13. 1. Turn the computer face up. 2. Open the display and make it flat. 3. Insert your finger into the latches of the both sides and lift up the speaker cover to remove.
Page 265 4.9 Keyboard 4 Replacement Procedures 5. Lift the upper side of the keyboard while releasing three latches and turn it face down on the palm rest. Keyboard Figure 4-11 Turning over the keyboard 6. Remove the following screw. • M2.5×4B FLAT HEAD screw ×1 7.
Page 266: Installing The Keyboard
4 Replacement Procedures 4.9 Keyboard 8. Disconnect the keyboard cable from the connector CN3200 on the system board and remove the keyboard. Keyboard cable CN3200 Keyboard Figure 4-13 Removing the keyboard Installing the Keyboard To install the keyboard, follow the steps below and refer to Figure 4-10 to 4-13. 1.
Page 267: Touch Pad
4.10 Touch pad 4 Replacement Procedures 4.10 Touch pad Removing the Touch pad To remove the touch pad, follow the steps below and refer to Figure 4-14 and 4-15. 1. Disconnect the touch pad cable from the connector CN3201 on the system board. 2.
Page 268 4 Replacement Procedures 4.10 Touch pad 3. Peel off the glass tape and disconnect the touch pad cable from the connector on the touch pad. 4. Remove the following screws and touch pad. • M2.5×4B ×2 FLAT HEAD screw M2.5×4B FLAT HEAD Glass tape M2.5×4B FLAT HEAD Touch pad cable...
Page 269: Bluetooth Module
4.11 Bluetooth module 4 Replacement Procedures 4.11 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below and refer to Figure 4-16. 1. Disconnect the Bluetooth antenna cable from the connector on the Bluetooth module. 2.
Page 270: Installing The Bluetooth Module
4 Replacement Procedures 4.11 Bluetooth module Installing the Bluetooth module To install the Bluetooth module, follow the steps below and refer to Figure 4-16. 1. Connect the Bluetooth cable to the connector on the Bluetooth module and set the Bluetooth module to the slot in place. 2.
Page 271: Switch Membrane
4.12 Switch membrane 4 Replacement Procedures 4.12 Switch membrane Removing the Switch membrane To remove the switch membrane, follow the steps below and refer to Figure 4-17. 1. Remove the following screw and lift up the upper part of the right side of the switch cover to remove.
Page 272 4 Replacement Procedures 4.12 Switch membrane Installing the Switch membrane To install the switch membrane, follow the steps below and refer to Figure 4-17. 1. Install the switch membrane in place and secure it with the following screw. • M2.5×4B FLAT HEAD screw 2.
Page 273: Display Assembly
4.13 Display assembly 4 Replacement Procedures Replacement Procedures 4.13 Display assembly Removing the Display assembly To remove the display assembly, follow the steps below and refer to Figure 4-18 to 4-20. 1. Peel off the insulator and disconnect the finger print sensor cable from the connector CN9700 on the system board.
Page 274 4 Replacement Procedures 4.13 Display assembly 5. Turn the computer face down and remove the following screws. • M2.5×16B ×8 (“16” in the figure below) FLAT HEAD screw • M2.5×8B ×7 (“8” in the figure below) FLAT HEAD screw • M2.5×4B ×1 (“4”...
Page 275 4.13 Display assembly 4 Replacement Procedures 6. Turn the computer face up and open the display. 7. Lift the display assembly up to remove while releasing the latches. Display assembly Figure 4-20 Removing the display assembly (3) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-33...
Page 276: Installing The Display Assembly
4 Replacement Procedures 4.13 Display assembly Installing the Display assembly To install the display assembly, follow the steps below and refer to Figure 4-18 to 4-20. 1. Place the display assembly to the base assembly while engaging the latches. 2. Secure the display assembly (front) with the following screws. •...
Page 277: Rtc Battery
4.14 RTC battery 4 Replacement Procedures 4.14 RTC battery Removing the RTC battery To remove the RTC battery, follow the steps below and refer to Figure 4-21. 1. Disconnect the RTC battery cable from the connector CN9990 on the system board. 2.
Page 278: Modem Daughter Card (Mdc)
4 Replacement Procedures 4.15 Modem Daughter Card (MDC) 4.15 Modem Daughter Card (MDC) Removing the Modem Daughter Card To remove the modem daughter card, follow the steps below and refer to Figure 4-22 and 4- 1. Remove the following screws securing the modem daughter card. •...
Page 279 4.15 Modem Daughter Card (MDC) 4 Replacement Procedures 4. Turn up the insulator and remove the modem jack from the slot. 5. Peel off the glass tape and turn up the insulator (cable holder). 6. Disconnect the modem cable from the connector CN3011 on the system board. Modem jack Glass tape Insulator...
Page 280 4 Replacement Procedures 4.15 Modem Daughter Card (MDC) Installing the Modem Daughter Card (MDC) To install the modem daughter card, follow the steps below and refer to Figure 4-22 to 4-24. 1. Turn up the insulator (cable holder) and connect the modem cable to the connector CN3011 on the system board.
Page 281: Usb Board
4.16 USB board 4 Replacement Procedures 4.16 USB board Removing the USB board To remove the USB board, follow the steps below and refer to Figure 4-25. 1. Remove the following screw and lift up the USB board to the left above. •...
Page 282 4 Replacement Procedures 4.16 USB board Installing the USB board To install the USB board, follow the steps below and refer to Figure 4-25. 1. Connect the USB cable to the connector CN4610 on the system board. 2. Connect the USB cable to the connector CN4622 on the USB board. 3.
Page 283: Internal Microphone
4.17 Internal microphone 4 Replacement Procedures 4.17 Internal microphone Removing the Internal microphone To remove the internal microphone, follow the steps below and refer to Figure 4-26. 1. Remove the following screws and front panel. • M2.5×6S Tapping screw ×2 2.
Page 284 4 Replacement Procedures 4.17 Internal microphone Installing the Internal microphone To install the internal microphone, follow the steps below and refer to Figure 4-26. 1. Install the internal microphone to the slot of the front panel. (Pass the hole of the microphone rubber through the guide.) 2.
Page 285: Sr Board/Dc-In Jack
4.18 SR board/DC-IN jack 4 Replacement Procedures 4.18 SR board/DC-IN jack Removing the SR board/DC-IN jack To remove the SR board/DC-IN jack, follow the steps below and refer to Figure 4-27. 1. Remove the following screw and take out the SR board from the slot. •...
Page 286 4 Replacement Procedures 4.18 SR board/DC-IN jack Installing the SR board/DC-IN jack To install the SR board/DC-IN jack, follow the steps below and refer to Figure 4-27 and 4- 1. Connect the DC-IN jack cable to the connector CN8800 on the system board (Pass the cable under the guide) and install the DC-IN jack to the slot.
Page 287: Fan
4.19 Fan 4 Replacement Procedures 4.19 Fan Removing the Fan To remove the fan, follow the steps below and refer to Figure 4-29. 1. Peel off the glass tape. 2. Disconnect the fan cable from the connector CN8770 on the system board. 3.
Page 288: Figure
4 Replacement Procedures 4.19 Fan Installing the Fan To install the Fan, follow the steps below and refer to Figure 4-29. 1. Install the fan and secure it with the following screws. • M2.5×4B ×2 FLAT HEAD screw 2. Connect the fan cable to the connector CN8770 on the system board. 3.
Page 289: Cpu
4.20 CPU 4 Replacement Procedures 4.20 CPU Removing the CPU To remove the CPU, follow the steps below and refer to Figure 4-30 and 4-31. 1. Remove the following screws securing the CPU holder, in the reverse order of the number marked on the holder.
Page 290 4 Replacement Procedures 4.20 CPU 3. Unlock the CPU by rotating the cam on the CPU socket 90 degrees to the counterclockwise with a flat-blade screwdriver (in the order shown in the figure below). 4. Remove the CPU. Figure 4-31 Removing the CPU 4-48 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 291 4.20 CPU 4 Replacement Procedures Installing the CPU To install the CPU, follow the steps below and refer to Figure 4-30 to 4-32. 1. Check that the triangle on the cam is in the unlocking position. 2. Install the CPU to the correct position in the CPU socket. 3.
Page 292: Gfx Board
4 Replacement Procedures 4.21 GFX board 4.21 GFX board Removing the GFX board To remove the GFX board, follow the steps below and refer to Figure 4-33 and 4-34. 1. Remove the following screws securing the GPU heat sink, in the reverse order of the number marked on the heat sink.
Page 293 4.21 GFX board 4 Replacement Procedures 2. Remove the following screws and disconnect the GFX board from the connector CN5900 on the system board. • M2×4B ×2 S-FLAT HEAD screw GFX board M2×4B S-FLAT HEAD CN5900 M2×4B S-FLAT HEAD Figure 4-34 Removing the GFX board Installing the GFX board To install the GFX board, follow the steps below and refer to Figure 4-33 and 4-34.
Page 294: System Board
4 Replacement Procedures 4.22 System board 4.22 System board Removing the System board To remove the system board, follow the steps below and refer to Figure 4-35 to 4-39. 1. Remove the following screw and HDD cable holder. • M2.5×6S ×1 Tapping screw 2.
Page 295 4.22 System board 4 Replacement Procedures 3. Remove the following screw and system board. • M2.5×6S ×1 Tapping screw M2.5×6S Tapping System board Figure 4-36 Removing the modem jack 4. Peel off the insulator and disconnect the HDD cable from the connector CN1850 on the back of the system board.
Page 296 4 Replacement Procedures 4.22 System board 5. Remove the following screws and PC card slot from the back of the system board. • M2×8B ×2 S-FLAT HEAD screw • M2×3S ×2 S-FLAT HEAD screw PC card slot M2×8B S-FLAT HEAD M2×3S S-FLAT HEAD Figure 4-38 Removing the PC card slot 6.
Page 297: Installing The System Board
4.22 System board 4 Replacement Procedures Installing the System board To install the system board, follow the steps below and refer to Figure 4-35 to 4-39. 1. Install the north bridge IC heat sink in place (back of the system board) and secure it with the following screws.
Page 298: Fp Board
4 Replacement Procedures 4.23 FP board 4.23 FP board Removing the FP board To remove the FP board, follow the steps below and refer to Figure 4-40. 1. Peel off the glass tape (back of the middle assembly). 2. Remove the following screws and FP board. •...
Page 299 4.23 FP board 4 Replacement Procedures Installing the FP board To install the FP board, follow the steps below and refer to Figure 4-40. 1. Connect the FP cable to the connector CN950 on the FP board. 2. Install the FP board in place and secure it with the following screws. •...
Page 300: Lcd Unit/Fl Inverter
4 Replacement Procedures 4.24 LCD unit/FL inverter Replacement Procedures 4.24 LCD unit/FL inverter Removing the LCD unit/FL inverter To remove the LCD unit/FL inverter, follow the steps below and refer to Figure 4-41 to 4-47. 1. Peel off two mask rubbers and two mask seals and remove the following screws securing the display mask.
Page 301 4.24 LCD unit/FL inverter 4 Replacement Procedures 3. Peel off one insulator from the FL inverter and take out the other one under the LCD unit. 4. Remove the following screw securing the FL inverter. • M2×4B ×1 S-FLAT HEAD screw 5.
Page 302 4 Replacement Procedures 4.24 LCD unit/FL inverter 6. Remove the following screws securing the LCD unit. • M2×4B ×2 S-FLAT HEAD screw LCD unit M2×4B S-FLAT HEAD M2×4B S-FLAT HEAD Figure 4-43 Removing the LCD unit (1) 4-60 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 303 4.24 LCD unit/FL inverter 4 Replacement Procedures 7. Carefully lift up the top of the LCD unit to access the LCD cable. NOTE: When lifting up the top of the LCD unit, hold the corners of the LCD unit. The top edge of the LCD unit is sensitive area.
Page 304 4 Replacement Procedures 4.24 LCD unit/FL inverter 10. Remove the following screws and detach two LCD brackets from the LCD unit. • M2×3S ×8 S-FLAT HEAD screw M2×3S S-FLAT HEAD LCD bracket LCD bracket M2×3S LCD unit S-FLAT HEAD Figure 4-45 Removing the LCD bracket 11.
Page 305 4.24 LCD unit/FL inverter 4 Replacement Procedures 12. Peel off two insulators (front of the middle assembly). 13. Remove the following screw and LCD cable holder A. • M2.5×4S Tapping screw ×1 14. Remove the following screw and LCD cable holder B. •...
Page 306 4 Replacement Procedures 4.24 LCD unit/FL inverter Installing the LCD unit/FL inverter To install the LCD unit/FL inverter, follow the steps below and refer to Figure 4-41 to 4-47. 1. Pass the LCD cable through the hole of the middle frame and set it in place. 2.
Page 307: Cover Latch
4.25 Cover latch 4 Replacement Procedures 4.25 Cover latch Removing the Cover latch To remove the cover latch, follow the steps below and refer to Figure 4-48. 1. Remove the cover cap. 2. Remove the cover latch to the direction in the figure below. Be careful not lose the spring Spring Cover latch...
Page 308: Wireless Lan Antenna/Bluetooth Antenna
4 Replacement Procedures 4.26 Wireless LAN antenna/Bluetooth antenna 4.26 Wireless LAN antenna/Bluetooth antenna Removing the Wireless LAN antenna/Bluetooth antenna To remove the wireless LAN antenna/Bluetooth antenna, follow the steps below and refer to Figure 4-49 and 4-50. 1. Peel off one acetate tape and four insulators from the back of the middle assembly. 2.
Page 309 4.26 Wireless LAN antenna/Bluetooth antenna 4 Replacement Procedures 3. Peel off eight acetate tapes and one insulator. 4. Peel off the wireless LAN antennas and Bluetooth antenna from the top cover and take them out. Wireless LAN antenna Bluetooth antenna Acetate tape Acetate tape Insulator...
Page 310: Hinge
4 Replacement Procedures 4.27 Hinge 4.27 Hinge Removing the Hinge To remove the hinge, follow the steps below and refer to Figure 4-51 to 4-53. 1. Remove the following screws and separate the display cover and middle frame. • M2×4B ×4 BIND screw •...
Page 311 4.27 Hinge 4 Replacement Procedures 2. Remove the following screw and SPG GND VGA fin. • M2×3S ×1 S-FLAT HEAD screw 3. Remove the following screws and take out the right hinge from the hole of the middle frame by moving it to the left. •...
Page 312 4 Replacement Procedures 4.27 Hinge 4. Remove the following screw and take out the left hinge from the hole of the middle frame by moving it to the right. • M2.5×6S ×1 Tapping screw M2.5×6S Tapping Hinge (left) Figure 4-53 Removing the hinge (left) 4-70 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 313 4.27 Hinge 4 Replacement Procedures Installing the Hinge To install the hinge, follow the steps below and refer to Figure 4-51 to 4-53. 1. Install the left hinge and secure it with the following screw. • M2.5×6S ×1 Tapping screw 2.
Page 314: Speaker
4 Replacement Procedures 4.28 Speaker 4.28 Speaker Removing the Speaker To remove the speaker, follow the steps below and refer to Figure 4-54. 1. Peel off four insulators. 2. Remove the left and right speakers from the slots. Speaker Insulator Speaker Figure 4-54 Removing the speaker Installing the Speaker...
Page 315: Battery Slider
4.29 Battery slider 4 Replacement Procedures 4.29 Battery slider Removing the Battery slider To remove the battery slider, follow the steps below and refer to Figure 4-55 and 4-56. 1. Release the latches of the battery slider A and remove the slider cap from the bottom of the computer.
Page 316 4 Replacement Procedures 4.29 Battery slider 3. Release the latches of the battery slider B and remove the slider cap from the bottom of the computer. 4. Take out the battery slider B from the base cover. Spring Battery slider B Slider cap Figure 4-56 Removing the battery slider B Installing the Battery slider...
Page 317: Fluorescent Lamp
4.30 Fluorescent Lamp 4 Replacement Procedure 4.30 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No. Supplier Section 15.0-inch (XGA) G33C00030110...
Page 318: Replacing The 15.0-Inch Xga Lg Philips Fluorescent Lamp
4 Replacement Procedure 4.30 Fluorescent Lamp 4.30.1 Replacing the 15.0-inch XGA LG Philips Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
Page 319 4.30 Fluorescent Lamp 4 Replacement Procedure Figure 4-57 Replacing LG.Philips fluorescent lamp (XGA) (1) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-77...
Page 320 4 Replacement Procedure 4.30 Fluorescent Lamp Disassembly of Top Case 1. Disassembly of Top Case. CAUTION: Pressure or stress should not be given on Source TCP and Gate COF. Figure 4-58 Replacing LG.Philips fluorescent lamp (XGA) (2) 4-78 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 321 4.30 Fluorescent Lamp 4 Replacement Procedure Disassembly of Source PCB 1. Disassembly of Source PCB. CAUTION: Pressure or stress should not be given on PCB and TCP. Figure 4-59 Replacing LG.Philips fluorescent lamp (XGA) (3) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-79...
Page 322 4 Replacement Procedure 4.30 Fluorescent Lamp Disassembly of Board Ass’y, Tape Adhesive, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2.
Page 323 4.30 Fluorescent Lamp 4 Replacement Procedure Assembly of Cover Ass’y Bottom (L), Sheets, Light guide, Tape Adhesive and Board Ass’y. 1. Assembly of Cover Ass’y Bottom and Screw (2 Point). CAUTION: Maximum value of torque with Screw should be below 2.0kgf.cm. 2.
Page 324 4 Replacement Procedure 4.30 Fluorescent Lamp Assembly of Source PCB 1. Assembly of Source PCB. CAUTION: Stress should not be given on TCP. Figure 4-62 Replacing LG.Philips fluorescent lamp (XGA) (6) 4-82 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 325 4.30 Fluorescent Lamp 4 Replacement Procedure Assembly of Top Case 1. Assembly of Top Case. CAUTION: Pressure should not be given on Source TCP and Gate COF. Figure 4-63 Replacing LG.Philips fluorescent lamp (XGA) (7) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-83...
Page 326 4 Replacement Procedure 4.30 Fluorescent Lamp Assembly of outside Tape and Cover shield 1. Assembly of Cover shield (S). CAUTION: Pressure or stress should not be given on Source PCB. Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC. 2.
Page 327: Replacing The 15.0-Inch Xga Sharp Fluorescent Lamp
4.30 Fluorescent Lamp 4 Replacement Procedure 4.30.2 Replacing the 15.0-inch XGA Sharp Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
Page 328 4 Replacement Procedure 4.30 Fluorescent Lamp 2. Remove the four screws (E) on the both sides. Screw loosening torque: 1.2kg.cm Figure 4-66 Replacing Sharp fluorescent lamp (XGA) (2) 4-86 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 329 4.30 Fluorescent Lamp 4 Replacement Procedure 3. Turn the LCD module face up and remove the bezel (F). 3) Release the hook of the bezel. Be careful not to stick the protection cover G on the TCP. 2) Release two latches of the 1) Release two latches of the lump cover.
Page 330 4 Replacement Procedure 4.30 Fluorescent Lamp 4. Turn the LCD module face down and remove the screw (E) fixing the board. Then open the bent portion of the TCP of the board and remove the backlight. Screw loosening torque: 1.2kg.cm Figure 4-68 Replacing Sharp fluorescent lamp (XGA) (4) Do not hold the edge.
Page 331 4.30 Fluorescent Lamp 4 Replacement Procedure 5. Turn the LCD module face up and remove the LCD panel (G) from the backlight unit (H). CAUTION: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit.
Page 332 4 Replacement Procedure 4.30 Fluorescent Lamp 6. Peel off four fixing tapes (P). CAUTION: Keep the removed fixing tapes (P) to reuse. Figure 4-71 Replacing Sharp fluorescent lamp (XGA) (7) 4-90 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 333 4.30 Fluorescent Lamp 4 Replacement Procedure 7. Remove the lens sheet (M), diffusion sheet (N) and light guide plate (O). CAUTION: Be careful not to scratch or soil the removed sheets and light guide to reuse them. Do not remove the reflection sheet under the light guide.
Page 334 4 Replacement Procedure 4.30 Fluorescent Lamp 8. Turn the back light unit (G) face down and remove two screws (I), lump cover (J), metal fitting A (K) and metal fitting B (L). CAUTION: Be careful not to scratch or soil the back light unit. Figure 4-73 Replacing Sharp fluorescent lamp (XGA) (9) 4-92 [CONFIDENTIAL]...
Page 335 4.30 Fluorescent Lamp 4 Replacement Procedure 9. Remove the lamp unit (Q) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. Figure 4-74 Replacing Sharp fluorescent lamp (XGA) (10) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-93...
Page 336 4 Replacement Procedure 4.30 Fluorescent Lamp Assembling the 15.0-inch XGA Sharp fluorescent lamp To assemble the 15.0-inch Sharp XGA fluorescent lamp, follow the steps below and refer to figures 4-75 to 4-87. 1. Install a new lamp unit (Q) on the P-chassis. CAUTION: When install the lamp unit (Q), be careful not to bend or damage the reflection sheet.
Page 337 4.30 Fluorescent Lamp 4 Replacement Procedure Install the lamp unit without floating. Install the reflection sheet as it is placed inside the reflector. Install the lead wire into this groove. Cross-section drawing of Z-Z Figure 4-76 Replacing Sharp fluorescent lamp (XGA) (12) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-95...
Page 338 4 Replacement Procedure 4.30 Fluorescent Lamp 2. Install the metal fitting A (K), metal fitting B (L) and lump cover (J) on the backlight unit and secure the two screws (I). (K), (L), and (J). An order of installing is: Screw tightening torque: 1.0kg•cm Figure 4-77 Replacing Sharp fluorescent lamp (XGA) (13) 3.
Page 339 4.30 Fluorescent Lamp 4 Replacement Procedure 4. Place the diffusion sheet (N) and lens sheet (M) on the backlight unit with light guide plate. An order of the sheets placing is: (N) and (M). Make sure there is no dust or scratch. Do not make any sheet over the edge of P-chassis.
Page 340 4 Replacement Procedure 4.30 Fluorescent Lamp 5. Stick four fixing tapes (P). Two places Two places Figure 4-80 Replacing Sharp fluorescent lamp (XGA) (16) 4-98 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 341 4.30 Fluorescent Lamp 4 Replacement Procedure 6. Place the LCD panel (H) on the backlight unit (G). CAUTION: Make sure there is no dust between the LCD panel and backlight unit. If any dust is found, remove it with crepe tape or others, which has no remaining of paste.
Page 342 4 Replacement Procedure 4.30 Fluorescent Lamp 7. Bend the TCP attaching to the source board and secure the screw (E). Do not hold the edge. Do not hold the edge. Figure 4-82 Replacing Sharp fluorescent lamp (XGA) (18) 4-100 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 343 4.30 Fluorescent Lamp 4 Replacement Procedure Screw tightening torque: 1.2kg.cm Figure 4-83 Replacing Sharp fluorescent lamp (XGA) (19) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-101...
Page 344 4 Replacement Procedure 4.30 Fluorescent Lamp 8. Install the bezel (F) on the lamp cover and hook four latches on the lamp cover and two latches on the P-chassis. Be careful not to stick (1) Hitch the hook of the bezel the protection cover G on the rib of the P-chassis.
Page 345 4.30 Fluorescent Lamp 4 Replacement Procedure Make sure of mating of the bezel and the rib of the P-chassis. Make sure of mating of the bezel and the latch of the P-chassis. Make sure of mating of the bezel and the latch of the P-chassis. Figure 4-85 Replacing Sharp fluorescent lamp (XGA) (21) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 346 4 Replacement Procedure 4.30 Fluorescent Lamp 9. Secure the four screws (E) on the both sides. Screw tightening torque: 1.2kg.cm Figure 4-86 Replacing Sharp fluorescent lamp (XGA) (22) 4-104 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 347 4.30 Fluorescent Lamp 4 Replacement Procedure 10. Stick the protection cover G (B), protection cover SC (A) and two fixing tapes (C) and (D). Fit the cover according to the outline of the screw. 0 to 1 0 to 1 0 to 1 mm Do not make the tape over the top of the module.
Page 348: Replacing The 15.0-Inch Xga Samsung Fluorescent Lamp
4 Replacement Procedure 4.30 Fluorescent Lamp 4.30.3 Replacing the 15.0-inch XGA Samsung Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
Page 349 4.30 Fluorescent Lamp 4 Replacement Procedure 2. Remove the white tapes, lamp-wire tape and aluminum tape. White tape Lump wire tape AI tape Figure 4-89 Replacing Samsung fluorescent lamp (XGA) (2) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-107...
Page 350 4 Replacement Procedure 4.30 Fluorescent Lamp 3. Separate the Top Chassis from the Mold frame. ⇒ CAUTION: The order : Bottom hook Side hook [Left & Right] Figure 4-90 Replacing Samsung fluorescent lamp (XGA) (3) 4-108 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 351 4.30 Fluorescent Lamp 4 Replacement Procedure 4. Separate the Panel assembly from the BLU CAUTION: Handle with care not to damage the COF of S/D and G/D ICs. Figure 4-91 Replacing Samsung fluorescent lamp (XGA) (4) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-109...
Page 352 4 Replacement Procedure 4.30 Fluorescent Lamp Assembling the 15.0-inch XGA Samsung Fluorescent Lamp To assemble the 15.0-inch XGA Samsung fluorescent lamp, follow the steps below and refer to Figure 4-88 to 4-91. Assembling is the opposite order of the disassembling. 4-110 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 353: Replacing The 15.0-Inch Sxga+ Lg Philips Fluorescent Lamp
4.30 Fluorescent Lamp 4 Replacement Procedure 4.30.4 Replacing the 15.0-inch SXGA+ LG Philips Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
Page 354 4 Replacement Procedure 4.30 Fluorescent Lamp Figure 4-92 Replacing LG Philips fluorescent lamp (SXGA+) (1) 4-112 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 355 4.30 Fluorescent Lamp 4 Replacement Procedure Disassembly of Top Case 1. Disassembly of Top Case. CAUTION: Pressure or stress should not be given on Source COF and Gate COF. Figure 4-93 Replacing LG Philips fluorescent lamp (SXGA+) (2) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-113...
Page 356 4 Replacement Procedure 4.30 Fluorescent Lamp Disassembly of Source PCB 1. Disassembly of Source PCB. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-94 Replacing LG Philips fluorescent lamp (SXGA+) (3) 4-114 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 357 4.30 Fluorescent Lamp 4 Replacement Procedure Disassembly of Board Ass’y, Tape Adhesive, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2.
Page 358 4 Replacement Procedure 4.30 Fluorescent Lamp Figure 4-95 Replacing LG Philips fluorescent lamp (SXGA+) (4) 4-116 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 359 4.30 Fluorescent Lamp 4 Replacement Procedure Assembling the 15.0-inch SXGA+ LG Philips Fluorescent Lamp To assemble the 15.0-inch SXGA+ LG Philips fluorescent lamp, follow the steps below and refer to Figure 4-96 to 4-99. Assembly of Cover Ass’y Bottom (L), Sheets, Light guide, Tape Adhesive and Board Ass’y 1.
Page 360 4 Replacement Procedure 4.30 Fluorescent Lamp Figure 4-96 Replacing LG Philips fluorescent lamp (SXGA+) (5) 4-118 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 361 4.30 Fluorescent Lamp 4 Replacement Procedure Assembly of Source PCB 1. Assembly of Source PCB. CAUTION: Stress should not be given on COF. Figure 4-97 Replacing LG Philips fluorescent lamp (SXGA+) (6) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-119...
Page 362 4 Replacement Procedure 4.30 Fluorescent Lamp Assembly of Top Case 1. Assembly of Top Case. CAUTION: Pressure should not be given on Source COF and Gate COF. Figure 4-98 Replacing LG Philips fluorescent lamp (SXGA+) (7) 4-120 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 363 4.30 Fluorescent Lamp 4 Replacement Procedure Assembly of outside Tape and Cover shield 1. Assembly of Cover shield (S). CAUTION: Pressure or stress should not be given on Source PCB. Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC. 2.
Page 364 4 Replacement Procedure 4.30 Fluorescent Lamp 4-122 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 365 Appendices [CONFIDENTIAL]...
Page 366 Appendices App-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 367 Appendices Appendix Contents Appendix A Handling the LCD Module ................A-1 Appendix B Board Layout ....................B-1 System Board (FDRSY*) Front View ..............B-1 System Board (FDRSY*) Back View ..............B-3 US Board (FDRUS*) Front and Back View ............B-5 SR Board (FDRSR*) Front and Back View............B-6 FS Board (FDRFS*) Front and Back View ............B-7 Appendix C Pin Assignments....................
Page 368 Appendices C.22 CN5620 RGB connector (15-pin) ...............C-23 C.23 CN5501 S-VIDEO connector (4-pin) ..............C-23 C.24 CN5900 GFX board interface connector (230-pin) ..........C-24 C.25 CN6050 Internal microphone connector (2-pin)..........C-28 C.26 J6051 External microphone connector (5-pin)............C-28 C.27 CN6170 Speaker connector (4-pin)..............C-28 C.28 J6310 Headphone connector (5-pin) ..............C-28 C.29 CN8800 DC-IN connector (4-pin) ..............C-28 C.30...
Page 369 RS232C direct-connection cable (9-pin to 25-pin) ..........F-3 Appendix G BIOS rewrite Procedures ................G-1 Appendix H EC/KBC rewrite Procedures............... H-1 Appendix I Reliability ......................I-1 Appendix J Maintenance of TOSHIBA RAID..............J-1 Figures Figure B-1 System board (FDRSY*) layout (front) ............B-1 Figure B-2 System board (FDRSY*) layout (back) ............B-3...
Page 370: Table
Appendices Tables Table B-1 System board (FDRSY*) ICs and connectors (front)........B-2 Table B-2 System board (FDRSY*) ICs and connectors (back)........B-4 Table B-3 US board (FDRUS*) connectors ..............B-5 Table B-4 SR board (FDRSR*) connectors ..............B-6 Table B-5 FS board (FDRFS*) connectors ...............B-7 Table C-1 SO-DIMM0 connector (200-pin)..............C-1 Table C-2...
Page 371 Appendices Table C-25 Internal microphone connector (2-pin) ............C-28 Table C-26 External microphone connector (5-pin)............C-28 Table C-27 Speaker connector (4-pin)................C-28 Table C-28 Headphone connector (5-pin) ..............C-28 Table C-29 DC-IN connector (4-pin) ................C-28 Table C-30 Main Battery connector (10-pin) ..............C-29 Table C-31 RTC Battery connector (3-pin) ..............C-29 Table C-32 FAN connector (3-pin).................C-29...
Page 372 Appendices Table J-5 Item of parameter set ..................J-14 Table J-6 Item of array ....................J-20 Table J-7 Items set in View Drive Info................J-23 Table J-8 Explanation of option and Function of key .............J-24 Table J-9 Content of Drive Log display ................J-26 Table J-10 Content of View Drive Log menu ..............J-27 Table J-11...
Page 373: Appendix A Handling The Lcd Module
Appendix A Handling the LCD Module Appendices Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1.
Page 374 Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent.
Page 375 Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge.
Page 376 Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 377 Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassembly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Page 378 Appendices Appendix A Handling the LCD Module [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 379: Appendix B Board Layout
Appendix B Board Layout Appendices Appendix B Board Layout B.1 System Board (FDRSY*) Front View (AD) (AE) (AA) (AC) (AB) Figure B-1 System board (FDRSY*) layout (front) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 380: Internal Microphone Connector (2-Pin
Appendices Appendix B Board Layout Table B-1 System board (FDRSY*) ICs and connectors (front) Mark Number Name J6310 Headphone connector J6051 External microphone connector CN4200 IEEE1394 connector CN6050 Internal microphone connector CN9990 RTC battery connector CN3010 MDC I/F connector IC1600 ICH6-M CN9700 FS Board I/F connector...
Page 381: System Board (Fdrsy*) Back View
Appendix B Board Layout Appendices B.2 System Board (FDRSY*) Back View Figure B-2 System board (FDRSY*) layout (back) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 382 Appendices Appendix B Board Layout Table B-2 System board (FDRSY*) ICs and connectors (back) Mark Number Name CN2300 Docking I/F connector CN1850 SATA HDD I/F connector CN2200 Wireless LAN card I/F connector IC2000 PC card controller IS2101 SD card connector CN1400 DIMM1 connector CN1410...
Page 383: Us Board (Fdrus*) Front And Back View
Appendix B Board Layout Appendices B.3 US Board (FDRUS*) Front and Back View (front) (back) Figure B-3 US Board (FDRUS*) layout (front/back) Table B-3 US Board (FDRUS*) connectors Mark Number Name CN4622 System board I/F connector CN4620 USB 3connector CN4621 USB 4 connector TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 384: Sr Board (Fdrsr*) Front And Back View
Appendices Appendix B Board Layout B.4 SR Board (FDRSR*) Front and Back View (front) (back) Figure B-4 SR Board (FDRSR*) layout (front/back) Table B-4 SR Board (FDRSR*) connectors Mark Number Name CN9510 System board I/F connector CN3420 Serial port CN4630 USB 6 connector [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 385: Fs Board (Fdrfs*) Front And Back View
Appendix B Board Layout Appendices B.5 FS Board (FDRFS*) Front and Back View (front) (back) Figure B-5 FS Board (FDRFS*) layout (front/back) Table B-5 FS Board (FDRFS*) connectors Mark Number Name CN950 System board I/F connector TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 386 Appendices Appendix B Board Layout [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 387: Appendix C Pin Assignments
Appendix C Pin Assignments Appendices Appendix C Appendix C Pin Assignments System board CN1410 SO-DIMM0 connector (200-pin) Table C-1 SO-DIMM0 connector (200-pin) (1/3) Pin No. Signal Name Pin No. Signal Name MRVREF-B0V ADQ04-B1P ADQ01-B1P ADQ05-B1P ADQ00-B1P ADM0-B1P ADQS0-B1N ADQS0-B1P ADQ02-B1P ADQ07-B1P ADQ03-B1P ADQ06-B1P...
Page 388 Appendices Appendix C Pin Assignments Table C-1 SO-DIMM0 connector (200-pin) (2/3) Pin No. Signal Name Pin No. Signal Name ADQ25-B1P ADQ28-B1P ADM3-B1P ADQS3-B1N ADQS3-B1P ADQ26-B1P ADQ30-B1P ADQ27-B1P ADQ31-B1P MCKE0-B1P MCKE1-B1P 1R8-B1V 1R8-B1V ABS2-B1P 1R8-B1V 1R8-B1V AMA12-B1P AMA11-B1P AMA09-B1P AMA07-B1P AMA08-B1P AMA06-B1P 1R8-B1V 1R8-B1V...
Page 389 Appendix C Pin Assignments Appendices Table C-1 SO-DIMM0 connector (200-pin) (3/3) Pin No. Signal Name Pin No. Signal Name ADQ41-B1P ADQ44-B1P ADQ40-B1P ADQ45-B1P ADQS5-B1N ADM5-B1P ADQS5-B1P ADQ46-B1P ADQ42-B1P ADQ47-B1P ADQ43-B1P ADQ53-B1P ADQ49-B1P ADQ48-B1P ADQ52-B1P MCK1-B1P MCK1-B1N ADQS6-B1N ADQS6-B1P ADM6-B1P ADQ50-B1P ADQ55-B1P ADQ54-B1P ADQ51-B1P...
Page 390: Cn1400 So-Dimm1 Connector (200-Pin
Appendices Appendix C Pin Assignments CN1400 SO-DIMM1 connector (200-pin) Table C-2 SO-DIMM1 connector (200-pin) (1/3) Pin No. Signal Name Pin No. Signal Name MRBREF-B0V BDQ01-B1P BDQ05-B1P BDQ00-B1P BDQ04-B1P BDM0-B1P BDQS0-B1N BDQS0-B1P BDQ02-B1P BDQ06-B1P BDQ07-B1P BDQ03-B1P BDQ12-B1P BDQ13-B1P BDQ08-B1P BDQ09-B1P BDM1-B1P BDQS1-B1N MCK3-B1P BDQS1-B1P...
Page 391 Appendix C Pin Assignments Appendices Table C-2 SO-DIMM1 connector (200-pin) (2/3) Pin No. Signal Name Pin No. Signal Name BDQ30-B1P BDQ25-B1P BDM3-B1P BDQS3-B1N BDQS3-B1P BDQ27-B1P BDQ29-B1P BDQ26-B1P BDQ31-B1P MCKE2-B1P MCKE3-B1P 1R8-B1V 1R8-B1V BBS2-B1P 1R8-B1V 1R8-B1V BMA12-B1P BMA11-B1P BMA09-B1P BMA07-B1P BMA08-B1P BMA06-B1P 1R8-B1V 1R8-B1V...
Page 392 Appendices Appendix C Pin Assignments Table C-2 SO-DIMM1 connector (200-pin) (3/3) Pin No. Signal Name Pin No. Signal Name BDQ41-B1P BDQ45-B1P BDQ40-B1P BDQ44-B1P BDQS5-B1N BDM5-B1P BDQS5-B1P BDQ42-B1P BDQ42-B1P BDQ43-B1P BDQ43-B1P BDQ53-B1P BDQ49-B1P BDQ52-B1P BDQ52-B1P MCK1-B1P MCK1-B1N BDQS6-B1N BDQS6-B1P BDM6 BDQ51-B1P BDQ55-B1P BDQ49-B1P BDQ51-B1P...
Page 393: Cn1850 Sata Interface Connector (11-Pin
Appendix C Pin Assignments Appendices CN1850 SATA interface connector (11-pin) Table C-3 SATA interface connector (11-pin) Pin No. Signal Name Pin No. Signal Name SATAT0-P3P SATAT0-P3N SATAR0-P3N SATAR0-P3P CN1810 Select bay interface connector (72-pin) Table C-4 Select bay interface connector (72-pin) (1/2) Pin No.
Page 394 Appendices Appendix C Pin Assignments Table C-4 Select bay interface connector (72-pin) (2/2) Pin No. Signal Name Pin No. Signal Name PDD00-P3P PDD14-P3P PDD01-P3P PDD13-P3P PDD12-P3P PDD02-P3P PDD11-P3P PDD03-P3P PDD08-P3P PDD04-P3P PDD10-P3P PDD05-P3P PDD09-P3P PDD06-P3P PDD07-P3P IDRSTB-P5N GNDNC SB-P5V [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 395: Cn2100 Pc Card Interface Connector (150-Pin
Appendix C Pin Assignments Appendices CN2100 PC card interface connector (150-pin) Table C-5 PC card interface connector (150-pin) (1/3) Pin No. Signal Name Pin No. Signal Name PETCRD-P3P PETCRD-P3N PERCRD-P3P PERCRD-P3N XPERD-P3P XPECRD-P3N CPPE-E3N CRDCRQ-E3N CRD-P3V CRD-P3V CRD-P3V CRD-P3V CRD-P3V CRDRST-E3N CRD-E3V CRD-E3V...
Page 396 Appendices Appendix C Pin Assignments Table C-5 PC card ard interface connector (150-pin) (2/3) Pin No. Signal Name Pin No. Signal Name USBP6-S3P USBP6-S3N ACCD2-E3N ACCLKR-EYN ACAD31-EYP ACD02-EYP ACAD30-EYP ACAD29-EYP ACAD28-EYP ACAD27-EYP ACSTSC-EYP ACAD26-EYP ACAUDI-EYP ACAD25-EYP ACCBE3-EYN ACAD24-EYP ACREQ-EYN ACAD23-EYP ACSERR-EYN ACAD22-EYP ACRST-EYN...
Page 397: Is2101 Sd Card Interface Connector (12-Pin
Appendix C Pin Assignments Appendices Table C-5 PC card interface connector (150-pin) (3/3) Pin No. Signal Name Pin No. Signal Name ACAD01-EYP ACAD02-EYP ACAD00-EYP ACCD1-E3N IS2101 SD card interface connector (12-pin) Table C-6 SD card interface connector (12-pin) Pin No. Signal Name Pin No.
Page 398: Cn2200 Mini Pci Interface Connector (124-Pin
Appendices Appendix C Pin Assignments CN2200 Mini PCI interface connector (124-pin) Table C-7 Mini PCI interface connector (124-pin) (1/2) Pin No. Signal Name Pin No. Signal Name (WLON-S3N) PIRQF-P3N PIRQG-P3N X33MPC-P3P PCIRST-S3N PREQ2-P3N PGNT2-P3N AD31-P3P PME-E3N AD29-P3P AD30-P3P AD27-P3P AD25-P3P AD28-P3P NCWCHDAT- AD26-P3P...
Page 399 Appendix C Pin Assignments Appendices Table C-7 Mini PCI interface connector (124-pin) (2/2) Pin No. Signal Name Pin No. Signal Name PERR-P3N DEVSEL-P3N CBE1-P3N AD14-P3P AD15-P3P AD13-P3P AD12-P3P AD11-P3P AD10-P3P AD09-P3P AD08-P3P CBE0-P3N AD07-P3P AD06-P3P AD05-P3P AD04-P3P AD02-P3P AD03-P3P AD00-P3P AD01-P3P TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 400: Cn2300 Docking Interface Connector (240-Pin
Appendices Appendix C Pin Assignments CN2300 Docking interface connector (240-pin) Table C-8 Docking interface connector (240-pin) (1/4) Pin No. Signal Name Pin No. Signal Name DSKDC DCOUT DCOUT DOCDT1-S3N IF-P5V EXMSCK-P5P EXKBCK-P5P (PHYRST-E3N) DPCONF-S5P NVASCL-P3P CDKRED-PXP CDKGRN-PXP CDKBLU-PXP DVSYNC-P35P NVBSCL-P35P DVITX2-P3P DVITX2-P3N DVITX1-P3P...
Page 401 Appendix C Pin Assignments Appendices Table C-8 Docking interface connector (240-pin) (2/4) Pin No. Signal Name Pin No. Signal Name NVASDA-P3P DHSYNC-P3P NVBSDA-P3P Not Mount Not Mount BIDCN-EXN Not Mount BIDCP-EXP Not Mount Not Mount Not Mount DCOUT DCOUT DSSCL-S5P IF-P5V (M5V) DTPA-E3P...
Page 402 Appendices Appendix C Pin Assignments Table C-8 Docking interface connector (240-pin) (3/4) Pin No. Signal Name Pin No. Signal Name PDB06-P5P PDB04-P5P PDB01-P5P PDB02-P5P PDB00-P5P STROB-P5N Not Mount LAN-E3V Not Mount Not Mount BIDAP-EXP BIDAN-EXN DCOUT DCOUT DSSDA-S5P IF-P5V DTPA-E3N DTPB-E3N USBP2-E3P USBP2-E3N...
Page 403: Cn3011 Modem Relay Connector (4-Pin
Appendix C Pin Assignments Appendices Table C-8 Docking interface connector (240-pin) (4/4) Pin No. Signal Name Pin No. Signal Name ACT-E3N LINK-E3N DOCDT2-S3N Not mounted Not mounted BIDBP-EXP BIDBN-EXN CN3011 Modem relay connector (4-pin) Table C-9 Modem relay connector (4-pin) Pin No.
Page 404: Cn3200 Keyboard Interface Connector (34-Pin
Appendices Appendix C Pin Assignments C.11 CN3200 Keyboard interface connector (34-pin) Table C-11 Keyboard interface connector (34-pin) Pin No. Signal Name Pin No. Signal Name SPY-PXP SP-GND SPX-PXP SP-P5V KBSC15-S3N KBSC14-S3N KBRT07-S3N KBRT06-S3N KBSC13-S3N KBSC12-S3N KBRT05-S3N KBRT04-S3N KBSC11-S3N KBSC10-S3N KBRT03-S3N KBRT02-S3N KBRT01-S3N KBSC09-S3N...
Page 405: Cn3260 Sw Board Interface Connector (13-Pin
Appendix C Pin Assignments Appendices C.13 CN3260 SW board interface connector (13-pin) Table C-13 SW board interface connector (13-pin) Pin No. Signal Name Pin No. Signal Name GPBTNB-S3W GPBTNA-S3N PWRSW-S3N PNLOFF-S3N C.14 CN3421 SR board interface connector (12-pin) Table C-14 SR board interface connector (12-pin) Pin No.
Page 406: Cn3401 Parallel Port Interface Connector (25-Pin
Appendices Appendix C Pin Assignments C.15 CN3401 Parallel port interface connector (25-pin) Table C-15 Parallel port interface connector (25-pin) Pin No. Signal Name Pin No. Signal Name STROB-P5N PDB00-P5P PDB01-P5P PDB02-P5P PDB03-P5P PDB04-P5P PDB05-P5P PDB06-P5P PDB07-P5P ACK-P5N BUSY-P5P PE-P5P SELCT-P5P AUTFD-P5N ERROR-P5N PINIT-P5N...
Page 407: Cn4400 Bluetooth Interface Connector (20-Pin
Appendix C Pin Assignments Appendices C.18 CN4400 Bluetooth interface connector (20-pin) Table C-18 Bluetooth interface connector (20-pin) Pin No. Signal Name Pin No. Signal Name BTMDL-P3N BTRST-S3N (GND) WCHCLK-P3P USBP4-E3P USBP4-E3N BT-P3V C.19 CN4610 US board I/F connector (10-pin) Table C-19 US board I/F connector (10-pin) Pin No.
Page 408: Cn5500 Lcd Interface Connector (40-Pin
Appendices Appendix C Pin Assignments C.21 CN5500 LCD interface connector (40-pin) Table C-21 LCD interface connector (40-pin) Pin No. Signal Name Pin No. Signal Name BRT2DA-S3P BRT1-P5P BRT0-P5P FL-P5V FL-P5V FL-P5V PNL-P3V PNL-P3V PNL1-P3P PNL0-P3P TXDT4-P3N TXDT4-P3P TXDT5-P3N TXDT5-P3P TXDT6-P3N TXDT6-P3P TXCK1-P3N TXCK1-P3P...
Page 409: Cn5620 Rgb Connector (15-Pin
Appendix C Pin Assignments Appendices C.22 CN5620 RGB connector (15-pin) Table C-22 RGB connector (15-pin) Pin No. Signal Name Pin No. Signal Name SYSRED-PXP SYSGRN-PXP SYSBLU-PXP DDC-P5V CRTSDA-P5P SHSYNC-P5P SVSYNC-P5P CRTSCL-P5P C.23 CN5501 S-VIDEO connector (4-pin) Table C-23 S-VIDEO connector (4-pin) Pin No.
Page 410: Cn5900 Gfx Board Interface Connector (230-Pin
Appendices Appendix C Pin Assignments C.24 CN5900 GFX board interface connector (230-pin) Table C-24 GFX board interface connector (230-pin) (1/4) PIN No. Signal name PIN No. Signal name PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV (L1INE1-PXP) PVT-EFV...
Page 411 Appendix C Pin Assignments Appendices Table C-24 GFX board interface connector (230-pin) (2/4) PIN No. Signal name PIN No. Signal name PEGC14-P1N PECG14-P1N PEGC14-P1P PECG14-P1P PEGC13-P1N PECG13-P1N PEGC13-P1P PECG13-P1P PEGC12-P1N PECG12-P1N PEGC12-P1P PECG12-P1P PEGC11-P1N PECG11-P1N PEGC11-P1P PECG11-P1P PEGC10-P1N PECG10-P1N PEGC10-P1P PECG10-P1P PEGC09-P1N PECG09-P1N...
Page 412 Appendices Appendix C Pin Assignments Table C-24 GFX board interface connector (230-pin) (3/4) PIN No. Signal name PIN No. Signal name PEGC04-P1P PECG04-P1P PEGC03-P1N PECG03-P1N PEGC03-P1P PECG03-P1P PEGC02-P1N PECG02-P1N PEGC02-P1P PECG02-P1P PEGC01-P1N PECG01-P1N PEGC01-P1P PECG01-P1P PEGC00-P1N PECG00-P1N PEGC00-P1P PECG00-P1P XPEPEG-P3N SYSRED-PXP XPEPEG-P3P A-GND...
Page 413 Appendix C Pin Assignments Appendices Table C-24 GFX board interface connector (230-pin) (4/4) PIN No. Signal name PIN No. Signal name DVATX2-P3N TSDA-P3P TSCL-P3P DVITXC-P3P GALERT-P3N DVACK-P3N GTHERM-P3N GPUHOT-S5N NVASCL-P3P NVASDA-P3P (SVSCL) NVBSCL-P3P (SVSDA) NVBSDA-P3P (SVRST) (NVCSCL-P3P) (VDMDD) (NVCSDA-P3P) (SVRXPD) (SVTXPD) LCDVEN-P3P A-GND...
Page 414: Cn6050 Internal Microphone Connector (2-Pin
Appendices Appendix C Pin Assignments C.25 CN6050 Internal microphone connector (2-pin) Table C-25 Internal microphone connector (2-pin) Pin No. Signal Name Pin No. Signal Name MICIN A-GND C.26 J6051 External microphone connector (5-pin) Table C-26 External microphone connector (5-pin) Pin No. Signal Name Pin No.
Page 415: Cn8020 Main Battery Connector (10-Pin
Appendix C Pin Assignments Appendices C.30 CN8020 Main Battery connector (10-pin) Table C-30 Main Battery connector (10-pin) Pin No. Signal Name Pin No. Signal Name PVBL1 BTMP1 (DCHG) PSCL-S5P PSDA-S5P DBT10V-S5N C.31 CN9990 RTC Battery connector (3-pin) Table C-31 RTC Battery connector (3-pin) Pin No.
Page 416: Cn9510 System Board Interface Connector (20-Pin
Appendices Appendix C Pin Assignments FDRSR Board C.34 CN9510 System board interface connector (20-pin) Table C-34 System board interface connector (20-pin) Pin No. Signal Name Pin No. Signal Name USB1PS-E5V USB1PS-E5V USB1PS-E5V USBP6-E3P DCD1:110 RD1:010 SD1:O10 DTR1:110 DSR1:110 RTS1:110 CTS1:110 RT1:110 C.35 CN4630 USB6 connector (4-pin) Table C-35 USB6 connector (4-pin)
Page 417: Cn950 System Board Interface Connector (8-Pin
Appendix C Pin Assignments Appendices FDRFS Board C.37 CN950 System board interface connector (8-pin) Table C-37 System board interface connector (8-pin) Pin No. Signal Name Pin No. Signal Name FGSPON-S3N USBFS-E3N USBFS-E3P TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] C-31...
Page 418: Cn5901 System Board Interface Connector (230-Pin
Appendices Appendix C Pin Assignments FDRVG Board C.38 CN5901 System board interface connector (230-pin) Table C-38 System board interface connector (230-pin)(1/4) PIN No. Signal name PIN No. Signal name PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV 1R5-P1V PVT-EFV (L1INE1-PXP)
Page 419 Appendix C Pin Assignments Appendices Table C-38 System board interface connector (230-pin)(2/4) PIN No. Signal name PIN No. Signal name PEGC14-P1N PECG14-P1N PEGC14-P1P PECG14-P1P PEGC13-P1N PECG13-P1N PEGC13-P1P PECG13-P1P PEGC12-P1N PECG12-P1N PEGC12-P1P PECG12-P1P PEGC11-P1N PECG11-P1N PEGC11-P1P PECG11-P1P PEGC10-P1N PECG10-P1N PEGC10-P1P PECG10-P1P PEGC09-P1N PECG09-P1N PEGC09-P1P...
Page 420 Appendices Appendix C Pin Assignments Table C-38 System board interface connector (230-pin) (3/4) PIN No. Signal name PIN No. Signal name PEGC04-P1P PECG04-P1P PEGC03-P1N PECG03-P1N PEGC03-P1P PECG03-P1P PEGC02-P1N PECG02-P1N PEGC02-P1P PECG02-P1P PEGC01-P1N PECG01-P1N PEGC01-P1P PECG01-P1P PEGC00-P1N PECG00-P1N PEGC00-P1P PECG00-P1P XPEPEG-P3N SYSRED-PXP XPEPEG-P3P A-GND...
Page 421 Appendix C Pin Assignments Appendices Table C-38 System board interface connector (230-pin) (4/4) PIN No. Signal name PIN No. Signal name DVATX2-P3N TSDA-P3P TSCL-P3P DVITXC-P3P GALERT-P3N DVACK-P3N GTHERM-P3N GPUHOT-S5N NVASCL-P3P NVASDA-P3P (SVSCL) NVBSCL-P3P (SVSDA) NVBSDA-P3P (SVRST) (NVCSCL-P3P) (VDMDD) (NVCSDA-P3P) (SVRXPD) (SVTXPD) LCDVEN-P3P A-GND...
Page 422: Cn4622 System Board Interface Connector (12-Pin
Appendices Appendix C Pin Assignments FDRUS Board C.39 CN4622 System board interface connector (12-pin) Table C-39 System board interface connector (12-pin) Pin No. Signal Name Pin No. Signal Name D- (Port 3) D+ (Port 3) USB Power USB Power D- (Port 4) D+ (Port 4) C.40 CN4620 USB Port 3 connector (4-pin) Table C-40 USB Port 3 connector (4-pin)
Page 423 Appendix D Keyboard Scan/Character Codes Appendices Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Code set 1 Code set 2 Keytop Note Make Break Make Break ‘ ~ 7 & BkSp TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 424 Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Code set 1 Code set 2 Keytop Note Make Break Make Break 29(42) Caps Lock ‘ “ Enter Shift (L) No.102 , < . > Shift (R) [CONFIDENTIAL]] TECRA S3 Maintenance Manual (960-532)
Page 425 Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Code set 1 Code set 2 Keytop Note Make Break Make Break Ctrl Alt (L) Space ALT (R) ← Home *1 *9 *1 *9 ↑...
Page 426 Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Code set 1 Code set 2 Keytop Note Make Break Make Break PrintSc Pause *7 *8 — — — — Notes: *1: Scan codes differ by mode. *2: Scan codes differ by overlay function.
Page 427 Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Code set 1 Code set 2 Make Break Make Break E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0 12 E0 AA E0 52 E0 D2 E0 2A E0 F0 12 E0 70 E0 F0 70 E0 12 E0 AA E0 53 E0 D3 E0 2A E0 F0 12 E0 71 E0 F0 71 E0 12 ←...
Page 428: Appendix D Keyboard Scan/Character Codes
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Code set 1 Code set 2 Make Break Make Break E0 2A E0 52 E0 D2 E0 AA E0 12 E0 70 E0 F0 70 E0 F0 12 E0 2A E0 53 E0 D3 E0 AA E0 12 E0 71 E0 F0 71 E0 F0 12 ←...
Page 429 Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Code set 1 Code set 2 Keytop Make Break Make Break (–) Note: The scan code of No. 55 key changes in Shift. Table D-6 No.124 key scan code Code set 1 Code set 2 Shift...
Page 430 Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Shift Code set 1 Code set 2 Make Make Pause Common E1 1D E1 F0 Ctrl* E0 46 7E E0 F0 *: This key generates only make codes. [CONFIDENTIAL]] TECRA S3 Maintenance Manual (960-532)
Page 431: Appendix E Key Layout
Appendix E Key Layout Appendices Appendix E Appendix E Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard United States (US) Keyboard Figure E-2 US keyboard TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 432 Appendices Appendix E Key Layout [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 433: Appendix F Wiring Diagrams
Appendix F Wiring diagrams Appendices Appendix F Appendix F Wiring diagrams LAN Loopback Connector Figure F-1 LAN loopback connector Printer Loopback Connector Figure F-2 Printer loopback connector TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 434: Rs232C Loopback Connector
Appendices Appendix F Wiring diagrams RS232C Loopback Connector Figure F-3 RS232C loopback connector RGB monitor Loopback Connector Figure F-4 RGB monitor loopback connector [CONFIDENTIAL]] TECRA S3 Maintenance Manual (960-532)
Page 435: Rs232C Direct-Connection Cable (9-Pin To 9-Pin
Appendix F Wiring diagrams Appendices RS232C direct-connection cable (9-pin to 9-pin) Figure F-5 RS232C direct-connection cable (9-pin to 9-pin) RS232C direct-connection cable (9-pin to 25-pin) Figure F-6 RS232C direct-connection cable (9-pin to 25-pin) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 436 Appendices Appendix F Wiring diagrams [CONFIDENTIAL]] TECRA S3 Maintenance Manual (960-532)
Page 437 Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS rewrite procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS 1.
Page 438 Appendices Appendix G BIOS rewrite procedures [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 439 Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC rewrite procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: BIOS/EC/KBC rewriting disk for the computer Rewriting the EC/KBC 1.
Page 440 Appendices Appendix H EC/KBC rewrite procedures [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 441: Mtbf
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time Between Failures). Table I-1 MTBF Time (hours) MTBF 5,514 TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]...
Page 442 Appendices Appendix I Reliability [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Page 443 Appendices Appendix J Appendix J Maintenance of TOSHIBA RAID Outline of Maintenance (Repair) of TOSHIBA RAID Follow the below procedures to repair TOSHIBA RAID. Reception Is the RAID configured by two HDD? (*1) Identify the failed HDD (*2) Is it needed to...
Page 444 Appendices Appendix J Maintenance of TOSHIBA RAID Analysis and handling by Drive Log Follow the below procedures to analyze. Boot the independent utility and check the Physical Drive status. Port 1 (1) Which port of HDD failed? Port 0 (3) Does operation...
Page 445 Appendix J Maintenance of TOSHIBA RAID Appendices J.2.1 How to identify the cause of failure (1) When “Fail” or “NODRIVE” is displayed. According to “Operation of Independent utility”, boot the independent utility to display the Drive Log. To identify the failure cause of Port 0, analyze the Drive Log of [REDUNDANT] side of Port 1.
Page 446 Appendices Appendix J Maintenance of TOSHIBA RAID 2. Analyze the detailed data of the message of right before of “xxx Error (IN)”, “xxx Error (OUT)” (for example, “DMA Error (IN)”, “DMA Error (OUT)”) right before the log of “Fail this drive” message and identify the cause.
Page 447 Appendix J Maintenance of TOSHIBA RAID Appendices Command Indicates Command code caused an error. The following list indicates the command. Table J-1 List of Command (1/2) TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]]...
Page 448 Appendices Appendix J Maintenance of TOSHIBA RAID Table J-1 List of Command (2/2) LBA (Logical Block Address): First sector address caused an error. Sector Count: Number of sectors transmitted from the address indicated by LBA. STATUS: Status of command. The lowest bit becomes “1”, when an error occurs.
Page 449 PgDn key. 2. If no message of “Fail this drive” message, it is judged that the second HDD is removed without the operation of removal by TOSHIBA RAID console and installed again. (3) How to change the status to OFF LINE Release the status of “Fail”, using the menu of [Force OFFLINE].
Page 450 TOSHIBA RAID make Drive Log redundant and store it. The drive has own log and other drive’s log. In TOSHIBA RAID, the log of own drive is called “Own Log” and the redundant log of other drive’s drive is called “Redundant Log”. Each port has “Own Log” and “Redundant Log”.
Page 451 Appendix J Maintenance of TOSHIBA RAID Appendices J.3.2 How to operate the Independent Utility (1)Booting PC Connected the USB FDD to the PC to be repaired. Insert the FD storing the program of the Independent Utility in the FDD and boot the PC from the FD. The following display appears.
Page 452 Appendices Appendix J Maintenance of TOSHIBA RAID (2) Display of Logical/Physical Drive Logical Drive The status of RAID array is displayed in Logical Drive by array. The displayed items are follows. Table J-2 Displayed item in Logical Drive Explanation Status Displays the status of array.
Page 453 Appendix J Maintenance of TOSHIBA RAID Appendices Physical Drive In Physical Drive, the condition of RAID array is displayed by array. The following items are displayed. Table J-3 Items displayed in Physical Drive Explanation Port Displays the port number of Serial ATA connected to the drive.
Page 454 Appendices Appendix J Maintenance of TOSHIBA RAID (3) Explanation of Main Menu The Independent Utility has following Main Menu. Table J-4 Item of Main Menu displayed Explanation Create Array Builds RAID array. Start Rebuild Rebuilds RAID-1. While the rebuild is suspended, the message of “Resume Rebuild”...
Page 455 Appendix J Maintenance of TOSHIBA RAID Appendices The tree of Independent Menu is as follows. Figure J-4 Tree of menu of Independent Utility TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL]] J-13...
Page 456 Appendices Appendix J Maintenance of TOSHIBA RAID Create Array This section explains how to select option and build array. The [Create Array] option can be selected only when there is a drive not assigned. To build array, follow the procedure below.
Page 457 Appendix J Maintenance of TOSHIBA RAID Appendices 6. Put the cursor on the “DONE” and press Enter key. Pressing “OK” in [Confirmation] store the change. CAUTION: When the array is initialized, the data of drive is lost. Start Rebuild Selecting of this option starts rebuilding. [Start Rebuild] is displayed only in the RAID- 1 condition of with “OFFLINE”...
Page 458 Appendices Appendix J Maintenance of TOSHIBA RAID 3. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated. When [Effective] is selected, rebuild limit becomes valid and it rebuilds up to the rebuild limit. When [Whole] is selected, it rebuilds maximum capacity of array.
Page 459 Appendix J Maintenance of TOSHIBA RAID Appendices 8. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. Resume Rebuild During being suspended,[Resume Rebuild] is displayed in [Main Menu]. To start rebuilding suspended, follow the procedure below.
Page 460 Appendices Appendix J Maintenance of TOSHIBA RAID 6. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. 7. When “Rebuild Limit” is set and [Rebuild Range] is set to [Whole], only [Finish] is can be selected after exceeding the Rebuild Limit. When [Finish] is selected and “OK”...
Page 461 Appendix J Maintenance of TOSHIBA RAID Appendices Check Media This option can check if there is an error in the HDD of array. The Check Media can be done only in RAID-1. To execute Check Media, follow the procedure below.
Page 462 Appendices Appendix J Maintenance of TOSHIBA RAID Modify Array This option changes the setting of array. Change Parameter Select [Change Parameter] in [Modify Array] menu. The following items can be set. Table J-6 Item of array Option Explanation Write Cache Displays the setting of drive write cache.
Page 463 Appendix J Maintenance of TOSHIBA RAID Appendices Change RAID Level To change RAID level, select [Modify Array] menu. When changing RAID-1 (Mirroring) to RAID-0 (Striping), refer “Changing RAID-1 to RAID-0”. When changing RAID-0 to RAID-1, refer “Changing RAID-0 to RAID-1”.
Page 464 Appendices Appendix J Maintenance of TOSHIBA RAID Delete Array Selects [Delete Array] of Setup Utility and delete array. Put the cursor on the array you want to delete and press Enter key. When [Confirmation] is displayed, select “OK” to store the setting.
Page 465 Appendix J Maintenance of TOSHIBA RAID Appendices Physical Drive Select [Physical Drive] in Setup Utility to set physical drive. View Drive Info. Select this option in [Physical Drive] to display information of physical drive. Select the drive that you want to display in [Physical Drive] at the lower of display and press [Enter] key.
Page 466 Appendices Appendix J Maintenance of TOSHIBA RAID View Drive Log Select this option in [Physical Drive] menu and select the drive that you want to display the log. At the beginning, the latest log is displayed. The 7,168 logs from the latest are recorded in detail.
Page 467 Appendix J Maintenance of TOSHIBA RAID Appendices Execute the following procedures to see the drive log in the Independent Utility. 1. Put on the cursor on [Physical Drive] in [Main Menu] and press Enter key. 2. Put on the cursor on [View Drive Log] and press Enter key.
Page 468 Appendices Appendix J Maintenance of TOSHIBA RAID The following is displayed. Table J-9 Content of Drive Log display Option Explanation Port Displays the port number of log displayed. Own/Redundant Displays if the displayed log is a log of own port (Own) or a copy of other port log (Redundant).
Page 469 Appendix J Maintenance of TOSHIBA RAID Appendices [View Drive Log] menu is as follows Table J-10 Content of View Drive Log menu Option Explanation Change Port Changes the display of the own log and redundant log. At the beginning, the Port-0’s own log and the redundant log are displayed.
Page 470 Appendices Appendix J Maintenance of TOSHIBA RAID Exit When this option is selected, the utility is finished. When [Confirmation] is displayed, select “OK”. J-28 [CONFIDENTIAL]] TECRA S3 Maintenance Manual (960-532)

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Tecra s3

Toshiba TECRA S4 Maintenance Manual

Table of Contents

Table of Contents

Chapter 1 Hardware Overview

Chapter 2 Troubleshooting

Chapter 3 Tests and Diagnostics

Table of Contents

Table of Contents

Chapter 4 Contents

Appendix

Mtbf

Appendix A Handling the LCD Module

Appendix Contents

Appendix B Board Layout

Appendix C Pin Assignments

Appendix D Keyboard Scan/Character Codes

Appendix E Key Layout

Appendix F Wiring Diagrams

Quick Links

Chapters

Troubleshooting

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Summary of Contents for Toshiba TECRA S4