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SK-9
SK-9 is used to print solder paste on MicroPA component (NMP code:
4355641) when the component is reworked.
SK-9 consists of ST-13 (NMP code: 0770848) stencil and RJ-21 (NMP code:
0770849) rework jig.
Due to the large mechanical tolerance of the component, the following
procedure is necessary:
Instructions
1 Put the component into the rework jig. The component should be
placed in the best fit location which is determined by placing the
component in the largest location first, and if this is too large, re-
position it to the next location. This should be carried out until the
best fit location is found.
2 Once the best fit location has been found, leave the component there
and put the stencil on top of the jig and the component.
3 Put soldering paste on the component properly.
4 Remove the stencil and the component from the jig.
5 Start the soldering process.
Spare part for SF-27
Spare part for SF-27
Soldering required
Company Confidential
Copyright ©2005 Nokia. All Rights Reserved.
LGA rework kit for
MicroPA
Test pin module
Spare part module
(LCD-UIB PWB)
Test pins
Spare part module
(KeyPad-UIB PWB)
RM-25
Service tools
0274819
0780357
0780356
0770754
0780355
9235618 (Issue 2)
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